BenQ mobile M315 Guida all'installazione

12/2005

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TD_Repair_L4 M315/AP75_R1.0.pdf Page 1 of 42

Service Repair Documentation

Level 4 (level 2,5e)

M315 / AP75

Release Date Department Notes to change

R 1.0 12.12.2005 BenQ Mobile (Taipei/KLF) New document

12/2005

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Technical Documentation

TD_Repair_L4 M315/AP75_R1.0.pdf Page 2 of 42

Table of Content

1Introduction ...............................................................................................................................3

1.1 PURPOSE...............................................................................................................................3

1.2 SCOPE ...................................................................................................................................3

1.3 TERMS AND ABBREVIATIONS ...................................................................................................3

2List of available level 4 (level 2,5e) parts ...............................................................................4

3Required Software for Level 4 (level 2,5e) ..............................................................................5

4Radio Part ..................................................................................................................................6

4.1 RECEIVER OPERATION............................................................................................................6

4.2 TRANSMITTER OPERATION......................................................................................................7

4.3 VCXO OPERATION.................................................................................................................8

4.4 BLUETOOTH OPERATION.........................................................................................................9

5Logic ( Base-Band ).................................................................................................................10

5.1 CALYPSO-LITE......................................................................................................................12

5.2 IOTA....................................................................................................................................15

5.3 POWER SUPPLY ...................................................................................................................19

5.3.1 System power on/off Sequence ...................................................................................21

5.4 MEMORY CIRCUIT .................................................................................................................22

5.5 LCD MODULE ( LCDM).........................................................................................................24

6Interfaces .................................................................................................................................27

6.1 AUDIO CIRCUIT .....................................................................................................................27

6.2 MELODY IC...........................................................................................................................29

6.3 AUDIO CIRCUIT .....................................................................................................................31

6.4 10 PINS I/O CONNECTOR......................................................................................................33

6.5 KEYPAD LED CIRCUIT...........................................................................................................35

6.6 VIBRATOR ............................................................................................................................36

6.7 SIM CIRCUIT ........................................................................................................................37

6.8 KEYPAD................................................................................................................................38

6.9 RTC CIRCUIT.......................................................................................................................40

7Charging circuit.......................................................................................................................41

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1 Introduction

1.1 Purpose

This Service Repair Documentation is intended to carry out repairs on BenQ repair level 3-4.

1.2 Scope

This document is the reference document for all BenQ authorised Service Partners which are

released to repair Siemens mobile phones up to level 2.5.

1.3 Terms and Abbreviations

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2 List of available level 4 (level 2,5e) parts

(according to Component Matrix V1.xx - check C-market for updates)

Product ID Order Number Description CM

M315

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Required Equipment for Level 4 (level 2,5e)

 GSM-Tester (CMU200 or 4400S incl. Options)

 PC-incl. Monitor, Keyboard and Mouse

 Adapter cable for Bootadapter (F30032-xx-A1)

 Troubleshooting Frame M315_AP75 (F30032-xx-A1)

 Power Supply

 Spectrum Analyser

 Active RF-Probe incl. Power Supply

 Oscilloscope incl. Probe

 RF-Connector (N<>SMA(f))

 Power Supply Cables

 Dongle (F30032-xx-A1)

 BGA Soldering equipment

Reference: Equipment recommendation V1.6

(downloadable from the technical support page)

3 Required Software for Level 4 (level 2,5e)

 Windows XP

 XCSD Tools Level 2

 GRT Version 3 or higher

 Internet unblocking solution (JPICS)

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4 Radio Part

M315 / AP75 utilizes TI’s chipsets (CALYPSO-Lite and IOTA) as base-band solution. Base-band is

composed with two potions: Logic and Analog/Codec. CALYPSO-Lite is a GSM/GPRS digital base-

band logic solution included microprocessor, DSP, and peripherals. IOTA is a combination of

analog/codec solution and power management which contain base-band codec, voice-band codec,

several voltage regulators and SIM level shifter etc. In addition, 56E22 integrates with other

features such as LED backlight, color LCD display, DSC, vibration, melody tone and charging etc.

The following sections will present the operation theory with circuitry and descriptions respectively.

4.1 Receiver Operation

IRxP

IRxN

GSM LNA

DCS LNA

RX GSM: 925~960 MHz

DCS:

1805~1880 MHz

DCS:3610~3760 MHz

GSM:3700~3840 MHz

Shift(1/2)

ADC/DAC & Control Logic for DC Offset Cancellation

Synth

DCS:

1805~1880 MHz

PCS LNA

RFVCO

PCS:3860~3980 MHz

T/R

Switch

PCS:

1930~1990 MHz

GSM:

1850~1920 MHz

PCS:

1930~1990 MHz

QRxP

QRxN

The Receiver structure in HD155155NP is a zero-IF solution. That means RF signal is directly down-

converted to the baseband signal. And by the way, all of the DC-offset canceling processes

are done within chip. We do not have to care about that.

The LNA amplifies the RF signal after passing the T/R switch and RF SAW filter and before it enters

the down-converter section. The RF signal is mixed with a local oscillator (LO) signal to generate the

baseband signal.

Three LPFs are used in the baseband signal processing for reducing blocking signals. The first LPF

employs two external capacitors, and we can check whether the front-end (LNA + Mixer) is

functionally well or not by probing these two capacitors to see if there is any baseband

signal(<200kHz).

After three stages of DC-offset cancelling, the signal (I+/I-/Q+/Q-) then output to the baseband IC for

further processing.

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4.2 Transmitter Operation

Quad-Band PA

T/R

Switch Charge

Pump PFD

QTxP

QTxN

ITxP

ITxN

80/82 MHz

TX GSM: 880~ 915 MHz

DCS:1710~1785 MHz

Loop Filter

DCS:3580~3730 MHz

GSM:3840~3980 MHz

RFVCO

Synth

IFVCO

I&Q Mod

Shift(1/2)

Synth

DCS/

PCS

GSM DCS:1790~1865 MHz

GSM: 960~995 MHz

640/656 MHz

PCS:3860~3980 MHz

PCS:1930~1990 MHz

PCS:1850~1910 MHz

The transmitter chain converts differential IQ baseband signals to a suitable format for

transmission by a power amplifier.

The common mode voltage range of the modulator inputs is 1.05 V to 1.45 V and they have 2.0 Vpp

differential swing. The modulator circuit uses double-balanced mixers for the I and Q paths. The

Local signals are generated by dividing the IFLO signals by 8 in GSM band and by 4 in DCS band,

and then passed to the modulator through a phase splitter / shifter. The IF signals generated are

then summed to produce a single modulated IF signal which is amplified and fed into the offset PLL

block.

Within the offset PLL block there are a down converter, a phase comparator and a VCO driver. The

down converter mixes the first local signal and the TXVCO signal to create a reference local signal

for use in the offset PLL circuit. The phase comparator and the VCO driver generate an error

current, which is proportional to the phase differential between the reference IF and the modulated

IF signals. This current is

used in a third order loop filter to generate a voltage, which in turn modulates the TXVCO.

The RF signal is then amplified by PA and power control loop to the assigned power level within the

burst ramping mask. After passing the LPF of the T/R switch, the signal is then radiated through the

antenna.

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4.3 VCXO Operation

+R-R

HD155155NP provides a VCXO function. With that function, we can build a reference clock

generation circuits as shown in the above graph. This means that the VCTCXO module is not

necessary for clock application, and only one crystal with 8ppm tolerance and one variocap are

enough.

The transistor in HD155155NP and two internal capacitors (C1, C2) provide a negative

resistance, and the crystal (X1) combined with some other passive components (including

variocap r : D1) to provide a positive resistance. When these two resistance values equal to each

other at some frequency, the oscillation will happen at that frequency. In our design target, the

oscillation frequency should be within 26MHz +/-15 ppm.

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4.4 Bluetooth Operation

2402~2480 MHz

BC3-Handphone

LDO

2.8V

VBAT

SPI Interface

G2-lite

IRDA

UART

MCSI

B5E-VCXO

26MHz

INTERRUPT

CLK_SEL OR

Gate TCXOEN

The Bluetooth main chip – BC3-Handphone deals with BT RF signal from chip antenna and

baseband signal from G2-lite including down/up-converting, de/- modulation and de/- coding … The

BC3-Handphone could accept clock frequency from 8MHz to 40MHz. In our application, we feed the

chip with 26MHz clock from RF chip, HD155155N, and share with G2-lite by an OR-Gate. So GSM

part and BT part could go to sleep respectively. BC3-Handphone could wake G2-lite up by a

interrupt. The BC3-Handphone is controlled by AT commands that come from G2-lite via IRDA

UART. The Data between BC3-Handphone and G2-lite are transmitted and received via MCSI

interface. The SPI interface is reserved for firmware downloading for BT chip of Flash-type. The

power BT chip needed outside is 2.8V the same with voltage level of I/O interface of G2-lite.

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5 Logic ( Base-Band )

Introduction:

56E22 utilizes TI’s chipsets (CALYPSO-Lite and IOTA) as base-band solution. Base-band is

composed with two potions: Logic and Analog/Codec. CALYPSO-Lite is a GSM/GPRS digital

base-band logic solution included microprocessor, DSP, and peripherals. IOTA is a combination

of analog/codec solution and power management which contain base-band codec, voice-band

codec, several voltage regulators and SIM level shifter etc. In addition, 56E30 integrates with

other features such as LED backlight, color LCD display , DSC, vibration, melody tone and

charging etc. The following sections will present the operation theory with circuitry and

descriptions respectively.

Block Diagram CPU CALYPSO (HERCROM40 )

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