Buehler EcoMet 300 Manuale utente
NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
Version 1.0
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Standard Operating Manual
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Buehler EcoMetTM300 Silicon Polisher
NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
Version 1.0
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Contents
1. Picture and Location
2. Process Capabilities
2.1 Cleanliness Standard
2.2 Possible Polishing Materials
2.3 Process Specification
3. Contact List and How to Become a Qualified User
3.1 Emergency Responses and Communications
3.2 Training to Become a Qualified EcoMetTM300 User
4Operating Procedures
4.1 System Description
4.2 Safety Warnings
4.3 Operation Precautions and Rules
4.4 Initial Status Checks
4.5 Initial System Checks
4.6 Preparation before Polishing
4.7 Polish Cloth and Slurry Selection
4.8 Polish Parameters setting
4.9 During the Run
4.10 Process Recording during the Process
4.11 Clean up
4.12 Check out
4.13 Important Notice
NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
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Buehler EcoMetTM300 Silicon Polisher
1. Picture and Location
This tool is located at Room 2227.
2. Process Capabilities
2.1 Cleanliness Standard
EcoMetTM300 silicon polisher is classified as a Semi-Clean equipment.
2.2 Possible Polishing Materials
Silicon, Silicon Oxide, Silicon Nitride
Fig.1 Buehler EcoMetTM300 Silicon Polishing Machine
NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
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2.3 Process Specification
What EcoMetTM300 Silicon Polisher CAN do
1. EcoMetTM300 can provide mechanical polish of sample surface using different
size of slurry corresponding to different type of polish cloth.
2. EcoMetTM300 can polish the samples with thickness from tens microns to one
millimeters.
3. EcoMetTM300 can polish the samples in any shape, with size smaller than 4
inch.
What the EcoMetTM300 Silicon Polisher CANNOT do
1. EcoMetTM300 should not be used to polish a sample larger than 4 inch in
diameter.
2. EcoMetTM300 should not be used to polish a sample not bounded on our
standard holder.
3. EcoMetTM300 should not be used to polish a sample with large area of metal
on the surface.
4. EcoMetTM300 should not be used to polish a sample with any photoresist
coated on the surface.
5. EcoMetTM300 should not be used to polish a sample with fine structures on the
surface.
6. EcoMetTM300 should not be used to polish a sample using polishing cloth,
slurry or lubricant not from NFF.
NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
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3. Contact List and How to Become a Qualified User
3.1 Emergency Responses and Communications
1. Security Control Center: 2358-8999 (24hr) & 2358-6565 (24hr)
2. Wing Leong CHUNG - Safety Officer (2358-7211 & 64406238)
3. Preason Man Wai Lee –Deputy Safety Officer (2358-7900),
4. Henry Chun Fai YEUNG –Senior Technician (2358-7896 & 2358-7219)
In case of technical help, please contact NFF staffs,
1. Henry Chun Fai YEUNG –Senior Technician (2358-7896 & 2358-7219))
2. Shuyun ZHAO –Scientific Officer (2358-7212)
3.2 Training to Become a Qualified EcoMetTM300 User
Please follow the procedures below to become a qualified user of the EcoMetTM300:
1. Read all materials provided on the NFF website of the EcoMetTM300.
2. E-mail to Mr. Henry Chun Fai YEUNG requesting EcoMetTM300 operation
training.
3. Hands-on operation training for EcoMetTM300 is required.
4. Pass the examination for the equipment operation and the security.
4. Operating Procedures
4.1 System Description
EcoMetTM300 silicon polisher is composed of power head, D-shape bowl and
control panel. This system is designed to provide mechanical polish of sample
NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
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surface using different slurry corresponding to different type of polish cloth. To
get a defect-free surface, it normally needs multi-steps from coarse to intermediate
and to fine polish.
The sample needs to be bounded on a 4-inch ceramic holder using wax. Then put
the ceramic holder and the drive adapter together and fix them using adhesive tape.
After fine polishing, the surface roughness can reach the level of ~1nm.
4.2 Safety Warnings
1. If the equipment failure while being used, never try to fix the problem by
yourself. Please contact NFF staffs.
2. In emergency, please push the red emergency button to interrupt the
equipment power, and report to the NFF staffs immediately. DO NOT attempt
to resume the equipment on before the problem is solved.
3. During process, if something going wrong and you are not sure what happens,
please report to NFF module staffs.
4.3 Operation Precautions and Rules
1. Please reserve the time slot on your own, and make sure you use your own
time slot to do the polish process.
2. Please fill all the details of the logbook attached, i.e. date, name, project
number, email, project details, material …
3. Do not operate the equipment unless you are properly trained and approved by
NFF staffs.
4. Do not leave an on-going etching process unattended.
NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
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5. Do not use the equipment after office hour.
4.4 Initial Status checks
1. Please check the status of shutdown notice posted in the NFF reservation
website.
2. Please check the reservation status on the website, and reserve the right time
slot by your own.
3. Please check-in the equipment on your own according to the reserved time
slot.
4. Before operate the machine, please make sure you have read and check the
details of the check list.
4.5 Initial system checks
1. Turn on the main power on the backside and check the front blue power button
in ON.
2. Check the N2pressure is ~35psi.
4.6 Preparation before Polishing
A) Sample preparation--wafer bonding*
(*If the sample is grinded using NVG-200A Silicon Grinder firstly, please ignore
this step)
1) If the sample is irregular shape, please polish the sharp corner using abrasive
paper before wafer bonding.
2) Put the ceramic holder on the hotplate.
3) Turn on the hotplate, as shown in Fig. 2, adjust the knob to position 6-7, wait
NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
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for 3~5 minute.
4) Melting enough wax on the ceramic holder, as shown in Fig. 3.
5) Put your sample on top of the wax, and move the wafer in different direction to
even the wax for a flat surface, see Fig. 4.
Fig. 2
Fig. 3
Fig. 4
NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
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6) Move the ceramic holder onto the bonder very carefully, and put an oil-paper
(Fig.5a) and a soft silicone pad on the top, as shown in Fig. 5b.
7) Switch the RED pneumatic button to horizontal (position 2), as shown in Fig.
6a, and let the heavy metal drop down to the sample surface. Then switch the
RED pneumatic button to position 3 to add 0.5MPa pressure to heavy metal for
around 5mins until the ceramic holder is cooled down to room temperature (Fig.
6b). DON’T adjust the pressure by yourself.
Oil paper
Silicone pad
Fig. 5
(a)
(b)
Position2
Position3
Fig. 6
(a)
(b)
0.5MPa
Position1
NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
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8) Take out the ceramic holder by switching the RED pneumatic button back to
position 2 and then position 1. The heavy metal will lift up to initial position.
Please be careful about the ceramic holder. Sometimes the ceramic holder will
goes up together with the heavy metal. User should put one hand under it
immediately, otherwise, the ceramic holder will drop to the bottom and might
be broken.
9) Measure the thickness or flatness using dial gauge, shown in Fig. 7.
Put the sample on top of the granite master flat;
Press the ON/OFF button to turn on the dial gauge;
Push the hand vacuum pump to rise up the probe, and release it to let the
probe touch sample surface.
Click the reset button to reset the zero position (optional);
Push the hand vacuum pump and move the sample, then release it to do the
measurement.
Fig. 7
Reset button
Granite
master flat
Hand vacuum
pump
Probe
Digital display
ON/OFF
Indice
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