HP MSR4060 Istruzioni per il montaggio

EL-MF877-00 Page 1

Template Revision B

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP MSR4060 Router Chassis(JG403A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic

instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as

defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display

backlights, scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or

PCAs already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and

toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

EL-MF877-00 Page 2

Template Revision B

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where

components and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

tweezers

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective

treatment:

1. Unscrew the screws for mounting angle 1, and then remove the mounting angle 1 from the rack or cabinet.

2. Remove all of the labels.

3. Unscrew the screws on blank panel 2 and 3, and then remove the blank panel 2 and 3.

4. Remove shielding fingers 4.

5. Remove the part 5 and 6.

6. Remove shielding fingers 4.

7. Remove the part 7.

8. Unscrew the screws on part 8, then remove it.

9. Remove shielding fingers 4.

10. Unscrew the screws on panel 7.1, and then remove panel 7.1.

11. Unscrew the screws on panel 7.2, and then remove panel 7.2.

12. Remove shielding fingers 4.

13. Unscrew the screws on PCB 7.3, and then remove PCB 7.3.

14. Unscrew the screws on panel 7.4, and then remove panel 7.4.

15. Unscrew the screws 7.5, and then remove handle 7.5.

16. Remove shielding fingers 4.

17. Unscrew the screws on panel 7.4.1, and then remove fan 7.4.2.

18. Unscrew the screws on part 8.1, and then remove PCB 8.2.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations)

EL-MF877-00 Page 3

Template Revision B

Figure 1 Remove mounting angle Figure 2 Treatments to the blank panel

Figure 3 Treatments to the product Figure 4 Treatments to the product

EL-MF877-00 Page 4

Template Revision B

Figure 5 Treatments to fan-assembly Figure 6 Treatments to the fan-assembly

Figure 7 Treatments to fan-assembly Figure 8 Treatments to fan-assembly

Figure 9 Treatments to fan-assembly Figure 10 Treatments to PCB-assembly

EL-MF877-00 Page 5

Template Revision B

3.3 Material of the facility built

Facility

Components

Material

Weight(g)

Weight percentage

Selective treatment for materials

and components

Details

269

1.69%

Fe recycling

59.6*10

3.76%

Fe recycling

95.8*2

1.21%

Fe recycling

Be-Cu

8.9

0.06%

Cu recycling

176.1

1.11%

Fe recycling

341.2*2

4.30%

Fe recycling

7.1

45.5

0.29%

Fe recycling

7.2

204.5

1.29%

Fe recycling

7.3

Complex PCB

0.16%

The surface of PCB is greater

than 10 square centimeters;

7.4

7.4.1

45.5*4

1.14%

Fe recycling

7.4.2

PBT , Cu

190*4

4.79%

Containing brominated flame

retardants;

7.5

37.5

0.23%

Fe recycling

7.6

682.1

4.30%

Fe recycling

8.1

125

0.79%

Fe recycling

8.2

Complex PCB

800

5.04%

The surface of PCB is greater

than 10 square centimeters;

11085.3

69.84%

Fe recycling

3.4 List the basic steps that should typically be followed to remove components and materials requiring selective

treatment:

1. Clear the yellow adhesive, if had, by the tweezers.

2. Pry the button battery up from socket.

EL-MF877-00 Page 6

Template Revision B

3.5 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations)

Figure 11 Clear the yellow adhesives by the tweezers.

Figure 12 Pry up the button battery

4.0 Revised record

Date

Version

Author

Modify content

2012.12.10

Cheng Wei

Initial version

Questo manuale è adatto per i seguenti modelli

Altri manuali HP Telaio

HP A9508-V Istruzioni per il montaggio

HP 7502 Istruzioni per il montaggio

HP 7506 Istruzioni per il montaggio

HP StorageWorks P2000 Guida

HP BL685c - ProLiant - 4 GB RAM Manuale di programmazione

HP Apollo a6000 Istruzioni operative e di sicurezza

HP Moonshot 1500 Istruzioni operative e di sicurezza

HP ProLiant s6500 Manuale utente

HP A7503-S Istruzioni per il montaggio

HP A-F5000 Istruzioni per il montaggio

HP FF 12916E Istruzioni per il montaggio

HP A10500 Series Manuale utente

HP MSA 2040 Guida

HP Apollo a6000 Istruzioni operative e di sicurezza

HP Apollo 4510 Gen10 Manuale

HP apollo 4510 gen9 Istruzioni operative e di sicurezza

HP ProLiant s6500 Istruzioni utente

HP A10504 Istruzioni per il montaggio

Manuali Telaio popolari di altre marche

Advantech

Advantech IPC-623 Series Manuale utente

IMC Networks

IMC Networks iMcV/18 Manuale utente

Chenbro

Chenbro RB13804N4WFT Manuale utente

Lenovo

Lenovo ThinkSystem SR665 V3 Manuale utente

Wuntronic

Wuntronic PCI4DRQ Manuale utente

EtherWAN

EtherWAN EMC400 Manuale utente

Overland Storage

Overland Storage SnapSAN S1000 Guida

Philips

Philips LC4.1E A Manuale utente

Supermicro

Supermicro SCF418 Series Manuale utente

Chenbro

Chenbro RM437 Series Manuale utente

Pickering

Pickering 40-914 Manuale utente

Supermicro

Supermicro SC823MTQ-R700LPB Manuale utente

SilverStone

SilverStone RMS08 Series Manuale utente

NI cRIO-FRC II Manuale utente

Pickering

Pickering 65-200 Manuale utente

Allied Telesis

Allied Telesis AT-MMCR18 Manuale utente

Hisense

Hisense MSD6586 Manuale utente

Cisco

Cisco Nexus 7010 Manuale di istruzioni