HAIIC MICA Hardware Development Guide
HAIIC MICA Hardware Development Guide, Edition 2016 9
3 MICA Customizable Circuit Board
3.1 Technical Description
In the technical drawing fig. 1 the dimensions and measurements of the printed circuit board
[PCB] of the MICA functional module are depicted. On the left you see the top view, in the
middle the side view and on the right the bottom view. The eight metallized areas in the mid-
dle of the top view depict module connector pins. The GND is the signal ground. The VDD
(supply voltage) supplies the device with 5V +/- 10% and 1A. The pins VBUS, D-, D+, GND,
GND define the USB 2.0 connection. A functional module should perform like a self-pow-
ered USB 2.0 compatible device.
All metalized mounting holes and mounting pads should be connected to GND.
3.2 Thermal Behavior
At the bottom of the functional module a thermal interface material (for example Bergquist
GF 1500) should be applied.
