BroadLink BL3383-P Manuale utente

World’s leading smart home solution provider

Features

100MHz 32bits MCU

256KB SRAM/2MB FLASH

Support AES, MD5, SHA1

Support XIP

Working voltage: DC 3.3V

Support BLE4.2

Wi-Fi related features

Support 802.11 b/g/n standard

Support station and soft AP

Support SmartConfig and AP

configuration

Support WEP/WPA2

Support multiple cloud services

Integrated balun/PA/LNA

TCP/IP stack optimized for IoT

application

PCB antenna

Peripherals:



3x UART

1x SPI

8x PWM

Up to 13GPIOs

Working temperature: 0℃to +85℃

Stamp style SMD for surface mounting

production

Applications

Smart transportation

Smart home / appliances

Instruments

Health care

Industrial automation

Intelligent security

Smart energy

Model

Antenna type

Note

BL3383-P

PCB antenna

Default

Embedded Wi-Fi Module

Version：1.1 Release date：May 06, 2021

BL3383-P

Product

Manual

- 2 -

Content

1. Overview............................................................................................................................ - 3 -

2. Basic Specifications............................................................................................................ - 3 -

2.1. Power Consumption................................................................................................... - 3 -

2.2. Working Environment ................................................................................................ - 4 -

3. Radio Specifications........................................................................................................... - 4 -

3.1. Basic Radio Specification............................................................................................ - 4 -

3.2. Radio Performance..................................................................................................... - 5 -

3.2.1 IEEE802.11b.......................................................................................................... - 5 -

3.2.2 IEEE802.11g .......................................................................................................... - 6 -

3.2.3 IEEE802.11n.................................................................................................... - 6 -

4. BL3383-P Hardware Information....................................................................................... - 7 -

4.1. PIN Sequence.............................................................................................................. - 7 -

4.2. PIN Definitions............................................................................................................ - 8 -

4.3 Recommendations....................................................................................................... - 9 -

4.4. Mechanical Dimensions............................................................................................ - 10 -

4.5. Recommended Pad Size ........................................................................................... - 11 -

4.6. Certifications ............................................................................................................ - 11 -

4.7. Label ......................................................................................................................... - 12 -

4.7. Mechanical Dimensions............................................................................................ - 12 -

4.8. Packaging.................................................................................................................. - 13 -

5. Reference Design............................................................................................................. - 14 -

5.1. UART Interface Design.............................................................................................. - 14 -

5.2. Power Supply Requirement...................................................................................... - 16 -

Revision History................................................................................................................... - 20 -

Copyrights............................................................................................................................ - 20 -

Contact Us ........................................................................................................................... - 20 -

- 3 -

1. Overview

BL3383-P is a cost-effective embedded Wi-Fi module designed by BroadLink, highly integrated

with 32-bit MCU speed up to 100MHz, 256KB SRAM and 2MB flash, with 3.3V power supply.

The module integrates radio transceiver, MAC, baseband, all Wi-Fi protocols, configurations and

network stack. It can be widely used in applications like smart home devices, remote monitoring

devices and medical care instruments.

2. Basic Specifications

2.1. Power Consumption

Please refer to Table 1 for power consumption data.

Table 1 BL3383-P Power Consumption Data

Specifications

Min.

Typ.

Max.

Units

VDD

3.0

3.3

3.6

VIL(input low voltage)

0.8

VIH(input high voltage)

2.0

3.6

VOL(output low voltage)

0.4

VOH(output high voltage)

2.4

3.6

Standby (RX)

pulse current @TX

11b @17.5dBm 11Mbps

280

pulse current @TX

11g @15.5dBm 54Mbps

245

pulse current @TX

11n @15.5dBm 65Mbps

245

- 4 -

BLE @4dBm

150

2.2. Working Environment

Please refer to Table 2 for working environment data.

Table 2 BL3383-P Working Environment Data

Symbol

Description

Min.

Max.

Units

Storage temperature

-40

125

℃

Ambient operating temperature

℃

Vdd

Supply voltage

3.0

3.6

Vio

Voltage on IO pin

3.6

3. Radio Specifications

3.1. Basic Radio Specification

Please refer to Table 3 for radio specification.

Table 3 BL3383-P Radio Specification

Radio range

2402-2480MHz

Wireless standards

IEEE 802.11 b/g/n

Radio output (conductive)

802.11b:18.6±1.5dBm@11Mbps

802.11g: 16.81±1.5dBm@54Mbps

802.11n: 16.9±1.5dBm@MCS7/HT20

BLE: 4±2dBm

Antenna type

Internal: PCB antenna

External: Not supported

Receiving sensitivity

802.11b≦-89dBm@11Mbps

802.11g≦-76dBm@54Mbps

802.11n/HT20≦-73dBm@MCS7

Stack

IPv4, TCP/UDP/FTP/HTTP/HTTPS/TLS/mDNS

- 5 -

Data rate (max)

11M@802.11b, 54M@802.11g, MCS[email protected]

Security

Encryption standard: Open/WEP-Open/WPA/WPA2

Encryption algorithm: WEP64/WEP128/TKIP/AES

Network types

STA/AP

3.2. Radio Performance

3.2.1 IEEE802.11b

Table 4 Basic specifications under IEEE802.11b

ITEM

Specification

Modulation Type

DSSS / CCK

Frequency range

2412 MHz~ 2462 MHz

Channel

CH1 to CH11

Data rate

1, 2, 5.5, 11Mbps

Table 5 Transmitting performance under IEEE802.11b

TX Characteristics

Min.

Typical

Max.

Unit

Power@11Mbps

17.5

dBm

Frequency Error

-10

+10

ppm

EVM@11Mbps

-14

Transmit spectrum mask

Pass

Table 6 Receiving performance under IEEE802.11b

RX Characteristics

Min

Typical

Max.

Unit

11Mbps Input Level Sensitivity

Minimum Input Level (FER≦8%)

-89

dBm

- 6 -

3.2.2 IEEE802.11g

Table 7 Basic specifications under IEEE802.11g

ITEM

Specification

Modulation Type

OFDM

Frequency range

2412 MHz~ 2462 MHz

Channel

CH1 to CH11

Data rate

6, 9, 12, 18, 24, 36, 48, 54Mbps

Table 8 Transmitting performance under IEEE802.11g

TX Characteristics

Min.

Typical

Max.

Unit

Power@54Mbps

dBm

Frequency Error

-10

+10

ppm

EVM@54Mbps

-30

Transmit spectrum mask

Pass

Table 9 Receiving performance under IEEE802.11g

RX Characteristics

Min

Typical

Max.

Unit

54Mbps Input Level Sensitivity

Minimum Input Level (FER≦10%)

-76

dBm

3.2.3 IEEE802.11n

IEEE802.11n 20MHz bandwidth mode

Table 10Basic specifications under IEEE802.11n with 20MHz

ITEM

Specification

- 7 -

Modulation Type

OFDM

Frequency range

2412 MHz~ 2462 MHz

Channel

CH1 to CH11

Data rate

MCS0/1/2/3/4/5/6/7

Table 11 Transmitting performance under IEEE802.11n with 20MHz

TX Characteristics

Min.

Typical

Max.

Unit

Power@HT20, MCS7

15.5

dBm

Frequency Error

-10

+10

ppm

EVM@HT20, MCS7

-30

Transmit spectrum mask

Pass

Table 12 Receiving performance under IEEE802.11n with 20MHz

RX Characteristics

Min

Typical

Unit

MCS7 Input Level Sensitivity

Minimum Input Level (FER≦10%)

-73

dBm

4. BL3383-P Hardware Information

4.1. PIN Sequence

Please refer to Fig 1 for the pin sequence.

- 8 -

Fig 1 BL3383-P pin sequence

4.2. PIN Definitions

Please refer to Table 13 for pin definitions.

Function

GDN

VDD

RST

GPIO14

TX0

GPIO13

RX0

GPIO16

TX2

SI-SCL

GPIO15

RX2

SPI-CS

GPIO0

PWM0

GPIO17

PWM5

GPIO18

PWM6

GPIO19

PWM7

SPI-MOSI

GPIO20

PWM0

SPI-MISO

VDD

GND

GPIO1

PWM1

GPIO4

PWM4

GPIO3

TX1

PWM2

I2C-SDA

GPIO2

RX1

PWM3

I2C-SCL

- 9 -

Table 13 BL3383-P pin definitions

Note:

1. In default, UART2 (pin4 and pin5) are used for bypass communication and UART2 (pin6 and

pin7) are used for output of debugging information and burning firmware. Please refer to the

description in DC Characteristics for UART output current level.

2. RST is the reset pin and will be effective with VIL. Configuration information will be remained

after module reset. The module has pull-up process for RST designed internally.

3. The pins for reset button and LED indication should be defined according to actual firmware

and circuit

4. GPIO0 and GPIO1 are hardware function pins and DO NOT pull up these two pins before

power-up.

5. Pulling up both GPIO0 and GPIO3 will switch the module to firmware programming mode.

4.3 Recommendations

The following precautions should be considered during PCB designing:

Do not place any electrical components or grounding in antenna area on main board and it’s

better to leave this area blank on PCB.

It is recommended to not place any electrical components within 10mm range of module

antenna and not design any circuit or bond copper on main board under this area.

Do not use the module inside any metal case or containers with metal painting.

Keep the antenna of Wi-Fi module next to the edge of main board (as shown in Fig 5) during

design of PCB to ensure better performance of antenna.

- 10 -

Fig 2 BL3383-P Recommended PCB layout

4.4. Mechanical Dimensions

Please refer to Fig 3 for the dimensions of module.

Fig 3 BL3383-P Module Dimensions

Note: Dimensions (17.7±0.2) mm * (30±0.2) mm * (3.2)mm (with shielding case)

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