Advantech PPC-3120-RE9A Istruzioni per l'installazione

Product Disassembly Instructions

Product Category:

Panel PC

Product Marketing Name / Model:

PPC-3120-RE9A

Purpose: The document provides the basic instructions for the disassembly of products to remove components and

materials requiring selective treatment, as defined by EU directive 2002/96/EC and 2012/19/EU, Waste Electrical and

Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

Item Description

Notes

Quantity of items

included in product

Printed Circuit Boards (PCB) or Printed

Circuit Assemblies (PCA)

With a surface greater than 10 sq. cm Mother

board, Card Reader board, USB Daughter

board, LID Daughter board

Batteries

All types including standard alkaline and

lithium coin or button style batteries 6cell

battery or 9 cell battery, and RTC battery

External electrical cables and Power

cord

Liquid Crystal Displays (LCD) with a

surface greater than 100 sq cm

Includes background illuminated displays with

gas discharge lamps

Cathode Ray Tubes (CRT)

Gas Discharge Lamps

Electrolytic Capacitors / Condensers

measuring greater than 2.5 cm in

diameter or height

Item Description

Notes

Quantity of items

included in product

Mercury-containing components

For example, mercury in lamps, display

backlights, scanner lamps, switches, batteries

Capacitors / condensers (Containing

PCB)

Plastics containing Brominated Flame

Retardants weighing > 25 grams

(Not including PCBs or PCAs already listed as a

separate item above)

Components and parts containing toner

and ink, including liquids, semi-liquids

(gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Asbestos waste and components which

contain asbestos

Components containing refractory

ceramic fibers

Chlorofluorocarbons (CFC),

hydrochlorofluorocarbons (HCFC) or

hydrofluorocarbons(HFC), hydrocarbons

(HC)

Components, parts and materials

containing radioactive substances

2.0 Disassembly Tool

List the tools that would typically be used to disassemble the product to a point where components and materials can

be removed.

Disassembly Tool

Picture

Screwdriver

Lever

Star Screwdriver

Hexagon Driver

Slanted pliers

Pliers

Hammer

Knife

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials.

A. Disassembly Box module.

A-1. Disassembly 9 pcs screw to remove the MB cover.

A -2. Disassembly 1 pcs screw to remove the Riser card boor.

A -3. Disassembly 2 pcs Antenna rubber.

A -4. Disassembly 5 pcs screw to remove the VESA bracket.

A -5. Disassembly 4 pcs screw to remove the HDD/SSD tray.

A -6. Disassembly 4 pcs screw to remove the HDD/SSD.

A -7. Disassembly 6 pcs screw to remove the CPU heatsink.

A -8. Disassembly 2 pcs screw to remove the EMI Bracket RAM.

A -9. Disassembly Hex 6pcs from DB9/DB15 port, screw 3pcs from IO bracket to separate the IO bracket.

A -10. Disassembly 1 pcs screw to IO bracket Attachment.

A -11. Disassembly DDR module from DDR socket.

A -12. Disassembly mSATA card (2pcs screw) and Mini PCIe card (2pcs screw) from each socket.

A -13. Remove RTC battery wire cable.

A -14. Disassembly 4 pcs screw to remove the Mother board.

A -15. Disassembly 4 pcs screw to remove the speaker module.

B. Disassembly Panel module.

B -1. Disassembly 3 pcs screw to remove the MB frame.

B-2. Disassembly screw 4pcs to remove the LCD sub-assembly from Front Bezel.

B-3. Disassembly screw 4pcs to separate the LCD bracket left and right with LCD module.

B-4. Separate the LCD sponge from LCD opening bezel.

B-5. Disassembly screw 1pcs to remove the LED indicator board.

B-6. Remove the waterproof from front bezel.

3.2 Exploded view drawing. Insert a graphic illustration below to identify the items contained in the product that

require selective treatment (with descriptions and arrows identifying locations).

Indice

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