Espressif Systems ESP32-S2-WROOM Manuale utente

ESP32-S2-WROOM &

ESP32-S2-WROOM-I

User Manual

Prerelease version 0.5

Espressif Systems

www.espressif.com

About This Document

This document provides the specifications for the ESP32-S2-WROOM and ESP32-S2-WROOM-I module.

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Disclaimer and Copyright Notice

Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS

PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABIL-

ITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE

ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.

All liability, including liability for infringement of any proprietary rights, relating to use of information in this docu-

ment is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights

are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a

registered trademark of Bluetooth SIG.

All trade names, trademarks and registered trademarks mentioned in this document are property of their respective

owners, and are hereby acknowledged.

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ESP32-S2-WROOM & ESP32-S2-WROOM-I User Manual V0.5

1. Module Overview

1.1 Features

MCU

• ESP32-S2 embedded, Xtensa®single-core 32-bit

LX7 microprocessor, up to 240 MHz

• 128 KB ROM

• 320 KB SRAM

• 16 KB SRAM in RTC

Wi-Fi

• 802.11 b/g/n

• Bit rate: 802.11n up to 150 Mbps

• A-MPDU and A-MSDU aggregation

• 0.4 µs guard interval support

•Center frequency range of operating channel:

2412 ~ 2462 MHz

Hardware

• Interfaces: GPIO, SPI, LCD, UART, I2C, I2S, Cam-

era interface, IR, pulse counter, LED PWM, USB

OTG 1.1, ADC, DAC, touch sensor, temperature

sensor

• 40 MHz crystal oscillator

• 4 MB SPI flash

• Operating voltage/Power supply: 3.0 ~3.6 V

• Operating temperature range: –40 ~85 °C

• Dimensions: (18 × 31 × 3.3) mm

Certification

• Green certification: RoHS/REACH

• RF certification: FCC/CE-RED/SRRC

Test

• HTOL/HTSL/uHAST/TCT/ESD

1.2 Description

ESP32-S2-WROOM and ESP32-S2-WROOM-I are two powerful, generic Wi-Fi MCU modules that have a rich set

of peripherals. They are an ideal choice for a wide variety of application scenarios relating to Internet of Things

(IoT), wearable electronics and smart home.

ESP32-S2-WROOM comes with a PCB antenna, and ESP32-S2-WROOM-I with an IPEX antenna. They both

feature a 4 MB external SPI flash. The information in this datasheet is applicable to both modules.

The ordering information of the two modules is listed as follows:

Table 1: Ordering Information

Module Chip embedded Flash Module dimensions (mm)

ESP32-S2-WROOM (PCB) ESP32-S2 4 MB (18.00±0.15)×(31.00±0.15)×(3.30±0.15)

ESP32-S2-WROOM-I (IPEX)

Notes:

1. The module with various capacities of flash is available for custom order.

2. For dimensions of the IPEX connector, please see Section 7.3.

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1. Module Overview

At the core of this module is ESP32-S2 *, an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. The

chip has a low-power co-processor that can be used instead of the CPU to save power while performing tasks

that do not require much computing power, such as monitoring of peripherals. ESP32-S2 integrates a rich set

of peripherals, ranging from SPI, I²S, UART, I²C, LED PWM, LCD, Camera interface, ADC, DAC, touch sensor,

temperature sensor, as well as up to 43 GPIOs. It also includes a full-speed USB On-The-Go (OTG) interface to

enable USB communication.

Note:

* For more information on ESP32-S2, please refer to ESP32-S2 Datasheet.

1.3 Applications

• Generic Low-power IoT Sensor Hub

• Generic Low-power IoT Data Loggers

• Cameras for Video Streaming

• Over-the-top (OTT) Devices

• USB Devices

• Speech Recognition

• Image Recognition

• Mesh Network

• Home Automation

• Smart Home Control Panel

• Smart Building

• Industrial Automation

• Smart Agriculture

• Audio Applications

• Health Care Applications

• Wi-Fi-enabled Toys

• Wearable Electronics

• Retail & Catering Applications

• Smart POS Machines

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2. Pin Definitions

2.1 Pin Layout

PCB Antenna

GND

IO46

IO45

RXD0

TXD0

IO42

IO41

IO40

IO39

IO38

IO37

IO36

IO35

IO34

IO33

GND

3V3

IO0

IO1

IO2

IO3

IO4

IO5

IO6

IO7

IO8

IO9

IO10

IO11

IO12

IO13

43 GND

IO14

IO15

IO16

IO17

IO18

IO19

IO20

IO21

IO26

26 GND

Figure 1: Module Pin Layout (Top View)

Note:

The pin diagram shows the approximate location of pins on the module. For the actual mechanical diagram, please refer

to Figure 7.1 Physical Dimensions.

2.2 Pin Description

The module has 42 pins. See pin definitions in Table 2.

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2. Pin Definitions

Table 2: Pin Definitions

Name No. Type Function

GND 1 P Ground

3V3 2 P Power supply

IO0 3 I/O/T RTC_GPIO0, GPIO0

IO1 4 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0

IO2 5 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1

IO3 6 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2

IO4 7 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3

IO5 8 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4

IO6 9 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5

IO7 10 I/O/T RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6

IO8 11 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7

IO9 12 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD

IO10 13 I/O/T RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4

IO11 14 I/O/T RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5

IO12 15 I/O/T RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6

IO13 16 I/O/T RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7

IO14 17 I/O/T RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS

IO15 18 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P

IO16 19 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N

IO17 20 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6, DAC_1

IO18 21 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3

IO19 22 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-

IO20 23 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+

IO21 24 I/O/T RTC_GPIO21, GPIO21

IO26 25 I/O/T SPICS1, GPIO26

GND 26 P Ground

IO33 27 I/O/T SPIIO4, GPIO33, FSPIHD

IO34 28 I/O/T SPIIO5, GPIO34, FSPICS0

IO35 29 I/O/T SPIIO6, GPIO35, FSPID

IO36 30 I/O/T SPIIO7, GPIO36, FSPICLK

IO37 31 I/O/T SPIDQS, GPIO37, FSPIQ

IO38 32 I/O/T GPIO38, FSPIWP

IO39 33 I/O/T MTCK, GPIO39, CLK_OUT3

IO40 34 I/O/T MTDO, GPIO40, CLK_OUT2

IO41 35 I/O/T MTDI, GPIO41, CLK_OUT1

IO42 36 I/O/T MTMS, GPIO42

TXD0 37 I/O/T U0TXD, GPIO43, CLK_OUT1

RXD0 38 I/O/T U0RXD, GPIO44, CLK_OUT2

IO45 39 I/O/T GPIO45

IO46 40 I GPIO46

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2. Pin Definitions

Name No. Type Function

EN 41 I

High: on, enables the chip.

Low: off, the chip powers off.

Note: Do not leave the EN pin floating.

GND 42 P Ground

Notice:

For peripheral pin configurations, please refer to ESP32-S2 User Manual.

2.3 Strapping Pins

ESP32-S2 has three strapping pins: GPIO0, GPIO45, GPIO46. The pin-pin mapping between ESP32-S2 and the

module is as follows, which can be seen in Chapter 5 Schematics:

• GPIO0 = IO0

• GPIO45 = IO45

• GPIO46 = IO46

Software can read the values of corresponding bits from register ”GPIO_STRAPPING”.

During the chip’s system reset (power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog

reset, and crystal clock glitch detection reset), the latches of the strapping pins sample the voltage level as strapping

bits of ”0” or ”1”, and hold these bits until the chip is powered down or shut down.

IO0, IO45 and IO46 are connected to the internal pull-up/pull-down. If they are unconnected or the connected

external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of these

strapping pins.

To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host

MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-S2.

After reset, the strapping pins work as normal-function pins.

Refer to Table 3for a detailed boot-mode configuration of the strapping pins.

Table 3: Strapping Pins

VDD_SPI Voltage 1

Pin Default 3.3 V 1.8 V

IO45 2Pull-down 0 1

Booting Mode

Pin Default SPI Boot Download Boot

IO0 Pull-up 1 0

IO46 Pull-down Don’t-care 0

Enabling/Disabling ROM Code Print During Booting 3 4

Pin Default Enabled Disabled

IO46 Pull-down See the fourth note See the fourth note

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2.4.Pin Definitions

Note:

1. Firmware can configure register bits to change the settings of ”VDD_SPI Voltage”.

2. Internal pull-up resistor (R1) for IO45 is not populated in the module, as the flash in the module works at 3.3 V by

default (output by VDD_SPI). Please make sure IO45 will not be pulled high when the module is powered up by

external circuit.

3. ROM code can be printed over TXD0 (by default) or DAC_1 (IO17), depending on the eFuse bit.

4. When eFuse UART_PRINT_CONTROL value is:

0, print is normal during boot and not controlled by IO46.

1 and IO46 is 0, print is normal during boot; but if IO46 is 1, print is disabled.

2 and IO46 is 0, print is disabled; but if IO46 is 1, print is normal.

3, print is disabled and not controlled by IO46.

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3. Electrical Characteristics

3.Electrical Characteristics

3.1 Absolute Maximum Ratings

Table 4: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V

TST ORE Storage temperature –40 85 °C

3.2 Recommended Operating Conditions

Table 5: Recommended Operating Conditions

Symbol Parameter Min Typ Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V

IV DD Current delivered by external power supply 0.5 — — A

T Operating temperature –40 — 85 °C

Humidity Humidity condition — 85 — %RH

3.3 DC Characteristics (3.3 V, 25 °C)

Table 6: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter Min Typ Max Unit

CIN Pin capacitance — 2 — pF

VIH High-level input voltage 0.75 × VDD — VDD + 0.3 V

VIL Low-level input voltage –0.3 — 0.25 × VDD V

IIH High-level input current — — 50 nA

IIL Low-level input current — — 50 nA

VOH High-level output voltage 0.8 × VDD — — V

VOL Low-level output voltage — — 0.1 × VDD V

IOH

High-level source current (VDD = 3.3 V, VOH >=

2.64 V, PAD_DRIVER = 3) — 40 — mA

IOL

Low-level sink current (VDD = 3.3 V, VOL =

0.495 V, PAD_DRIVER = 3) — 28 — mA

RP U Pull-up resistor — 45 — kΩ

RP D Pull-down resistor — 45 — kΩ

VIH_nRST Chip reset release voltage 0.75 × VDD — VDD + 0.3 V

VIL_nRST Chip reset voltage –0.3 — 0.25 × VDD V

Note:

VDD is the I/O voltage for a particular power domain of pins.

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4. Electrical Characteristics

4.1 Current Consumption Characteristics

With the use of advanced power-management technologies, the module can switch between different power

modes. For details on different power modes, please refer to Section RTC and Low-Power Management in ESP32-

S2 User Manual.

Table 7: Current Consumption Depending on RF Modes

Work mode Description Average Peak

Active (RF working)

802.11b, 20 MHz, 1 Mbps, @ 22.31dBm 190 mA 310 mA

802.11g, 20 MHz, 54 Mbps, @ 25.00dBm 145 mA 220 mA

802.11n, 20 MHz, MCS7, @ 24.23dBm 135 mA 200 mA

802.11n, 40 MHz, MCS7, @ 22.86 dBm 120 mA 160 mA

RX 802.11b/g/n, 20 MHz 63 mA 63 mA

802.11n, 40 MHz 68 mA 68 mA

Note:

• The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF

port. All transmitters’ measurements are based on a 50% duty cycle.

• The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle.

Table 8: Current Consumption Depending on Work Modes

Work mode Description Current consumption (Typ)

Modem-sleep The CPU is

powered on

240 MHz 22 mA

160 MHz 17 mA

Normal speed: 80 MHz 14 mA

Light-sleep — 550 µA

Deep-sleep

The ULP co-processor is powered on. 220 µA

ULP sensor-monitored pattern 7 µA @1% duty

RTC timer + RTC memory 10 µA

RTC timer only 5 µA

Power off CHIP_PU is set to low level, the chip is powered off. 0.5 µA

Note:

• The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and the cache

idle.

• When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. Therefore, current consump-

tion changes accordingly.

• In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load and

the peripherals used.

• During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I²C are able to

operate.

• The ”ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works periodi-

cally. When touch sensors work with a duty cycle of 1%, the typical current consumption is 7 µA.

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