EMTRION EmSTAMP-Argon Manuale utente

Hardware Manual: emSTAMP- emSBC-Argon (Rev1)

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emSTAMP-Argon

emSBC-Argon

Hardware Manual

including the emSTAMP-Argon processor module

and the emSBC-Argon development board

Rev1 / 30.09.2019

emtrion GmbH

Hardware Manual: emSTAMP- emSBC-Argon (Rev1)

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media without written approval. The information contained in this documentation is subject to

change without prior notice. We assume no liability for erroneous information or its consequences.

Trademarks used from other companies refer exclusively to the products of those companies.

Revision: 1 / 30.09.2019

Rev

Date/Signature

Changes

25.07.2019/We

Preliminary revision

30.09.2019/We

First revision including the emSBC-Argon

Hardware Manual: emSTAMP- emSBC-Argon (Rev1)

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Table of Content

1Introduction................................................................................................................................................................5

2Overview of the emSBC-Argon with embedded emSTAMP-Argon.......................................................5

3Handling Precautions..............................................................................................................................................6

4Functional Overview of the CPU module (emSTAMP-Argon)..................................................................6

5Functional description of the CPU module (emSTAMP-Argon) ..............................................................7

5.1 Processor.............................................................................................................................................................7

5.1.1 Processor Clocks.....................................................................................................................................8

5.1.2 Boot Configuration................................................................................................................................9

5.2 DDR3L SDRAM ..................................................................................................................................................9

5.3 QSPI-NOR Flash.................................................................................................................................................9

5.4 eMMC –NAND Flash interface................................................................................................................. 10

5.5 Ethernet............................................................................................................................................................ 10

5.6 USB 2.0.............................................................................................................................................................. 11

5.6.1 USB 2.0 Host.......................................................................................................................................... 11

5.6.2 USB 2.0 OTG........................................................................................................................................... 11

5.7 Display controller.......................................................................................................................................... 12

5.7.1 Display Serial Interface (DSI)............................................................................................................ 12

5.7.2 LCD-TFT display controller (LTDC) ................................................................................................ 13

5.8 FD-CAN ............................................................................................................................................................. 14

5.9 SD card interface........................................................................................................................................... 14

5.10 UART/USARTs................................................................................................................................................. 14

5.11 I2C Interface..................................................................................................................................................... 15

5.12 SPI Interface .................................................................................................................................................... 15

5.13 Serial Audio Interface (SAI)........................................................................................................................ 15

5.14 ADC and DAC ................................................................................................................................................. 16

5.14.1 Analog to Digital Converter (ADC)................................................................................................ 16

5.14.2 Digital to Analog Converter (DAC)................................................................................................ 16

5.15 GPIOs................................................................................................................................................................. 16

5.16 JTAG Debug.................................................................................................................................................... 17

5.17 Status LEDs...................................................................................................................................................... 17

5.18 User Power-On Key (PONKEY#)................................................................................................................ 17

5.19 Reset .................................................................................................................................................................. 18

5.20 Castellation Connector ............................................................................................................................... 19

5.21 Power Supply ................................................................................................................................................. 23

5.21.1 VIN Supply ............................................................................................................................................... 23

5.21.2 VBAT Supply.......................................................................................................................................... 23

5.21.3 +3V3 Supply.......................................................................................................................................... 23

5.21.4 VDD_SD .................................................................................................................................................. 23

5.21.5 USBH_VBUS........................................................................................................................................... 23

5.21.6 USB_OTG_VBUS................................................................................................................................... 23

6Functional Description of the Single-Board-Computer (emSBC-Argon)........................................... 24

6.1 eMMC NAND-Flash....................................................................................................................................... 24

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6.2 microSD-Card socket................................................................................................................................... 25

6.2.1 Pinout of microSD-Card connector J6 ......................................................................................... 25

6.3 Ethernet Connector...................................................................................................................................... 26

6.3.1 Pinout ethernet connector J9......................................................................................................... 26

6.4 DSI-LCD............................................................................................................................................................. 26

6.4.1 Usage of LCD-Board MB1407.......................................................................................................... 26

6.4.2 Usage of LCD-Board B-LCD40-DSI1 .............................................................................................. 26

6.4.3 Pinout of DSI-Connector J3 ............................................................................................................. 27

6.5 USB 2.0 HOST.................................................................................................................................................. 28

6.5.1 Connector USB 2.0 Host J12............................................................................................................ 28

6.6 USB 2.0 OTG .................................................................................................................................................... 28

6.6.1 Pinout USB-OTG Connector J1 ....................................................................................................... 28

6.7 RPi Connector................................................................................................................................................. 29

6.8 FD-CAN Connector....................................................................................................................................... 30

6.9 UART connector ............................................................................................................................................ 30

6.10 Reset & Wake-up Buttons........................................................................................................................... 30

6.10.1 Reset Button S2.................................................................................................................................... 30

6.10.2 Wake-up Button S1............................................................................................................................. 31

6.11 Boot configuration DIP-Switch ................................................................................................................ 31

6.12 Battery holder................................................................................................................................................. 31

6.13 Board ID............................................................................................................................................................ 32

6.14 Power Supply ................................................................................................................................................. 32

7Technical Characteristics .................................................................................................................................... 33

7.1 Electrical Specifications .............................................................................................................................. 33

7.2 Environmental Specifications................................................................................................................... 33

7.3 Mechanical Specifications ......................................................................................................................... 33

7.4 Dimensional Drawing.................................................................................................................................. 34

7.4.1 emSTAMP-Argon (CPU module).................................................................................................... 34

7.4.2 emSBC-Argon (Single Board Computer)..................................................................................... 35

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1Introduction

The emSTAMP-Argon processor module is a CPU board of emtrions emSTAMP-family, based on the

STM32MP157 processor from STMicroelectronics. The STM32MP157 has an ARM Cortex-A7 dual-

core and an ARM Cortex-M4.

The dual-core Cortex-A7 may be clocked up to 650MHz and includes a variety of functions required

for IOT, industrial or multimedia applications.

The CPU board is designed as a compact module with castellated mounting holes with 1.0mm

pitch that can be soldered directly on a baseboard. As an extension the CPU board has additional

solder pads on its bottom side which can be used if RGB- or JTAG-Interface are needed.

The emSBC-Argon development board is a SBC which is build around the CPU module. It provides

direct access to a set of the modules interfaces. It is targeted to quickly start into product

development.

The functionalities of the emSTAMP-Argon CPU board as well as the emSBC-Argon development

board are both documented in this manual.

2Overview of the emSBC-Argon with embedded emSTAMP-Argon

Hardware Manual: emSTAMP- emSBC-Argon (Rev1)

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3Handling Precautions

Please read the following notes prior to installing the processor module. They apply to all ESD

(electrostatic discharge) sensitive components:

The module does not need any configurations before installing

The CPU module does not provide any on-board ESD protection circuitry –this must be

provided by the product it is used in.

Be sure all tools required for installation are electrostatic discharged as well.

Handle the board with care and try to avoid touching its components or tracks.

4Functional Overview of the CPU module (emSTAMP-Argon)

Block Diagram of the available Interfaces of the CPU module

Hardware Manual: emSTAMP- emSBC-Argon (Rev1)

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5Functional description of the CPU module (emSTAMP-Argon)

5.1 Processor

The emSTAMP-Argon CPU module uses the STM32MP157CAC processor from STMicroelectronics.

The processor includes the ARM Cortex-A7 dual-cores (runs up to 650 MHz) and an ARM Cortex-M4

(runs up to 200 MHz). In addition to the CPU core, this processor provides a lot of features such as:

Secure Boot, TrustZone, DES/TDES/AES cryptographic acceleration, Secure ROM and RAM

NAND Flash controller (eMMC, SLC NAND-Flash)

DDR3(L) SDRAM controller

3D GPU (OpenGL ES 2.0) with 133Mpix/sec @533MHz

Ethernet MAC with 10/100 Mbit/s or 1Gbit/s

2 x USB 2.0 Host with high-speed mode

USB 2.0 OTG with high-speed mode

3x SDMMC/SDIO controller

LCD-TFT up to 24bpp and 1366x768 (WXGA) @60Hz

24 bit RGB interface TFT displays

MIPI DSI with 2 data lanes each up to 1GHz

8- to 14-bit parallel camera interface

2x FDCAN controller

serial interfaces:

o6 x I²C

o6 x SPI

o8 x U(S)ART

o4 x SAI (stereo audio)

Up to 29 Timer for encoder input, PWM output

2 x ADC (up to 16-bit resolution, up to 5Msps)

2 x DAC with 12-bit resolution and 1 MHz

JTAG debug interface

Real time clock

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5.1.1 Processor Clocks

The processors high-speed external clock signal (HSE) is generated by an external 24MHz oscillator,

which is connected to the HSE_OSC_IN pin. Several internal dividers and PLLs multiply the 24 MHz

HSE input clock to the internal clocks. The SysClock is set to its maximum speed of 650 MHz.

A 32.768 KHz crystal is connected to the Low Speed External oscillator (LSE) of the processor. Its

main application is to generate the clock for the processors RTC. The emSTAMP-Argon module has

a dedicated pin for battery supply of the RTC block if the main power supply of the STM32MP157 is

turned off.

The STM32MP157 has two pins for “Microcontroller Clock Output”(MCO1 and MCO2) which are

connected to the castellated mounting holes. Each MCO has its own MUX and prescaler to select

the clock source of the MCO1 and MCO2 (see picture below).

Pinout of MCO1 and MCO2 on the emSTAMP-Argon module:

Module Pin

CPU Pin Name

Signal

Direction

(module view )

Termination

PG2

RCC_MCO_2

PI11

RCC_MCO_1

More information about the STM32P157 clock system is described in the chapter 10 “Reset and

Clock Control (RCC)” of the Reference manual from STMicroelectronics.

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5.1.2 Boot Configuration

The STM32MP157 offers different boot modes which are selected by the three CPU pins BOOT[2:0].

The different boot modes which are available on the emSTAMP-Argon are shown in the table

below:

BOOT2

BOOT1

BOOT0

Initial boot mode

UART and USB

QUADSPI NOR-Flash

eMMC on SDMMC2 (only fitted on SBC)

SD-Card on SDMMC1

UART and USB

On the emSTAMP-Argon module the three boot configuration pins BOOT[2:0] are connected to 1k

pull-up resistor. The boot pins BOOT[2..0] are connected to the castellated mounting holes of the

module. The desired boot mode has to be set by appropriate setting of these three boot pins on

the carrier board.

Module Pin

CPU Pin Name

Signal

Direction

(module view )

Termination

BOOT0

PU 1K

BOOT1

PU 1K

BOOT2

PU 1K

Note: The emSBC-Argon provides a DIP-switch to set the different boot modes. Please refer to

chapter 6.11 “Boot configuration DIP-Switch” for details how to set the boot mode on the emSBC-

Argon by the DIP-switch.

5.2 DDR3L SDRAM

The emSTAMP-Argon CPU module provides up to 512MiB DDR3L SDRAM as main memory. The

RAM is connected via a 16 bit width data bus und may be clocked up to 533MHz.

5.3 QSPI-NOR Flash

A 16-Mibit QSPI-NOR flash memory (IS25LP016D form ISSI) is integrated on the CPU module. It is

used to hold the initial Bootloader that provides the basic boot functionality of the module. The

flash is connected to the QUAD-SPI bank1 with Quad-SPI-lines.

Module Pin

CPU Pin Name

Signal

PF8

QUADSPI_BK1_IO0

PF9

QUADSPI_BK1_IO1

PF7

QUADSPI_BK1_IO2

PF6

QUADSPI_BK1_IO3

PB6

QUADSPI_BK1_CS#

PF10

QUADSPI_CLK

Internal connection of QSPI-NOR-flash on the CPU-module

Hardware Manual: emSTAMP- emSBC-Argon (Rev1)

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5.4 eMMC –NAND Flash interface

To store the operation system and application data, the CPU-module provides an eMMC-interface

to connect a NAND-Flash to the emSTAMP-Argon. It is connected to the 8-bit SDMMC2 interface of

the STM32MP157 and can be used a boot device.

Module Pin

CPU Pin Name

Signal

Direction

(module view )

Termination

PE3

SDMMC2_CK

SR 22R

PG6

SDMMC2_CMD

101

PB14

SDMMC2_D0

I/O

102

PB15

SDMMC2_D1

I/O

103

PB3

SDMMC2_D2

I/O

104

PB4

SDMMC2_D3

I/O

105

PA8

SDMMC2_D4

I/O

106

PA9

SDMMC2_D5

I/O

107

PE5

SDMMC2_D6

I/O

108

PC7

SDMMC2_D7

I/O

PF14

EMMC_RST#

The NAND Flash size can be between 4GB and 32GB depending on the ordering code.

Please contact emtrion GmbH for your required NAND Flash size.

5.5 Ethernet

The emSTAMP-Argon module provides an Ethernet interface with up to 100BASE-TX full duplex.

The Ethernet MAC interface of the STM32MP157 CPU is connected in RMII mode to the external

PHY LAN8720A from Microchip. The PHY address is set to 0.

A 25MHz clock is generated by the STM32MP157 on its ETH Clock Output (available at PB5) and

connected to the XTAL1/CLKIN of the PHY.

The reset input nRST of the PHY is controlled via the PA1 of the STM32MP157. An external 10k pull-

down resistor is connected to this signal to hold the PHY in reset during start-up of the CPU.

Module Pin

CPU Pin Name

Signal

PC1

ETH1_MDC

PA2

ETH1_MDIO

PA7

ETH1_CRS_DV

PC4

ETH1_RXD0

PC5

ETH1_RXD1

PB11

ETH1_TX_EN

PG13

ETH1_TXD0

PG14

ETH1_TXD1

PB5

ETH1_CLK

PA1

ETH1_RESET#

Internal connection of Ethernet-MAC interface on the CPU-module

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