HP BladeSystem Blade Switch Istruzioni per il montaggio

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Product End-of-Life Disassembly Instructions

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes Quantity of items

included in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm 2 (system bd,

daughter bd)

Batteries All types including standard alkaline

and lithium coin or button style

batteries

1 (underside of

daughter board)

Mercury-containing components For example, mercury in lamps, display

backlights, scanner lamps, switches,

batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm Includes background illuminated

displays with gas discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height 2

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and

toner

Include the cartridges, print heads,

tubes, vent chambers, and service

stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

List the type and size of the tools that would typically be used to disassemble the product to a point where

components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Description #1 Flat blade, torx (T15) screwdriver Torx: T-15

Description #2 3/16-inch nut driver

Description #3

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials

requiring selective treatment:

DAUGHTER BOARD

1 Turn the three black levers that secure the daughter board to the system board to a horizontal

position to align with the slots (see Figure 2 below).

2 Remove the screw from each of the two metal retaining clips that secure the daughter board to

the metal tray (see Figure 3 below).

3 Remove two 3/16-inch hex nuts from the rear panel (see Figure 3 below).Remove the mid-plane

assembly.

4 Lift the top of the daughter board, and then pull it toward the open end of the tray until the

connectors on the back of the board are free from the metal tray.

5 Lift the daughter board out of the tray.

DAUGHTER BOARD BATTERY

1 Lay the daughter board on its top so that the components are visible.

2 Use a flat blade screwdriver to lift off the plastic cap marked “DALLAS POWERCAP”. The

battery is located in the plastic cap (see Figures 4 & 5 below).

3 Pry the battery from the plastic cap using the flat blade screwdriver.

SYSTEM BOARD

1 Using a T15 driver, remove the two remaining screws that secure the system board to the metal

tray (see Figure 6 below).

2 Slide the board forward about 12 mm (½ inch) toward the open end of the tray.

3 Lift the system board up and out of the tray.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to

identify the items contained in the product that require selective treatment (with descriptions and

arrows identifying locations).

FIGURE 1: Switch FIGURE 2: Lever that secures daughter board to

system board

FIGURE 3: Daughter board retaining clips hex nuts FIGURE 4: Daughter board battery location

FIGURE 5: Daughter board battery FIGURE 6: System board screws