Ebyte E73-2GM08S1C Manuale utente

E73-2G4M08S1C User Manual

nRF52840 2.4GHz SMD Wireless Module

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M08S1C User Manual

Contents

1 Product overview................................................................................................................................................................. 2

1.1 Brief Introduction..................................................................................................................................................... 2

1.2 Features.....................................................................................................................................................................2

1.3 Application................................................................................................................................................................2

2 Specification and parameter................................................................................................................................................ 3

2.1 Limit parameter........................................................................................................................................................ 3

2.2 Operating parameter................................................................................................................................................. 3

3 Size and pin definition......................................................................................................................................................... 5

4 Development and Application............................................................................................................................................. 7

5 Basic operation.................................................................................................................................................................... 8

5.1 Hardware design....................................................................................................................................................... 8

6 FAQ......................................................................................................................................................................................9

6.1 Communication range is too short............................................................................................................................9

6.2Module is easy to damage..........................................................................................................................................9

6.3 BER(Bit Error Rate) is high................................................................................................................................... 10

7 Production guidance.......................................................................................................................................................... 10

7.1 Reflow soldering temperature................................................................................................................................ 10

7.2 Reflow soldering curve...........................................................................................................................................11

8 E73 series...........................................................................................................................................................................11

9 Antenna recommendation.................................................................................................................................................. 12

9.1 Recommendation.................................................................................................................................................... 12

Revision history....................................................................................................................................................................12

About us................................................................................................................................................................................12

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M08S1C User Manual

1 Product overview

1.1 Brief Introduction

E73-2G4M08S1C are wireless Bluetooth modules designed by

Chengdu Ebyte which feature small size, low power consumption. It

adopt the originally imported RFIC nRF52840 of NORDIC,

supporting BLE 4.2 and BLE 5.0. The chip has high-performance

ARM CORTEX-M4F kernel and other peripheral resources, such as

UART, I2C, SPI, ADC, DMA, PWM etc. The module led out most

IO Port of nRF52840 for multilateral development.Please see the pin definition for details.

E73-2G4M08S1C is hardware platform without firmware, so users need to conduct a secondary development.The

characteristics of the nRF52840 chip can be found in the official Datasheet.

1.2 Features

Small size: 13x18mm;

Support BLE4.2 and BLE 5.0;

The measured communication distance is up to 120m;

Maximum transmission power of 6mW, software multi-level adjustable;

Support the global license-free ISM 2.4GHz band;

Built-in high performance low power ARM® and Cortex ® -M4 dual core processor;

Rich resources, 1024KB FLASH, 256KB RAM;

Support 1.7V~5.5Vpower supply, power supply over 3.3Vcan guarantee the best performance;

Industrial grade standard design, support -40 ~ 85 °C for working over a long time;

Built-in ceramic antenna, no antenna is required for the built-in antenna.

1.3 Application

Smart homes and industrial sensors；

Security system, positioning system；

Wireless remote control, drone；

Wireless game remote control；

Health care products；

Wireless voice, wireless headset；

Automotive industry applications.

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M08S1C User Manual

2 Specification and parameter

2.1 Limit parameter

Main parameter

Performance

Remark

Min

Max

Power supply （V）

5.5

Voltage over 5.5V will cause permanent

damage to module

Blocking power（dBm）

Chances of burn is slim when modules

are used in short distance

Operating temperature（℃）

-40

2.2 Operating parameter

Main parameter

Performance

Remark

Min

Type

Max

Operating voltage（V）

1.7

3.3

5.5

≥3.3 V ensures output power

Communication level （V）

3.3

For 5V TTL, it may be at risk of

burning down

Operating temperature （℃）

-40

Industrial grade

Operating frequency（GHz）

2360

2500

Support ISM band

Transmitting current

TX only run current

(DC/DC, 3 V) PRF =

+8 dBm

17.05

TX only run current

(DC/DC, 3 V) PRF =

+4 dBm

12.68

TX only run current

(DC/DC, 5 V, REG0

out = 3.3 V)PRF =

0dBm

7.25

TX only run current

(DC/DC, 3 V)P RF =

0 dBm

7.63

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M08S1C User Manual

TX only run current

(DC/DC, 3 V) PRF =

+8 dBm

17.05

Receiving current

RX only run current

(DC/DC, 3 V) 1

Mbps / 1 Mbps BLE

7.71

RX only run current

(DC/DC, 3 V) 2

Mbps / 2 Mbps BLE

8.27

Transmitting power

dBm

Receiving sensitivity

-103 dBm@BLE 125kbps(long distance mode), -95 dBm@BLE 1M

Main parameter

Description

Remark

Reference distance

120m

Clear and open area, antenna gain: 5dBi, antenna height:

2.5m，air data rate: 1Mbps

Crystal Oscillator

32MHz

Protocol

BLE 4.2/5.0

Package

SMD

Interface

1.27mm

Stamp hole/Ceramic antenna

nRF52840-QIAAC0/ aQFN ™ 73

FLASH

1024KB

RAM

256KB

Core

ARM® Cortex ® -M4

Size

13.0 * 18.0 mm

Antenna

ceramic antenna

50 ohm impedance

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M08S1C User Manual

3 Size and pin definition

No.

Pin item

Corresponding

chip pin item

Pin direction

Application

P1.11

Common I/O

See details about nrf52840 datasheet on Nordic

website

P1.10

Common I/O

Low frequency I/O, standard drive

P0.03

P0.03/AIN1

Common I/O

Analog input 1, low frequency I/O, standard

drive

AI4

P0.28/AIN4

Common I/O

Analog input 4

GND

Single ground line ，connect to the power

reference ground

P1.13

Common I/O

Low frequency I/O, standard drive

AI0

P0.02/AIN0

Common I/O

Analog input 0, low frequency I/O, standard

drive

AI5

P0.29/AIN5

Common I/O

Analog input 5, low frequency I/O, standard

drive

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M08S1C User Manual

AI7

P0.31/AIN7

Common I/O

Analog input 7, low frequency I/O, standard

drive

AI6

P0.30/AIN6

Common I/O

Analog input 6, low frequency I/O, standard

drive

XL1

P0.00/XL1

Common I/O

Connect to 32.768 kHz crystal

P0.26

Common I/O

See details about nrf52840 datasheet on Nordic

website

XL2

P0.01/XL2

Common I/O

Connect to 32.768 kHz crystal

P0.06

Common I/O

See details about nrf52840 datasheet on Nordic

website

AI3

P0.05/AIN3

Common I/O

Analog input 3

P0.08

Common I/O

See details about nrf52840 datasheet on Nordic

website

P1.09

Common I/O

See details about nrf52840 datasheet on Nordic

website

AI2

P0.04/AIN2

Common I/O

Analog input 2

VDD

Power supply

P12

P0.12

Common I/O

See details about nrf52840 datasheet on Nordic

website

GND

ground line ，connect to the power reference

ground

P0.07

Common I/O

See details about nrf52840 datasheet on Nordic

website

VDH

VDDH

High-voltage power supply

GND

ground line ，connect to the power reference

ground

DCH

DCCH

DC/DC Converter output

RST

P0.18/RESET

Common I/O

QSPI/CSN/external reset

VBS

VBUS

USB power supply ，5V input ，used to

USB3.3V voltage regulator

P15

P0.15

Common I/O

See details about nrf52840 datasheet on Nordic

website

D-

USB D-

P17

P0.17

Common I/O

See details about nrf52840 datasheet on Nordic

website

D+

USB D+

P0.20

Common I/O

See details about nrf52840 datasheet on Nordic

website

P0.13

Common I/O

See details about nrf52840 datasheet on Nordic

website

P0.22

Common I/O

QSPI

P0.24

Common I/O

QSPI

P1.00

Common I/O

See details about nrf52840 datasheet on Nordic

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M08S1C User Manual

website

SWD

SWDIO

Serial debug programming port data

P1.02

Common I/O

See details about nrf52840 datasheet on Nordic

website

SWC

SWDCLK

Serial debug programming port clock

P1.04

Common I/O

Low frequency I/O, standard drive

NF1

P0.09/NFC1

Common I/O

NFC input

P1.06

Common I/O

Low frequency I/O, standard drive

NF2

P0.10/NFC2

Common I/O

NFC input

4 Development and Application

No.

Item

Notes

Burn

Firmware

1.The module is embedded with ARM MCU. For program downloading, please use the J-LINK downloader.

Any other serial port or JTAG、ISP、ICP are unavailable to download.

1.The burn firmware needs to be completed in two parts. Since the protocol stack provided by NORDIC is not

loaded in the program, in the second development, you need to use the official burning tool nRFgo studio to

burn the protocol stack, and then use nRFgo studio to burn. The hex of the application code; you can also use

the official burning tool nRFgo studio to burn the protocol stack, and then download it with IAR or KEIL.

Website of tool download:

http://www.nordicsemi.com/eng/Products/Bluetooth-low-energy/nRF52832/(language)/eng-GB

Testing

Board

Testing board is not available.

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M08S1C User Manual

5 Basic operation

5.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and

the module needs to be reliably grounded.

Please pay attention to the correct connection of the positive and negative poles of the power supply, reverse

connection may cause permanent damage to the module.

Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,

the module will be permanently damaged;

Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the

margin, so the whole machine is beneficial for long-term stable operation;

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other

parts with large electromagnetic interference;

Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided

under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer,

and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital

part of the module and routed in the Bottom Layer;

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M08S1C User Manual

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer

or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;

It is assumed that there are devices with large electromagnetic interference around the module that will greatly

affect the performance. It is recommended to keep them away from the module according to the strength of the

interference. If necessary, appropriate isolation and shielding can be done;

Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,

power traces) around the module that will greatly affect the performance of the module. It is recommended to stay

away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding

can be done;

If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is

still a risk of damage);

Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;

The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure

that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good

antenna extension cable to extend the antenna to the outside;

The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly

weakened.

6 FAQ

6.1 Communication range is too short

The communication distance will be affected when obstacle exists;

Data lose rate will be affected by temperature, humidity and co-channel interference;

The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;

Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;

The signal will be affected when the antenna is near metal object or put in a metal case;

Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the

distance);

The power supply low voltage under room temperature is lower than recommended value, the lower the voltage, the

lower the transmitting power;

Due to antenna quality or poor matching between antenna and module.

6.2 Module is easy to damage

Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will

lead to a permanent damage to the module.

Please check the stability of power supply and ensure the voltage not to fluctuate too much.

Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic

susceptibility.

Please ensure the humidity is within limited range for some parts are sensitive to humidity.

Please avoid using modules under too high or too low temperature.

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