Aiwa CSD-XD55 Manuale utente
CSD-XD55
US Model
Canadian Model
AEP Model
E Model
SERVICE MANUAL
CD RADIO CASSETTE-CORDER
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-877-717-02
2004D02-1
© 2004.04
SPECIFICATIONS
Ver 1.1 2004. 04
– Continued on next page –
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL
HARMONIC DISTORTION
With 3.2-ohm loads, both channels driven
from 150 - 6,300 Hz; rated 3.0 W per
channel-minimum RMS power, with no
more than 10 % total harmonic distortion
in AC operation.
Other specifications
CD player section
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wave length: 780 nm
Emission duration: Continuous
Laser output: Less than 44.6 µW
(This output is the value measured at a distance
of about 200 mm from the objective lens surface
on the optical pick-up block with 7 mm aperture.)
Spindle speed
200 r/min (rpm) to 500 r/min (rpm)
(CLV)
Number of channels
2
Frequency response
20 - 20 000 Hz +1/–2 dB
Wow and flutter
Below measurable limit
Radio section
Frequency range
Antennas
FM: Telescopic antenna
AM: Built-in ferrite bar antenna
Cassette recorder section
Recording system
4-track 2 channel stereo
Fast winding time
Approx. 120 s (sec.) with Sony cassette C-60
Frequency response
TYPE I (normal): 80 - 10 000 Hz
CD
Model Name Using Similar Mechanisma CFD-S250
Section CD Mechanism Type KSM-213RDP
Optical Pick-up Name KSS-213R
TC Model Name Using Similar Mechanism NEW
Section Tape Transport Mechanism Type MF-XD55
US, CND model
FM 87.5 - 108 MHz
AM 530 - 1 710 kHz
E, SP models
FM 87.5 - 108 MHz
AM 530 - 1 710 kHz (10 kHz step)
531 - 1 611 kHz (9 kHz step)
AEP model
FM 87.5 - 108 MHz
MW 530 - 1611 kHz(9kHz step)
530 - 1610 kHz(10kHz step)
LW 153 - 279 kHz
2
CSD-XD55
Ver 1.1
General
Speaker
Full range: 10 cm dia., 3.2 ohms, cone type (4)
Tweeter: 2.0 cm (2)
Outputs
Headphones jack (stereo minijack)
For 16 - 68 ohms impedance headphones
Power output
4.5 W + 4.5 W (at 3.2 ohms, 10% harmonic
distortion (DC))
Power requirements
For CD stereo radio cassette recorder:
US, CND model
120V AC, 60 Hz
Central American model and South American
model:
110 - 127V, 220 - 240V AC selectable,
50/60 Hz
Other models:
230 V AC, 50 Hz
9 V DC, 6 size D (R20) batteries
For remote control
3 V DC, 2 size AA (R6) batteries
Power consumption
US model, Canadian model, Central American
model and Soy∫h American model :
AC 17 W
Other models:
AC 16 W
Battery life
For CD stereo radio cassette recorder:
Dimensions
Approx. 552 x 271 x 318 mm (w/h/d)
(21 3⁄4x 10 5⁄8x12 1⁄2inches) (incl. projecting parts)
Mass
Approx. 5.4 kg (11 lb. 14 oz) (incl. batteries)
Supplied accessory
AC power cord (1)
Remote control (1)
Design and specifications are subject to changewithout notice.
• Abbreviation
CND : Canadian model
SP : Singapore model
FM recording
Sony R20P: approx. 12 h
Sony alkaline LR20: approx. 34 h
Tape playback
Sony R20P: approx. 5.5 Ah
Sony alkaline LR20: approx. 15.5 h
CD playback
Sony R20P: approx. 2.5 h
Sony alkaline LR20: approx. 12 h
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Ver 1.1
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
LEAKAGE
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. Acommercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operatedAC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2VAC range are suitable. (See
Fig. A)
SAFETY CHECK-OUT
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
To Exposed Metal
Parts on Set
0.15 µF1.5 kΩ
AC
Voltmeter
(0.75 V)
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
3
CSD-XD55
Ver 1.1
• UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
TABLE OF CONTENTS
1. SERVICING NOTES ................................................ 4
2. GENERAL ................................................................... 5
3. DISASSEMBLY
3-1. Disassembly Flow ............................................................ 6
3-2. Cabinet (Top) Assy ........................................................... 6
3-3. Cabinet (Front Assy), Cabinet (Bottom) Assy ................. 7
3-4. Wires ................................................................................ 8
3-5. MD Block ......................................................................... 9
3-6. Cassette Holder ................................................................ 9
3-7. Main Board ...................................................................... 10
3-8. Tuner Board ...................................................................... 10
3-9. Power Board ..................................................................... 11
3-10. CD Lid.............................................................................. 11
3-11. CD Block Assy ................................................................. 12
3-12. Optical Pick-up ................................................................ 12
3-13. R/P Head (HRP301), TC Board ....................................... 13
3-14. Main Belt, RF Belt, Motor Assy (M301) ......................... 13
4. MECHANICAL ADJUSTMENTS......................... 14
5. ELECTRICAL ADJUSTMENTS .......................... 14
6. DIAGRAMS
6-1. IC Pin Description ............................................................ 17
6-2. Circuit Boards Location ................................................... 17
6-3. Block Diagram – CD Section – ........................................ 18
6-4. Block Diagram – Main Section – ..................................... 19
6-5. Printed Wiring Board – CD Section – .............................. 20
6-6. Schematic Diagram – CD Section –................................. 21
6-7. Printed Wiring Board
– Tuner Section(US, CND, E, SP model) – ..................... 22
6-8. Printed Wiring Board – Tuner Section (AEP model)– ..... 23
6-9. Schematic Diagram – Tuner Section – ............................. 24
6-10. Printed Wiring Boards – Main Section – ......................... 25
6-11. Schematic Diagram – Main Section (1/2) – ..................... 26
6-12. Schematic Diagram – Main Section (2/2) – ..................... 27
6-13. Printed Wiring Board – TC Section – .............................. 28
6-14. Schematic Diagram – TC Section – ................................. 29
6-15. Printed Wiring Boards – Control Section –...................... 30
6-16. Schematic Diagram – Control Section – .......................... 31
6-17. Printed Wiring Boards – Power Supply Section – ........... 32
6-18. Schematic Diagram – Power Supply Section –................ 33
6-19. IC Block Diagrams ........................................................... 34
7. EXPLODED VIEWS
7-1. Cabinet Section ................................................................ 37
7-2. Cabinet (Front) Section-1................................................. 38
7-3. Cabinet (Front) Section-2................................................. 39
7-4. Cabinet (Top) Section ...................................................... 40
7-5. Cabinet (Bottom) Section................................................. 41
7-6. Tape Mechanism Section ................................................. 42
7-7. CD Mechanism Section-1 ................................................ 43
8. ELECTRICAL PARTS LIST .................................. 44
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINEWITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
4
CSD-XD55
CHUCK PLATE JIG ON REPAIRING
On repairing CD section, playing a disc without the lid (CD), use
Chuck Plate Jig.
• Code number of Chuck Plate Jig: X-4918-255-1
SECTION 1
SERVICING NOTES
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
1. Turn ON the[OPERATE]button and press[CD] button to CD
position.
2. Open the CD lid.
3. Turn on S801 with screwdriver, etc. as following figure.
4. Press the N X (CD) button.
5. Confirmthe laserdiode emission whileobserving theobjecting
lens. When there is no emission, Auto Power Control circuit
or Optical Pick-up is broken.
Objectivelens movesup anddown threetimes forfocus search.
S801
5
CSD-XD55
SECTION 2
GENERAL This section is extracted
from instruction manual.
Remote Control
Location of controls
VOL
BAND
CD/RADIO
CD
123
45
0/10
10
6
789
SLEEPFUNCTION
MODE
POWER
RADIO TUNE
S-BASS
SURROUND
(AC ONLY)
SLEEP
N
X
MODE
BAND
SURROUND
FUNCTION POWER
VOL +*,–
TUNE –,+
S-BASS
x
.,>
ZPUSH
OPEN/CLOSE
Loading a CD
With the labeled side up
Inserting a cassette
With the side you want
to play facing you
Total track number Programmed track Playing order
EF
Total playing time
Display
Number buttons
*The button has a tactile dot.
PAUSE
STOP/EJECT
FF REW PLAY REC
i
TUNE –,+
VOLUME –,+*
SURROUND
S-BASS
SLEEP
u
MODE
LINE IN
(AEP model only)
OPR/BATT
LINE
DISPLAY/ENTER/MEMORY .,>
PRESET –,+
CD, RADIO BAND/
AUTO PRESET,TAPE
x
ZPUSH OPEN/CLOSE
OPERATE
Display
Remote sensor
6
CSD-XD55
• The equipment can be removed using the following procedure.
SECTION 3
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
3-2. CABINET (TOP) ASSY
2
screw
(+BV (B3
)
)
1
two
screws
(+BV (B3
)
)
3
two
screws
(+BV (B3
)
)
1
two
screws
(+BV (B3
)
)
4
6
CNP702
5
connector
(CNJ807)
7
connector
(CNP809)
8
connector
(CNP302)
9
cabinet (top) assy
3-2 CABINET (TOP) ASSY
(Page 6)
3-3. CABINET (FRONT) ASSY,
CABINET (BOTTOM) ASSY
(Page 7)
3-11. CD BLOCK ASSY
(Page 12)
SET
3-4. WIRES
(Page 8)
3-5. MD BLOCK
(Page 9) 3-7. MAIN BOARD
(Page 10)
3-6. CASSETTE HOLDER
(Page 9)
3-10. CD LID
(Page 11)
3-8. TUNER BOARD
(Page 10)
3-13. R/P HEAD (HRP301),
TC BOARD
(Page 13)
3-14. MAIN BELT (B),
SUB BELT (B)
MOTOR ASSY (M301),
(Page 13)
3-9. POWER BOARD
(Page 11)
3-12. OPTICAL PICK-UP
(Page 12)
3-1. DISASSEMBLY FLOW
7
CSD-XD55
3-3. CABINET(FRONT)ASSY, CABINET(BOTTOM)ASSY
1
battery lid
2
three
screws
(+BV (B3
)
)
3
two
screws
(+BV (B3
)
)
4
screw
(+BV (B3
)
)
5
screw
(+BV (B3
)
)
9
CNP805
0
connector
(CNP305)
qa
connector
(CNP810)
6
two
screws
(+BV (B3
)
)
7
three
screws
(+BV (B3
)
)
qs
connector
(CNP806)
qf
CNP801
cabinet (bottom) ass
y
qd
CNP808
8
three
screws
(+BV (B3
)
)
qg
cabinet (front) assy
8
CSD-XD55
cabinet front
cabinet bottom
from MAIN board
A
BCD EF
G
HI
3-4.WIRES
Put flat cable and wires between the cabinets and push them in the
grooves located at A to I in the figure to prevent disconnection before
assembling the set.
9
CSD-XD55
1
cassette holder
2
two
screws
(+BV (B3
)
)
3
two
screws
(+BV (B3
)
)
4
MD block
1
screw
(+BV (B3
)
)
2
damper
3
cassette holder
4
cassette spring
3-5. MD BLOCK
3-6. CASSETTE HOLDER
10
CSD-XD55
1
connector
(CNP811)
2
connector
(CNP304)
3
two
screws
(+BV (B3
)
)
4
screw
(+BV (B3
)
)
5
MAIN board
1
screws
(+P (M3
)
)
2
telescopic antenna
3
screws
(+BV (B3
)
)
4
two claws
5
6
TUNER board
3-7. MAIN BOARD
3-8.TUNER BOARD
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