ConMed 7550 Manuale utente

Service Manual

LIMITED WARRANTY

For a period of two years following the date of delivery,

CONMED Corporation warrants the CONMED Sys-

tem 7550 Electrosurgical Generator against any defects

in material or workmanship and will repair or replace (at

CONMED’s option) the same without charge, provided

that routine maintenance as specified in this manual has

been performed using replacement parts approved by

CONMED. This warranty is void if the product is used in

a manner or for purposes other than intended.

525 French Road

Utica, New York 13502 U.S.A.

U.S. Patent Numbers 4,437,464 - 4,569,345 - 4,617,927

- 4,727,874 - 4,848,335 - 4,961,739 - 5,152,762 -

5,626,575 and other patents pending.

For Technical Service or Return Authorization Phone:

303-699-7600 / 1-800-552-0138 Extension 5274

Fax 303-699-1628

For Customer Service or to order parts phone:

1-800-448-6506 / 315-797-8375 / Fax 315-735-6235

or contact your CONMED Representative.

European Authorized Representative

MDSS GmbH

Burckhardtstr 1

D - 30163 Hannover

Germany

The revision level of this manual is specified by the

highest revision letter found on either the inside front cover

or enclosed errata pages (if any).

Manual Number 60-7552-ENG Rev. D 10/06

Unit Serial Number_________________________________

Table of Contents

& List of Illustrations

Section Title Page

1.0 General Information ...........Refer to Operator’s Manual (P/N 60-7551)

2.0 System Components .................................... Refer to Operator’s Manual

3.0 Operation .................................................... Refer to Operator’s Manual

4.0 Operator Service ......................................... Refer to Operator’s Manual

5.0 Technical Information ................................. Refer to Operator’s Manual

6.0 Circuit Descriptions .......................................................................... 6-1

6.1 Introduction ........................................................................................................ 6-1

6.2 Display Panel Assembly [A5] ............................................................................... 6-1

6.2.1 General Information ..........................................................................................................6-1

6.2.2 Mailbox [U19] ..................................................................................................................6-1

6.2.3 Power Adjustments [U16 & U33] ..................................................................................6-1

6.2.4 Activation Requests [U16 & U33] ....................................................................................6-2

6.2.5 Mode Select Encoders [U31 & U32] ................................................................................6-2

6.2.6 Display Drivers - Seven Segment [U14, U20, U39, U40, U41, & U17] .........................6-3

6.2.7 Indicator Driver [U34] .....................................................................................................6-3

6.2.8 Firmware [U28 & U1] ......................................................................................................6-3

6.2.9 RAM [U2 -6116] ..............................................................................................................6-3

6.2.10 A/D Inputs [Control Microcontroller] ..............................................................................6-3

6.2.11 A/D Inputs [Monitor Microcontroller] .............................................................................6-4

6.2.12 EEPROM & Driver [U37, U27] ......................................................................................6-4

6.2.13 D/A Converter [U12] .......................................................................................................6-4

6.2.14 Keyboard Scanner [U5] ....................................................................................................6-5

6.2.15 5V Monitoring [U29] .......................................................................................................6-5

6.2.16 Output PIA [U21] ............................................................................................................6-5

6.2.17 T_MON [U35] .................................................................................................................6-5

6.3 Power Control Assembly [A4] ............................................................................. 6-5

6.3.1 Power Control - Full Bridge Amplifier ..............................................................................6-6

6.3.2 RF Logic [U7 on the Power Control Assembly] ...............................................................6-7

6.3.3 Power Control - I/O Signals ..............................................................................................6-8

6.3.4 ABC™ Arc Sense ...............................................................................................................6-8

6.4 High Voltage Power Supply [A7] ........................................................................ 6-9

6.4.1 Power Supply Topology ....................................................................................................6-9

6.4.2 Phase Control Output ......................................................................................................6-9

6.4.3 HVPS Isolation Components ..........................................................................................6-10

6.4.4 HVPS Low Voltage Components ...................................................................................6-11

6.5 HV/Flow Control Assembly [A1] ..................................................................... 6-11

6.5.1 Line Synchronization Circuit ...........................................................................................6-11

6.5.2 HV Regulation Control Loop .........................................................................................6-12

6.6 Argon Flow Control [A1] ................................................................................. 6-13

6.6.1 Pneumatic Circuit ............................................................................................................6-13

6.6.2 Mass Flow Rate Regulation ............................................................................................6-14

6.6.3 Smart Sense .....................................................................................................................6-15

6.7 Full Bridge Amplifier [A8] ................................................................................ 6-15

Section Title Page

6.8 Single-Ended Amplifier [A9] ............................................................................. 6-16

6.9 RF Output Assembly/Components [A10] ......................................................... 6-17

6.10 Low Voltage Power Supply [A6] ....................................................................... 6-18

6.11 HS/A.R.M. Assembly [A11] ............................................................................. 6-18

6.11.1 Handsense Circuit ...........................................................................................................6-18

6.11.2 Aspen Return Monitor (A.R.M.) ....................................................................................6-19

6.11.3 RF Leakage Monitor .......................................................................................................6-20

6.11.4 Transformer Select Relays ................................................................................................6-20

6.11.5 Arc Sense Transformer ....................................................................................................6-20

7.0 Maintenance/Checkout ...................................................................... 7-1

7.1 Introduction ........................................................................................................ 7-1

7.2 Cleaning .............................................................................................................. 7-1

7.3 Generator & Mobile Storage Assembly ................................................................ 7-1

7.4 Access to Circuits & Factory Settings .................................................................. 7-2

7.5 Default Settings (Factory Settings) ...................................................................... 7-2

7.6 AC Mains Frequency & Voltage .......................................................................... 7-2

7.7 Initial Setup & Test ............................................................................................. 7-3

7.7.1 Accessory Connections ......................................................................................................7-3

7.7.2 Display Panel Testing ........................................................................................................7-3

7.7.3 Activation Testing .............................................................................................................7-5

7.7.4 RF Output Power Checks .................................................................................................7-5

7.7.5 Argon Flow Testing ..........................................................................................................7-6

7.7.6 Remote Power Control Testing .........................................................................................7-6

7.7.7 Return Monitor (A.R.M. - Aspen Return Monitor) ..........................................................7-7

7.8 Pulsed Cut Mode ................................................................................................. 7-8

7.9 RF Leakage Test .................................................................................................. 7-8

7.10 Final Checks ........................................................................................................ 7-8

7.11 Mobile Storage Pedestal (Cart) ............................................................................ 7-8

8.0 Calibration ........................................................................................ 8-1

8.1 Introduction ........................................................................................................ 8-1

8.2 Equipment List ................................................................................................... 8-1

8.2.1 Standard Equipment List ..................................................................................................8-1

8.2.2 Optional Calibration Equipment List ................................................................................8-1

8.2.3 Test Leads & Adaptors ......................................................................................................8-1

8.3 Calibration Set-Up .............................................................................................. 8-1

8.4 A.R.M. Calibration (HS/A.R.M. Assembly - A11) ............................................ 8-1

8.4.1 10 Ohm A.R.M. Calibration .............................................................................................8-1

8.4.2 150 Ohm A.R.M. Calibration ...........................................................................................8-2

8.5 High Voltage Calibration (HV/Flow Control Assembly - A1) ............................. 8-2

8.5.1 HV RAMP Calibration .....................................................................................................8-2

8.5.2 High Voltage Adjust .........................................................................................................8-2

8.5.3 HV_MON Adjust .............................................................................................................8-2

8.6 Argon Flow Calibration (HV/Flow Control Assembly - A1) ............................... 8-2

8.6.1 dP Calibration (Differential Pressure) ................................................................................8-2

8.6.2 PABS Calibration (Absolute Pressure) ...............................................................................8-2

8.6.3 Flow Rate Calibration (Optional) .....................................................................................8-2

8.6.4 FMON Calibration ...........................................................................................................8-3

8.7 Power Calibration ................................................................................................ 8-3

8.7.1 Filter Calibration - Full Bridge Modes (Optional) .............................................................8-3

8.7.2 Cut Power Calibration (Power Control Assembly - A4) ....................................................8-3

Section Title Page

8.7.3 Pinpoint Coag Calibration (Power Control Assembly - A4) ..............................................8-3

8.7.4 Spray Coag Calibration (Power Control Assembly - A4) ...................................................8-3

8.7.5 Bipolar Calibration (Power Control Assembly - A4) .........................................................8-4

8.7.6 ABC Calibration (Power Control Assembly - A4) .............................................................8-4

8.7.7 ABC Over Voltage Calibration (Power Control Assembly - A4) [Optional] .....................8-4

8.8 EEPROM Calibration ......................................................................................... 8-4

8.8.1 Spray Coag PW_MEA Loading ........................................................................................8-4

8.8.2 ABC PW_MEA Loading ...................................................................................................8-4

8.8.3 A.R.M. Max Voltage Loading ...........................................................................................8-4

8.9 IEC RF Leakage Measurement [Optional] .......................................................... 8-5

Appx. A Mnemonic List ................................................................................. A-1

Appx. B Troubleshooting Guide .....................................................................B-1

Introduction ........................................................................................................ B-1

Control Microcontroller Failure Codes and Troubleshooting Tips ........................ B-2

Monitoring Microcontroller Failure Codes and Troubleshooting Tips .................. B-3

Additional Troubleshooting Tips (Non-Error Code Related) ............................... B-5

Error Storage and Retrieval ................................................................................. B-7

Error Display Configuration .............................................................................................B-7

Example Error ...................................................................................................................B-8

Appx. C Schematics & BOMs ........................................................................ C-1

Bill of Material: Chassis & Cart ...........................................................................C-1

Bill of Material: HV/Flow Control PCB Assembly ..............................................C-2

Bill of Material: Power Control PCB Assembly ...................................................C-4

Bill of Material: Display PCB Assembly ..............................................................C-5

Bill of Material: LV Power Supply PCB Assembly .............................................C-10

Bill of Material: HV Output PCB Assembly ......................................................C-11

Bill of Material: FB Amplifier PCB Assembly ....................................................C-12

Bill of Material: SE Amplifier PCB Assembly ....................................................C-13

Bill of Material: RF Output PCB Assembly .......................................................C-14

Bill of Material: ARM/Handsense PCB Assembly .............................................C-15

Figure/Title Page

Figure 6.1 RF Drive Signals ....................................................................................................... 6-8

Figure 6.2 Line Sync/RAM ...................................................................................................... 6-11

Figure 6.3 Flow Diagram ......................................................................................................... 6-14

Figure 6.4 Resistance vs. Bargraph ........................................................................................... 6-19

Figure 7.1 Test Adapters ............................................................................................................ 7-9

Figure 7.2 Test Analyzer Connections ...................................................................................... 7-10

Figure 3.1 RAMP Flat Spot ....................................................................................................... 8-2

Figure 3.2 IEC Method RF Leakage Test Setup ......................................................................... 8-5

Figure B-1 Signal Status for a Handcontrol 1, Cut Activation Request ..................................... B-9

Figure B-2 Signal Status for ABC® Activation ........................................................................ B-10

Figure C-1a Assembly Location Diagram ..................................................................................C-1

Figure C-1b Pneumatic Assembly ..............................................................................................C-1

Figure C-2 Interconnect Diagram .............................................................................................C-1

Figure C-3 A1 HV/Flow Control PCB .....................................................................................C-2

Figure C-4a A1 HV/Flow Control PCB Schematic, Sheet 1 (of 2) ...........................................C-2

Figure C-4a A1 HV/Flow Control PCB Schematic, Sheet 2 (of 2) ...........................................C-3

Figure C-5 A4 Power Control PCB ...........................................................................................C-4

Figure C-6 A4 Power Control PCB Schematic ..........................................................................C-4

Figure C-7 A5 Display PCB ......................................................................................................C-5

Figure C-8a A5 Display PCB Schematic, Sheet 1 (of 4) ............................................................C-6

Figure C-8b A5 Display PCB Schematic, Sheet 2 (of 4) ...........................................................C-7

Figure C-8c A5 Display PCB Schematic, Sheet 3 (of 4) ............................................................C-8

Figure C-8d A5 Display PCB Schematic, Sheet 4 (of 4) ...........................................................C-9

Figure C-9 A6 LV Power Supply PCB ....................................................................................C-10

Figure C-10 A6 LV Power Supply PCB Schematic .................................................................C-10

Figure C-11 A7 HV Output PCB ...........................................................................................C-11

Figure C-12 A7 HV Output PCB Schematic ..........................................................................C-11

Figure C-13 A8 FB Amplifier PCB .........................................................................................C-12

Figure C-14 A8 FB Amplifier PCB Schematic ........................................................................C-12

Figure C-15 A9 SE Amplifier PCB .........................................................................................C-13

Figure C-16 A9 SE Amplifier PCB Schematic .........................................................................C-13

Figure C-17 A10 RF Output PCB ..........................................................................................C-14

Figure C-18 A10 RF Output PCB Schematic .........................................................................C-14

Figure C-19 A11 A.R.M./Handsense PCB ..............................................................................C-15

Figure C-20 A11 A.R.M./Handsense PCB Schematic .............................................................C-15

6-1

Circuit Descriptions

Section 6.0

6.1 Introduction

The information on the System 7500™ circuits

identifies specific signals and I/O ports that help

identify the appropriate signal levels. The text

uses the word SET for high and CLEAR for

low. To locate the assemblies within the System

7500™, refer to Figure C-1. Use the system inter-

connect (Figure C-2) to identify wiring harness

terminations and individual signals within a har-

ness.

6.2 Display Panel Assembly [A5]

6.2.1 General Information

The System 7500™ has two 80C550 microcon-

trollers with one dedicated to system control and

the other dedicated to system monitoring. The

control microcontroller (U15) sets the system

enables and control limits, while the monitor

microcontroller (U22) monitors system perfor-

mance and sets “inhibits” when an error is detect-

ed. Both of these devices have “on-board” A/D

converters, and each device independently moni-

tors separate analog signals. The address, data

and control buses of both microcontrollers are

isolated by a device called the “mailbox”, U19, a

dual port RAM that allows two-way data transfer

between the two microcontrollers.

On the schematic, the signal labels will have either

a “C” or “M” attached. The “C” is for the con-

troller logic (U15) or control microcontroller and

the “M” is for the monitor logic (U22) or moni-

tor microcontroller interface. The schematic for

the display panel (Figure C-8) is on four separate

sheets. Sheet 1 is the schematic for the displays

and drivers only; sheet 2 shows all the connec-

tors that are on this assembly along with some

discrete non-logic circuitry; sheet 3 is the control

microcontroller logic; and sheet 4 is the monitor

microcontroller logic.

This assembly has several programmable logic

devices to interface signals to the data bus for

both the control and monitor microcontrollers.

During the discussion when two reference desig-

nators are listed together it means the logic func-

tions are the same and can be interchanged.

6.2.2 Mailbox [U19]

A dual port logic device that allows data transfer

between the two microcontrollers. All system

setups and messages are communicated through

the mailbox between the two microcontrollers.

When data is loaded by either microcontroller, a

bit labeled DA (data available) is SET to inform

the other microcontroller that it has mail. Once

the data is read from the mailbox, another bit

labeled DC (data cleared) is CLEARED to inform

the sender that the mail has been retrieved. Each

microcontroller has independent access to the

mailbox and the mailbox is the only component

that connects the two data buses. Each instruc-

tion sent through the mailbox requires two bytes

of information with the first byte (command byte)

identifying the instruction and the second byte

(data byte) containing the data for the instruction.

6.2.3 Power Adjustments [U16 & U33]

(C for controller; M for monitor) Power adjust-

ments on the System 7500™ are made by rotat-

ing the power control encoders. The mnemon-

ics for the power encoders are: CT - CUT; CG

- COAG; BP - BIPOLAR; BM - ABC™. Each

encoder is a two bit counter (i.e.; CT0 & CT1)

where the two counts are used to identify the

direction of rotation. The logic devices (U16

& U33) store the previous count and compare

it to the new count in order to recognize if the

count is increasing or decreasing, which defines

if the encoder is rotated clockwise or counter-

clockwise. Each “click” of the encoder is a count

and the number of counts are stored within

U16 & U33 until the microcontroller reads the

port. The microcontroller reads each encoder

port independently and if an encoder has been

rotated, the count will be greater than zero. The

data the micro will see is a number (0 to 32) rep-

resenting the number of “clicks” the encoder has

been rotated and a separate bit that signifies the

direction of the count, either up or down. The

microcontroller then takes this count and adds or

6-2

subtracts it to the existing power value.

The control microcontroller reads and controls

power change requests, however the monitor

microcontroller also looks at the encoders to verify

the change is valid. If the two microcontrollers

disagree on the direction (up or down), number

of counts, or which encoder is rotating, the power

will not be changed; i.e. the change request is

ignored.

6.2.4 Activation Requests [U16 & U33]

Activation requests are “looked at” by both micro-

controllers, and if the two do not agree on an acti-

vation request, an error code (Err 303 or Err 307)

will be displayed.

Activation Requests: Handcontrol or

Footcontrol

H2CT Handcontrol 2, Cut, Active Low

H2CG Handcontrol 2, Coag, Active Low

H1CT Handcontrol 1, Cut, Active Low

H1CG Handcontrol 1, Coag, Active Low

HIP Handcontrol, Bipolar, Active Low

FCT Footcontrol, Cut, Active High

FCG Footcontrol, Coag, Active High

FBIP Footcontrol, Bipolar, Active High

FAB Footcontrol, ABC™, Active High

Note: HABC Handcontrol is activated at

handcontrol 2 and is a result of H2CT * H2CG *

HABC_DR, which is an output of U16.

6.2.5 Mode Select Encoders [U31 & U32]

Blend Level (BL) and Argon Flow (FL) rate is

adjusted by the same type of encoders as used for

power adjustments. The logic within U31 & U32

for these two encoders is the same as for power

adjustment and the discussion for power adjust-

ment applies here.

These logic devices have I/O ports also, and the

following text provides a brief description of each

port signal.

U31: Port B (PB0 - PB7) Inputs for Control

Microcontroller

LPSW: Low Pressure Switch

SET when the argon tank pressure is less than

240 psi. Low Tank warning is illuminated.

FDEV: Flow Deviance

SET if an occlusion occurs to the argon flow.

A_T: Active Mode or Target Mode

ABC™ mode and used for tone selection only.

A_T SET, tone is 500 Hz and ABC™ is active

- A_T CLEARED, tone is 250 Hz and

ABC™ is in the Target mode.

BRN_OUT: Brown Out

Holds high for at least 6 seconds when power

fails and is used to identify a temporary power

loss. The user settings are returned following

a temporary power loss.

Tone_A: Tone Signal

Mode Activation and Alarms. Square wave sig-

nal with frequency between 250 Hz to 1KHz

for audible tone.

KB_DA: Keyboard Data Available

SET when a front panel switch is pressed, cleared

when the device is read.

U31: Port C (PC0 - PC6) Outputs from

Control Microcontroller

ABC>80: ABC™ Power is Greater than 80W

SET when ABC™ power is set to greater than

80W. CLEARED when ABC™ power is 80W

or less.

RFEN: RF Enable

SET to enable the RF drive for all activations.

FB_EN: Full Bridge Enable

CLEARED when activation for Cut, Blend,

Pinpoint, & Bipolar occurs.

OV_TST: Over Voltage Test

Test pin that allows the control microcontroller

to test and verify the ABC™ over voltage

circuit is operational. During Power-On Self-

Test (POST), this signal is clocked for a dura-

tion of about 7mS.

Alarm: Tone for alarms

1KHz signal tone for alarm - volume cannot be

adjusted.

Tone_B: Tone, Mode

Signal for all Tones except alarm tones. Volume

can be adjusted.

U32: Port B (PB0 - PB7) Monitor Inputs

This port has the switch for setting the system

defaults. The switch is located on the back side of

the Display PCB for accessibility. Default settings

are with the switch in the “OFF” position (off

= high on the input pin of U32). To change a

default setting, move the appropriate switch to the

6-3

“ON” position. To verify the selection, turn the

power off for at least 10 seconds, and then restore

power.

1-TEST-RUN (Default: RUN MODE)

TEST mode allows the system to be operated

without error detection and shut down. This

mode can be changed anytime while the sys-

tem is in standby. Test mode can be selected

before the unit is powered on, however the

“store” button must be held down until an

“Err 1” is displayed. Test mode is to be used

only for system level testing.

2-SIN-DUAL PAD (Default: DUAL PAD)

SIN is for single foil return electrodes.

3-ZERO-LAST (Default: LAST SETTING)

When ZERO is selected, all power levels will

default to zero when the system is powered

on. Last setting only applies to power levels

of the default modes.

4-SPRAY-PPT (Default: PINPOINT COAG)

Spray Coagulation can be selected as a default

mode.

5-NON_SIM-SIM (Default: SIMULTANEOUS)

When the switch is set for non-simultaneous

activation, dual activation will not occur for

coag modes.

6-GAS TEST (for testing purposes only)

Allows the ABC™ mode to be tested without

argon gas connected. Can only be set after

the unit has been powered on and completed

initialization.

U32 - PORT C: Outputs from Monitor

This port has three (3) active outputs only and the

outputs are used solely to inhibit internal circuits

when a system fault is detected.

GAS_En: Gas Enable

SET to enable argon gas flow - CLEAR inhibits

argon gas flow. Drives the solenoid valve that

is part of the argon flow control manifold.

HV_INH: High Voltage Inhibit

SET inhibits the HV to the amplifiers.

RF_INH: RF Drive Inhibit

CLEAR inhibits the RF Drive to the amplifiers.

6.2.6 Display Drivers - Seven Segment [U14,

U20, U39, U40, U41, & U17]

Converts Hex to Seven-Segment. The hex value

on bits 0-3 drive the “ones” digit; the hex value

on bits 4-7 drive the “tens” digit; and the hex

value on the address (A0, A1) is used to drive

the “hundreds” digit. The displays are common

anode, therefore each segment is illuminated with

an active low on the drivers. The digits are mul-

tiplexed, allowing only one digit to be on at any

one time for each section.

6.2.7 Indicator Driver [U34]

All indicators on the display panel with the excep-

tion of the numeric displays are driven with this

logic device in a 4x7 matrix. The outputs labeled

S0-S3 are multiplexed at a 25% duty cycle and

these outputs are converted to 15V at U38 &

U42, which provide drive current for all LED

indicators. U9 and U10 sink the current for the

indicators. The monitor microcontroller loads

4- eight bit registers, with each bit dedicated to a

specific display panel indicator. The outputs S0-

S3 are “send” and the outputs labeled R0-R7 are

“receive”. All the send and receive outputs are

active high at a 25% duty cycle.

6.2.8 Firmware [U28 & U1]

The firmware or program for the control

microcontroller is stored in U1 and the program

for the monitor microcontroller is stored in U28.

6.2.9 RAM [U2 -6116]

U2 is the external RAM for the con-

trol microcontroller only and the monitor

microcontroller only uses internal RAM.

6.2.10 A/D Inputs [Control Microcontroller]

Only four of the 8 internal A/D inputs are uti-

lized, and three of these inputs are for the A.R.M.

(Aspen Return Monitor).

2VARM: A voltage that represents the resistance of

the patient plate.

ARM_10: Calibration limit for 10 ohms. (See

A.R.M. cal)

ARM_150: Calibration limit for 150 ohms (See

A.R.M. cal)

FMEA: Back pressure monitoring for argon gas

flow. The control microcontroller monitors this

signal as a means of detecting occlusions or special

accessories with small orifice sizes.

When the monitor microcontroller senses an error

at ARM_10 or ARM_150, it will display an error

code to identify which input has the fault. These

are fatal errors that require the system to be reset

6-4

when they occur. An error for 2VARM is a return

electrode fault and occurs when the resistance

measured on the return electrode is not within

specified limits for either a single or dual foil

return electrode. An error code is not displayed,

however the “red” indicator for a return electrode

fault is illuminated.

In many cases, intermittent or continuous alarms

associated with these signals can be rectified

by going through the calibration procedure for

A.R.M.

FMEA has an idle voltage of one-half of the value

of PABS. When testing or troubleshooting, use

the calibration procedure for PABS to determine

the value of FMEA when no argon flow is occur-

ring. This voltage increases with flow. A voltage

that exceeds 3.3V in all flow modes will set a flow

alarm by illuminating the “red” Flow Fault indica-

tor.

6.2.11 A/D Inputs [Monitor Microcontroller]

Seven of the eight available inputs are used for

monitoring system signals. A failure with any one

of the inputs will be displayed as an error code.

HV_MON: High Voltage Power Supply Monitoring

This A/D input is 200mV±40mV when the

system is in the idle mode. The resolution is

20mV/V or 20mV for every volt on the +DC

& -DC terminals of the High Voltage power

supply. Calibrated for 1V with 50V on the

High Voltage Power Supply.

IMEA: Current Measure

A ratio of the output current that is applied to

the patient when Cut, Blend, Pinpoint or

Bipolar modes are used. Used in conjunction

with the HV_MON to determine the output

power.

F_MON: Flow Monitor

The current through the flow control valve rep-

resents the flow rate. A flow rate that exceeds

requested flow by more than 2 SLPM will

set an alarm and inhibit both RF Output and

argon flow. This signal is calibrated for 2V

with a flow setting of 4 SLPM.

PW_MEA: Pulse Width Measure

Spray and ABC™ modes only. A DC average of

the RF Drive pulse width to the single ended

amplifier. In ABC™, the voltage increases as

the power increases if a load is connected to

the ABC™ output. In Spray, the voltage is

constant for all dial settings.

FB_MON: Full Bridge Monitoring

Cut, Blend, Pinpoint and Bipolar modes only.

A DC average of the full bridge RF Drive.

With Cut activated, FB_MON is approxi-

mately 2.85V and for each blend, the voltage

is about 225mV less than the previous blend

or cut mode.

10V Reference:

The 10V reference is monitored and must be

4.46V±.2V.

15V Supply:

The system 15V for control circuits is moni-

tored. This voltage is used for op amps,

relays and flow control valves. This voltage

must be 3.72V±.5V.

6.2.12 EEPROM & Driver [U37, U27]

The EEPROM (U37) is used to store user set-

tings and these settings are recalled when the unit

is first powered on or if a 5 second brown out

occurs. On power-up, power settings will be the

last settings for the default modes. Included in

the EEPROM are the calibration limits for ABC™

and SPRAY PW_MEA settings. A failure detected

with the EEPROM during system initialization

will default all power settings to “0”. A failure

detected with the PW_MEA stored data will

inhibit the system from being used until the prob-

lem is corrected.

U27 is a parallel-to-serial interface device.

The EEPROM is loaded serially, however the

PCF8584 allows the control microcontroller to

load the serial data from the parallel data bus.

6.2.13 D/A Converter [U12]

The D/A converter is used to control the follow-

ing:

•High Voltage (VCON)

•Output Power (PCON)

•Maximum voltage at each dial setting (ILIM)

for Cut, Blend, Pinpoint, & Bipolar Modes

•Argon Flow Rate (VGAS).

Each of these signals should be zero volts in the

idle mode and increase as the power or flow

increases. The voltages listed below are the maxi-

mum limits at full power settings.

Indice

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