Advantech PPC-3120-RE9A Istruzioni per l'installazione
Product Disassembly Instructions
Product Category:
Panel PC
Product Marketing Name / Model:
PPC-3120-RE9A
Purpose: The document provides the basic instructions for the disassembly of products to remove components and
materials requiring selective treatment, as defined by EU directive 2002/96/EC and 2012/19/EU, Waste Electrical and
Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
Item Description
Notes
Quantity of items
included in product
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA)
With a surface greater than 10 sq. cm Mother
board, Card Reader board, USB Daughter
board, LID Daughter board
7
Batteries
All types including standard alkaline and
lithium coin or button style batteries 6cell
battery or 9 cell battery, and RTC battery
1
External electrical cables and Power
cord
0
Liquid Crystal Displays (LCD) with a
surface greater than 100 sq cm
Includes background illuminated displays with
gas discharge lamps
1
Cathode Ray Tubes (CRT)
0
Gas Discharge Lamps
0
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
0
Item Description
Notes
Quantity of items
included in product
Mercury-containing components
For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
0
Capacitors / condensers (Containing
PCB)
0
Plastics containing Brominated Flame
Retardants weighing > 25 grams
(Not including PCBs or PCAs already listed as a
separate item above)
0
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Asbestos waste and components which
contain asbestos
0
Components containing refractory
ceramic fibers
0
Chlorofluorocarbons (CFC),
hydrochlorofluorocarbons (HCFC) or
hydrofluorocarbons(HFC), hydrocarbons
(HC)
0
Components, parts and materials
containing radioactive substances
0
2.0 Disassembly Tool
List the tools that would typically be used to disassemble the product to a point where components and materials can
be removed.
Disassembly Tool
Picture
Screwdriver
Lever
Star Screwdriver
Hexagon Driver
Slanted pliers
Pliers
Hammer
Knife
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials.
A. Disassembly Box module.
A-1. Disassembly 9 pcs screw to remove the MB cover.
A -2. Disassembly 1 pcs screw to remove the Riser card boor.
A -3. Disassembly 2 pcs Antenna rubber.
A -4. Disassembly 5 pcs screw to remove the VESA bracket.
A -5. Disassembly 4 pcs screw to remove the HDD/SSD tray.
A -6. Disassembly 4 pcs screw to remove the HDD/SSD.
A -7. Disassembly 6 pcs screw to remove the CPU heatsink.
A -8. Disassembly 2 pcs screw to remove the EMI Bracket RAM.
A -9. Disassembly Hex 6pcs from DB9/DB15 port, screw 3pcs from IO bracket to separate the IO bracket.
A -10. Disassembly 1 pcs screw to IO bracket Attachment.
A -11. Disassembly DDR module from DDR socket.
A -12. Disassembly mSATA card (2pcs screw) and Mini PCIe card (2pcs screw) from each socket.
A -13. Remove RTC battery wire cable.
A -14. Disassembly 4 pcs screw to remove the Mother board.
A -15. Disassembly 4 pcs screw to remove the speaker module.
B. Disassembly Panel module.
B -1. Disassembly 3 pcs screw to remove the MB frame.
B-2. Disassembly screw 4pcs to remove the LCD sub-assembly from Front Bezel.
B-3. Disassembly screw 4pcs to separate the LCD bracket left and right with LCD module.
B-4. Separate the LCD sponge from LCD opening bezel.
B-5. Disassembly screw 1pcs to remove the LED indicator board.
B-6. Remove the waterproof from front bezel.
3.2 Exploded view drawing. Insert a graphic illustration below to identify the items contained in the product that
require selective treatment (with descriptions and arrows identifying locations).
Indice
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