HP EliteDesk 880 G1 Istruzioni per l'installazione

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP EliteDesk 880 G1 Small Form Factor Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic

instructions for the disassembly of HP products to remove components and materials requiring selective treatment ,as

defined by EU directive 2002/96/EC,Waste Electrical and Electronic Equipment (WEEE)

1.0 Items Requiring Selective

Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

PCA

Batteries

All types including standard alkaline and lithium

coin or button style batteries Yes

Mercury-containing components

For example, mercury in lamps, display

backlights, scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

Liteon 320W STD PSU

External electrical cables and cords

Yes

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink

Include the cartridges, print heads, tubes, vent

including liquids, semi-liquids (gel/paste) and toner

chambers, and service stations.

Components and waste containing asbestos

EL-MF877-00 Page 1

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Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where

components and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

#1Torx Screwdriver

#2 Phillips Screwdriver

#3 Micro shear

T-15

170II

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective

treatment:

1. Remove the access panel.(see Figure 1 below)

2. Disconnect the cables from the board.(see Figure 2-7 below)

3. Remove the HDD、slim ODD、ODD from cage.(see Figure 8-10 below)

4. Remove the Memory from the board.(see Figure 11 below)

5. Remove the CPU HeatSink from the board(see Figure 12&13 below)

6. Remove the fan from CPU HeatSink(see Figure 14&15 below)

7. Remove the CPU from the board.(see Figure 16&17 below))

8. Remove the battery from the system board.(see Figure 18 below)

9. Remove stone card from chassis.(see Figure 19&20 below)

10. Remove M/B from chassis.(see Figure 21&22 below)

11. Remove system fan from chassis.(see Figure 23&24 below)

12. Remove PSU from chassis.(see Figure 25-27 below)

13. Remove Speaker from chassis .(see Figure 28&29 below)

14. Remove front bezel.(see Figure 30 below)

15. Remove Front I/O and power LED cable.(see Figure 31-33 below)

16. Remove PSU cover.(see Figure 34&35 below)

17. Remove PSU PCA,and disconnect power cables.(see Figure 36&37 below)

18. Remove the Electrolytic Capacitors.(see Figure 38-40 below)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 2

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EL-MF877-00 Page 3

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Figure1 Remove the Access Panel Figure2 Disconnect PSU cables from the board

Figure3 Disconnect the ODD/HDD PSU cables Figure4 Disconnect the slim ODD cables

Figure5 Disconnect the cables from the HDD Figure6 Disconnect the CPU HeatSink cable

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PSG instructions for this template are available at EL-MF877-01

Figure7 Disconnect the Front IO cable Figure8 Remove the HDD from cage

Figure9 Remove the slim ODD from cage Figure10 Remove the ODD from cage

Figure11 Remove the Memory from the board Figure12 Loose the screws from the CPU HeatSink

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Figure13 Remove the CPU HeatSink from the board Figure14 Loose the screws from the CPU HeatSink

Figure15 Remove the fan from CPU HeatSink Figure16 Rotate the handle and open it up

Figure17 Remove the CPU from the board Figure18 Remove the battery from the system board

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Figure19 Loose the stone card screws Figure20 Remove the stone card from MB

Figure21 Loose the screws from board Figure22 Remove M/B from chassis

Figure23 Loose the screws from system fan Figure24 Remove system fan

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Figure25 Loose the screws from PSU Figure26 Press the baffle and slide the PSU

Figure27 Remove PSU from chassis Figure28 Loose the screws from Speaker

Figure29 Remove Speaker Figure30 Remove front bezel

EL-

Tem

F877-00

late Revisio

Figure31 L

Figure33 R

Figure35 Li

ose the scr

move powe

t the cover

PSG instruc

w of Front I

r LED cable

ff the power

ions for this

supply

emplate are

Figu

vailable at E

e32 Remov

e34 Remov

e36 Cut the

-MF877-01

Front IO c

the screw

cable tie

ble

on the PS

chassis

e 8

EL-MF877-00 Page 9

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PSG instructions for this template are available at EL-MF877-01

Figure37 Remove PSU MB from PSU Chassis

（Liteon 320W STD）

Figure38 Show Ele-Cap on PCBA

Figure39 Remove Ele-Cap from PCBA

Figure40 Remove Ele-Cap from PCBA

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