HP Dx1000 - Microtower PC Istruzioni per il montaggio

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

Compaq dx1000 Microtower PC

Name / Model #2

Name / Model #3

Name / Model #4

Name / Model #5

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

The QTY may vary from different PSU Models

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

system fan, cooler

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

1.3 Markings for plastic parts greater than 25 grams

Plastic Part Name

Plastic Part

Description

Weight

(grams)

ISO 11469:2000 Plastic Part

Mark

Optional:

Photo

Alamo Main Bezel

Main front bezel piece

150

>ABS<

Alamo Anna Bezel

Frame

Front bezel frame

194

>ABS<

System Fan Frame

Fan Frame

>PBT-GF30-FR(17)<

CPU Heatsink Fan Frame

Fan Frame

>PBT-GF30-FR(17)<

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 Trox screw driver

T10

Description #2 Soldering Iron

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove cover from the unit

2. Remove all the cables from PCA

3. Remove PCI & PCI-E card from the PCA

4. Remove HDD from the system Remove ODD from PCA

5. Take off Front Panel

6. Take off ODD

7. Take off Cooler

8. Take off CMOS battery

9. Take off PS from the Unit

10. Cut off wire tie

11. Open PSU

12. Use screw driver to separate the small PCA from the main board

13. Electrolytic Capacitors location

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

1 Remove cover from the unit

Rotate screw to open the cover

2 Remove all the cables from PCA

Press the button to pull power cords off

Pull the other cords off PCA

3 remove PCI & PCI-E card from the PCA

Use screw driver to take off the screw as shown in the

photo

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

3 Take PCI & PCI-E cards off the PCA

Use one hand to push the white plastic use the other hand

to pull off the card

4 Remove HDD from the system

Rotate the screw driver to take off the HDD holder

5 Take off Front Panel

Pull the button up and then take off the front panel

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

6 Take off ODD

Use one hand to pull the steel up , and the same time take

off ODD use the other hand

7 Take off Cooler

7.1 Press the steel button to loose Cooler fan

7 Take off Cooler

7.2 Rotate screw driver to loose screw and then

take the cooler off PCA

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

8 Take off CMOS battery

Pull the battery holder as shown in the photo,

and then the battery will be off the PCA

9 Take off PS from the Unit

Use screw driver to loose screws and then take

the PS off the Unit

10 Cut off wire tie

EL-MF877-00 Page 7

Template Revision B

PSG instructions for this template are available at EL-MF877-01

11 open PSU

12 Use screw driver to separate the small PCA

from the main board

13 Remove Electrolytic Capacitors

13.1 Electrolytic Capacitors

13 Remove Electrolytic Capacitors

13.2 Use the Soldering Iron to heat the solder of

Electrolytic Capacitors and then remove it

EL-MF877-00 Page 8

Template Revision B

PSG instructions for this template are available at EL-MF877-01

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