Document: DS-M8--OPM-1.0M Page 3of 19 ©DESAY INTELLIGENT CO. LTD.
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TABLE OF CONTENTS
1General………………….………………....................………………….………………………………......…………….. 4
1.1 M8 LED panel specification …….…………………………………………....….............………………............. 5
2Main Assemblies………………….……….....................………..…………………………………………………...... 6
2.1 Main Composition of display unit …………………………..................……...……………………..........…... 6
2.1.1 Component placement ……………….....................……………….……………………………………......……... 6
2.2 Intelligent modules (IM)………………….........................…………….……………………………………..……... 7
2.3 Hanging Stacker (HB) ………………………………………… ..............…………………...…………………..…... 8
2.4 Stacker &Base……………………….……………………………...…………………............................………….……9
2.4.1 Base ……………………………………………………………..………………............................………………..…….…. 9
2.4.2 Stacker ……………………………………………………………………………..................……………………...….… 10
2.5 Truss ……………………………………………………….....................…………………………………................…... 10
3Installation Guides…………………………………………………………………....................…………..…….…. 11
3.1 Mechanical……………………………………………………………………………………......................……..…...... 11
3.1.1 Rigging/Hanging Installation ……………………………………........……………………………..………….. 12
3.1.2 Stacking Installation ………………………………………………….....……………………………................…….13
3.2 Electrical……………………………………………………..........................……………………………………..……….14
3.2.1 Circuit protection………………………………………………....................………………………………..……....... 14
3.2.2 Earth leakage considerations……………………….............…………………………………………..………….. 14
3.2.3 Inrush-current and over-current considerations……………..…………………………………………..... 14
3.2.4 Earthing………………………………………………………………........................……………………..….………...... 14
3.2.5 MC statement………………………………………………........................…………………………………………….15
3.3 Power Cabling Wiring………………………………………………...............……………………..…….……....…15
3.3.1 AC Power…………………………………………………….........................……………………………………….….... 15
Appendix A : M8 Mechanical Assembly &Wiring Diagram.......................................................... 16
Appendix BProcedure for IM, Power supply& receiving cards Replacement.......................... 17
Appendix CTrouble shooting ………………...……….……………………........................................... 19
