Forenex FEB600 Manuale utente

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FEB600 User Manual

FEB600-Q/D/U

ARM BOX PC

User Manual

(Preliminary)

Fanless ultra-compact quad core

ARM system ruggedized for

extreme environments

Version: V1.0

Document No: doc-FEB600x-V10

PCB Bare Board: PB630868-V10

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FEB600 User Manual

Packing List

1 x FEB600 device.

1 x Terminal Block to DC Jack.

Ordering Information

Part number : FEB600-xyz-m-n-MN

•xyz : The feature code of Processor

Q10 Fanless ARM system with 1.0GHz NXP i.MX 6Quad Cortex-A9 SoC.

D10 Fanless ARM system with 1.0GHz NXP i.MX 6Dual Cortex-A9 SoC.

U10 Fanless ARM system with 1.0GHz NXP i.MX 6DualLite Cortex-A9 SoC.

• m: The size code of DDR3 Memory on board

1 1GB of DDR3.

2 2GB of DDR3.

• n: The size code of eMMC on board

4 4GB of eMMC.

8 8GB of eMMC.

F 16GB of eMMC.

•MN : The Function Summary code

SS HDMI, 3x USB2.0, Mini USB 2.0 OTG, 1x COM, Micro SD socket, CANbus &

Debug port, GPIO, Gigabit Ethernet, line-out/MIC-in, DC12V-in.

PS HDMI, 3x USB2.0, Mini USB 2.0 OTG, 1x COM, Micro SD socket, CANbus &

Debug port, GPIO, Gigabit Ethernet, line-out/MIC-in, DC12V-in,

PoE (802.3af/ PD mode A/ endspan only )

Optional Accessories

Part Number Description

EP21-B4356C AP12356,802.11 a/b/g/n/ac(2T2R)+BT(V4.1 LE), mPCIe Wifi

module.

WFS001I401nnnO8 SMA(ST. JR)to IPEX(IV) cable, 50Ω, nnn=130/230/400mm.

LN1RF2G20M0 2.4/5Ghz, 2dBi-antenna, SMA(ST. PR), bendable, 110mm.

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FEB600 User Manual

Revision histories

Rev. No.

Date

Substantial Changes

1.0

2018/06

First issue.

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FEB600 User Manual

Table of Contents

1. General Information ........................................................................................................ 6

1-1. Features .............................................................................................................................. 6

1-1-1. ARM based System ............................................................................................................ 6

1-1-2. Ultra compact, Ruggedized and Fanless ............................................................................ 6

1-1-3. The Operating Temperature .............................................................................................. 6

1-1-4. Storage Expansion.............................................................................................................. 7

1-1-5. Networking Option ............................................................................................................ 7

1-1-6. Power over Ethernet option .............................................................................................. 7

1-1-7. Embedded OS ready........................................................................................................... 7

1-2. Product Specifications......................................................................................................... 8

1-3. Outline Dimensions........................................................................................................... 10

1-3-1. Front view ........................................................................................................................ 10

1-3-2. Top view........................................................................................................................... 10

1-3-3. Rear view.......................................................................................................................... 10

1-4. Peripherals Port layout diagram ....................................................................................... 11

1-4-1. Front Panel....................................................................................................................... 11

1-4-2. Rear Panel ........................................................................................................................ 11

2. Peripherals Port Description.......................................................................................... 12

2-1. DC-in Jack .......................................................................................................................... 12

2-2. LEDs Indicator ................................................................................................................... 12

2-3. Micro SD/eMMC boot select switch ................................................................................. 12

2-4. COM1 Port ........................................................................................................................ 13

2-5. Gigabit Ethernet Port ........................................................................................................ 13

2-6. Reset Button ..................................................................................................................... 14

2-7. USB 2.0 Port ...................................................................................................................... 14

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FEB600 User Manual

2-8. Mini USB OTG Port............................................................................................................ 14

2-9. CAN/Debug Port................................................................................................................ 15

2-10. Micro SD/SDHC card Slot .................................................................................................. 15

2-11. DIO port............................................................................................................................. 16

2-12. MIC with Stereo Jack......................................................................................................... 16

2-13. Headphone with Stereo Jack ............................................................................................ 16

2-14. HDMI®-1.4 port ................................................................................................................. 17

3. Software and Technical Supports .................................................................................. 18

3-1. Android Programming Guide ............................................................................................ 18

3-1-1. ADB installation........................................................................................................ 18

3-1-2. GPIO installation....................................................................................................... 20

3-1-3. CANbus installation .................................................................................................. 21

3-1-4. COM port installation and Sample code .................................................................. 22

3-2. Linux Programming Guide................................................................................................. 22

3-2-1. GPIOs installation ..................................................................................................... 22

3-2-2. CANbus installation .................................................................................................. 23

3-2-3. COM port installation and Sample code .................................................................. 24

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FEB600 User Manual

1.General Information

The FORENEX FEB600 BoxPC is an ultra-compact solution designed to take full advantage of

ARM-based ultra-energy-saving and easily create a variety of easy-to-assemble, fanless system

designs for a wide range of industrial automation, transportation, HMI and energy management

applications.

The FEB600 is a completely fanless system. Its rugged design can endure a wide operating

temperature range of -20 °C to 70 °C, and it consumes extremely low power under typical operating

conditions. In addition, an optional miniPCIe slot is provided for 5G / Wi-Fi connection.

Comprehensive I / O functions on the front and rear panels make the FEB600 a flexible solution for a

variety of embedded applications.

The heart of the FEB600 PC box is the i.MX 6Quad/Dual/DualLite processor which provides all of the

interfaces necessary for connecting peripherals such as:

-Networking: RJ45 Gigabit Ethernet port, an optional miniPCIe Wi-Fi(WLAN) connectivity.

-Serial port: Mini USB 2.0 OTG port, USB 2.0 port, COM1/485/422 port, CAN/Debug port.

-Display: HDMI® 1.4 port.

-Audio: Stereo Line-out jack, MIC-in jack.

-Expansion storage & GPIO: Micro SD slot, DIO port.

-Others: Micro SD/eMMC boot select switch, reset button, power LED, Wi-Fi LED.

1-1. Features

1-1-1. ARM based System

ARM based Pico-ITX alike board with an NXP i.MX6 Quad (Dual or DualLite) Cortex-A9 ARM SoC,

offering high performance processing optimized for the lowest power consumption.

1-1-2. Ultra compact, Ruggedized and Fanless

The FEB600 fanless system is a 143mm (W) x 60mm (H) x 74mm (D) ruggedized chassis, which is

suitable to install in a space critical environment to ensure maximum reliability. The chassis design

has a ridged aluminum top cover does also acts as the heatsink of the NXP i.MX6 processor.

1-1-3. The Operating Temperature

This provide a wide range from -20°C up to 70°C, suitable for critical environment applications.

**Note: The Operating Temperature is a result of testing performed in an experimental chamber.

It is highly suggested to execute a solid testing under an actually application environment.

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FEB600 User Manual

1-1-4. Storage Expansion

The Micro SD/SDHC card slot enables the FEB600 to have a flexible storage up to 32GB size.

**Note: More frequent and larger data access on eMMC memory makes its lifespan shorter.

Therefore, it is highly recommended to use a Micro SD card for large data access.

1-1-5. Networking Option

The FEB600 is equipped with RJ-45 port that supports high speed Gigabit Ethernet. An optional

miniPCIe slot is provided for 2.4G/5Ghz,Wi-Fi (WLAN) connectivity. The wireless module (Wi-Fi)

complies with IEEE 802.11a/b/g/n/ac 2x2 MIMO standard.

1-1-6. Power over Ethernet option

Integrated 802.3af, mode A (endspan) only, Powered Device (PD) controller and switching regulator

intended for high power IEEE 802.3at and 802.3af applications. The power over Ethernet (PoE) PD

board can output 15.4W of power. The FEB600 can be operated using either PoE or external

adaptors (12V).

1-1-7. Embedded OS ready

Android 6.0, Linux 4.1.15.

Yocto Project2.0 with QT 5.4 (Weston Wayland UI).

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FEB600 User Manual

1-2. Product Specifications

Processor:

1.0GHz NXP i.MX 6Quad Cortex-A9 SoC (FEB600-Q10xx).

1.0GHz NXP i.MX 6Dual Cortex-A9 SoC (FEB600-D10xx).

1.0GHz NXP i.MX 6DualLite Cortex-A9 SoC (FEB600-U10xx).

System Memory:

2GB DDR3-1066 SDRAM onboard.

Storage:

8GB eMMC Flash memory.

Graphics:

Vivante GC2000 GPU (FEB600-Q10xx & FEB600-D10xx)

Two (identical) Image Processing Units (IPUs).

Supports HDMI 1.4 port.

Supports Hardware Graphics acceleration: OpenGL® ES 3.0, OpenCL and OpenVG™ 1.1.

Supports Hardware video acceleration: HD1080p60 Decode, Dual HD720p Encode.

Vivante GC880 GPU (FEB600-U10xx)

Two (identical) Image Processing Units (IPUs).

Supports HDMI 1.4 port.

Supports Hardware Graphics acceleration: OpenGL® ES 3.0, OpenVG™ 1.1.

Supports Hardware video acceleration: HD1080p30 Decode, Dual HD720p Encode.

LAN:

ATHEROS AR8031 Gigabit Ethernet transceiver with RGMII support.

WLAN: (Optional)

2.4G/5Ghz Wi-Fi module with miniPCIe interface. The wireless module complies with IEEE

802.11a/b/g/n/ac 2x2 MIMO standard.

Audio:

NXP SGTL5000 low power stereo codec.

USB:

MicroChip USB2514 USB 2.0 high speed 4-port hub controllers.

CAN:

MicroChip MCP2551T_I EMC optimized CAN transceiver.

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FEB600 User Manual

Front Panel I/O:

1 x 2-pole Phoenix DC jack.

1 x Power LED & WLAN/WPAN/WWAN LED (if Wi-Fi has installed).

1 x COM1 port (supports 5-wire TX/RX/RTS/CTS) RS232 DTE mode/RS485/RS422.

1 x Gigabit Ethernet port (supports optional IEEE802.3 af type 1).

1 x Micro SD/eMMC boot select switch.

2 x Antenna holes for 5G/Wi-Fi.

Rear Panel I/O:

1 x Reset button.

1 x HDMI® port.

1 x Mini USB 2.0 type B port support OTG.

3 x USB 2.0 type A ports.

1 x Micro SD/SDHC card slot.

1 x CAN/Debug port supports one COM2(supports 2-wire TX/RX) and two CAN bus support

CAN Protocol specification Version 2.0 B) through a cable.

1 x DIO port supports eight GPIOs.

1 x Audio jack for Line-out(default)/Earphone-out(option).

1 x Audio jack for Mic-in(default)/Line-in(option).

Dimension (W x D x H):

143mm x 74mm x 60mm (5.6” x 2.9” x 2.4”).

Weight:

TBD.

Operating Temperature:

-20°C ~ 70°C.

Operating Humidity:

0% ~ 90% @ 45°C (non-condensing).

Operating System:

Android 6.0, Linux 4.1.15 (AMOS-820-QP SKU).

Yocto Project2.0 with QT 5.4 (Weston Wayland UI).

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FEB600 User Manual

1-3. Outline Dimensions

1-3-1. Front view

1-3-2. Top view

1-3-3. Rear view

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