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1. Disassembly Procedures

S1

Turn off the monitor.

S2

To remove the stand

Place the monitor on a soft cloth or

cushion at the edge of the desk.

Press and hold the stand release button

at the back of the display.

Lift the stand assembly up and away

from the monitor.

S3

Unlock 4 RC screws

isassemble Rear Cover from Middle

Frame according to the sequence

shown in the picture

(Screw Torque: 9±1kgf)

S4

Pull out CTRL FFC from I/F B to take

off Rear Cover

S5

Tear off 1 tape from CTRL B FFC on

Rear Cover

Unlock 3 screws to disassemble CTRL

B from Rear Cover

(Screw Torque: 1.4±0.1kgf)

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S6

Pull out USB FFC from USB B and I/F

B

Unlock 1 screw on USB B

isassemble USB B from Middle

Frame

(Screw Torque: 4.5±0.5kgf)

S7

Tear off adhesive tape on Backlight

Wire

Tear off adhesive tape on LV S Cable

(Note: Only for LG panel)

Tear off two tapes to disassemble Main

SH from panel

S8

Pull out Backlight Wire from SPS B

S9

Pull out LV S cable and take off Main

SH from panel

S1

Unlock 9 screws on Middle Frame

Unlock 2 screws on Bezel Chin

(Screw Torque-MF: 3.5~~4.0kgf)

(Screw Torque-BZL Chin: 2.0±0.1kgf)

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S11

isassemble Middle Frame and Bezel

Chin from Panel

S12

Pull out Backlight Wire from panel

S13

isassemble Mylar from Main SH

S14

Unlock 5 PCB screws and 2 hex screws

(Screw Torque-PCB: 8.5±1kgf)

(Screw Torque-Hex: 5±0.6kgf)

S15

Take out I/F B and SPS B from Main

SH

S16

Pull out LV S cable and SPS B cable

from I/F B

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S17

Remove electrolyte capacitors (red mark) from printed circuit boards

S17-1 Cut the glue between bulk cap. and PCB with a knife

S17-2 Ensure cutting path within the glue, don’t touch bulk cap. or PCB

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S17-3 Take out bulk cap. pin solder with soldering iron and absorber

S17-4 Lift the bulk cap. up and away from the PCB

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2. Product material information

The following substances, preparations, or components should be disposed of or

recovered separately from other WEEE in compliance with Article 4 of EU Council

Directive 75/442/EEC.

Capacitors / condensers (containing

PCB/PCT)

No used

Mercury containing components

No used

Batteries No used

Printed circuit boards (with a surface greater

than 10 square cm)

Product has printed circuit boards

(with a surface greater than 10 square

cm)

Component contain toner, ink and liquids No used

Plastic containing BFR

No used

Component and waste contain asbestos

No used

CRT No used

Component contain CFC, HCFC, HFC and

HC

No used

Gas discharge lamps

No used

LCD display > 100 cm2 Product has an LCD greater than 100

cm2

External electric cable Product has external cables

Component contain refractory ceramic fibers

No used

Component contain radio

-

active substances

No used

Electrolyte capacitors (height

> 25mm, diameter > 25mm)

Product has electrolyte capacitors

(height >25mm, diameter > 25mm)

3. Tools Required

List the type and size of the tools that would typically can be used to disassemble the

product to a point where components and materials requiring selective treatment can be

removed.

Tool Description:

- Screwdriver

- Scraper Bar

- Penknife

- Soldering iron and absorber