
Summary 3
3.6 Handlingprecautions ....................................... 32
3.6.1 Temperature and humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.6.2 Warrantylimitations .................................. 32
3.6.3 Mechanicalstress.................................... 32
3.6.4 Heatdissipation ..................................... 32
3.6.5 Monitoring internal temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3.6.6 Automatic internal temperature safety mechanism . . . . . . . . . . . . . . . . 33
3.6.7 EMI/ESD precautions: noise and electrostatic discharge . . . . . . . . . . . . . 34
3.7 CleaningCELERAPcamera.................................... 35
3.7.1 Beforestarting...................................... 35
3.7.2 Cleaning CELERA P camera housing . . . . . . . . . . . . . . . . . . . . . . . . . 35
3.7.3 Opticalpathcleaning .................................. 35
3.7.4 Impurities......................................... 36
3.7.5 Filtercleaning ...................................... 36
3.7.6 Sensorcleaning ..................................... 37
3.7.7 Usingcompressedair.................................. 37
3.7.8 After cleaning procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
4 Interfacing to the world 39
4.0.1 DetectingI/Opower .................................. 40
4.1 I/Ocable............................................... 41
4.2 PowerSelection........................................... 42
4.3 I/Omodule.............................................. 42
4.3.1 Inputmodulestructure................................. 42
4.3.1.1 Debouncingmodule................................ 43
4.3.1.2 Inputevents..................................... 44
4.3.1.3 RS-422........................................ 45
4.3.1.4 RS-644........................................ 46
4.3.1.5 LV-TTL / LV-CMOS / 12 V - 24 V . . . . . . . . . . . . . . . . . . . . . . . . . 46
4.3.2 Output module structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
4.3.2.1 RS-422........................................ 49
4.3.2.2 RS-644........................................ 49
4.3.2.3 LV-TTL/LV-CMOS................................. 50
4.3.2.4 5to24VOutput .................................. 51
4.3.3 Bidirectional module structure (port 0) . . . . . . . . . . . . . . . . . . . . . . . 51
4.3.4 I/Oswitchingtime.................................... 51
4.4 Usinginputsignals ......................................... 52
4.4.1 Encodermodule..................................... 52
4.4.1.1 Encoderhysteresis................................. 53
4.4.1.2 Directionreversal ................................. 53
4.4.1.3 Conguring the encoder module . . . . . . . . . . . . . . . . . . . . . . . . . 54
4.4.1.4 Reading and resetting encoder position . . . . . . . . . . . . . . . . . . . . 54
4.4.2 Frequency Multiplier (Phase Locked Loop (PLL)) . . . . . . . . . . . . . . . . . . 55
4.4.3 Triggermanager..................................... 56
4.5 Controllingoutputports...................................... 57