HPF9000-OM (V1.8) HPF-9000 PRODUCT MANUAL 1-3
Introduction Safety Summary
Safety Summary
Warnings
Cautions
HPF-9000 Functional Description
The HPF-9000 is an openGear®-compatible12RU high-density modular
frame offering 360 Watts of net (user) available power in a high-capacity
20-slot format. (Maximum card capacity is determined by card model(s)
installed and other factors (see Frame Card Capacity and Rear I/O Modules
on page 1-5).
High power-density power supplies (single standard, redundant second
optional) and engineered cooling/ventilation design allow 10 high-power
cards in a frame (10 x 36 W = 360 W), or 20 medium-power cards in a frame
(20 x 18 W = 360W). Separate forced-air cooling paths are provided for the
card area and the power supply areas. An intelligent fan controller adjusts fan
speed with changes in power supply loading and temperature.
The HPF-9000 can accommodate two front-loaded PSU-9000 power supply
modules. Adding a second (optional) supply gives the frame full power
redundancy. The PSU-9000 power supply unit is interchangeable as a primary
or redundant power supply module, with supplies in either position being
hot-swapable. Each power supply contains an independent cooling fan and a
front-mounted power switch.
The HPF-FC Network Controller Card (furnished as standard on the
HPF-9000 frame) allows Ethernet connectivity to any number of connections
for full multi-point control and monitoring via free DashBoard™software.
The frame is equipped with two independent reference buses that can supply a
selected reference to cards within the frame.
! WARNING ! To reduce risk of electric shock do not remove line voltage service barrier cover on frame
equipment containing an AC power supply. NO USER SERVICEABLE PARTS INSIDE.
REFER SERVICING TO QUALIFIED SERVICE PERSONNEL.
CAUTION This device is intended for environmentally controlled use only in appropriate video
terminal equipment operating environments.
CAUTION Heat and power distribution requirements within a frame may dictate specific slot
placement of cards. Cards with many heat-producing components should be arranged to
avoid areas of excess heat build-up. As such, avoiding placing the card adjacent to other
cards with similar dissipation values if possible.
1. openGear®is a registered trademark of Ross Video Limited. DashBoard™is a trademark of Ross
Video Limited.
