CINCH ModICE SE Series Manuale utente
ModICE Modular Integrated
Connector Enclosure
Enclosure Assembly Instructions
For technical or ordering information
relating to this product, contact Cinch
Transportation Marketing Department at
630-705-6031 or consult our website at
www.cinch.com
Assembly and Opening Tools
The ModICE connector enclosure system is
available in 2 sizes and various pin counts :
Small Enclosure : SE 18, 30 and 48 I/O
Large Enclosure : LE 30, 48 and 60 I/O
Blank face headers are also available for
custom interconnection.
Available options :
Headers with ferrite filter
Enclosure with 1 or 2 heat sink
The assembly process is identical for all
header sizes.
The heat sink feature requires additional
steps in the assembly of the printed circuit
board.
Unless otherwise noted, the following
instructions apply to both the SE and LE
enclosure systems.
Introduction
Heat Sink
(optional)
Ferrite filter
(optional)
Enclosure
Header
Enclosure
Bottom view
Spring plate for heat sink (optional)
Mount Header to Printed Circuit Board
Headers must be secured to the
board with 2 screws
#4 self-tapping screws
Torque : 2-3 in-lbs (0.23-0.34 Nm)
Refer to Cinch header drawings for
board layout.
Process Printed Circuit Board
Protect header functional areas from conformal coating.
Refer to Cinch header drawings for protection of heat sink spring plate
mounting slots.
Heat Sink Option
Install heat sink spring plates after
printed circuit board has been
processed.
Spring plates and thermally conductive
adhesive paste are necessary to guarantee
proper heat conduction through the heat
sinks; Cinch recommends Loctite 383.
Spring plates are marked “R” and “L” and
need be installed as indicated.
When using a one (1) heat sink enclosure,
use spring plate “R” only.
Refer to Cinch header prints for specific
board lay out and spring plate selection.
Slots (2) for Spring Plate
press fit
Press fit spring plates into board
Mosfet TO220
R
L
Tool part number 599-11-11-650
One tool used to assemble both
ModICE SE and LE systems
Simple settings to convert from SE
to LE enclosure system
Adjustable Enclosure Holder
Adjustable Header Holder (SE position shown)
ModICE Assembly Tool
SE Setting
LE Setting
Header alignment blocks down
Header alignment blocks up
Enclosure Holder in LE position
Enclosure Holder in SE position
General
Move Enclosure Holder to the back
position for the LE position
For LE setting, rotate and snap the
two alignment blocks.
Tool Settings for Small (SE) and
Large (LE) Enclosure
Enclosure Holder Settings Header Holder Settings
SESE
LELE
ModICE Assembly Tool
Load Enclosure into the holder
Check SE / LE position on the
previous page
Load Header into the holder
• Open the press to load the
header/PCB assembly
• Alignment blocks must be in the
down position for SE headers
(pic. shown)
Alignment blocks must be in the
up position for LE headers
(see previous page)
Slide Header into alignment blocks
Push header against the holder
(snap fit retention by spring
plunges)
ModICE Assembly Tool
Push for
snap fit
Alignment Block
Loading of the Enclosure and
Header
2 1
2
11
Spring plunge
ModICE SE Small Enclosure
Install enclosure and header
Activate lever to assemble
header/PCB into the enclosure
Push all the way down to close all
latches (audible snaps)
Pull back to open position to release
the ModICE assembly from the press
Verify that all latches are fully engaged
ModICE Assembly Tool
ModICE Large Enclosure
Install enclosure and header
Activate lever to assemble
header/PCB into the enclosure
Push all the way down to close all
latches (audible snaps)
Pull back to open position to release
the ModICE assembly from the press
Verify that all latches are fully engaged
ModICE Assembly Tool
ModICE is designed to be tamper proof.
Specific tools are required to open the
enclosures.
Tool p/n 5991111611 – ModICE SE
Tool p/n 5991111612 – ModICE LE
Any attempt to open an enclosure without
the recommended tools may result in
damaged parts that will affect the
mechanical characteristics and the
sealing of the enclosure.
ModICE Opening Tool
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