HP EliteOne 1000 G2 Istruzioni per l'installazione

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Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP EliteOne 1000 G2 34-in Curved All-in-One Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Motherboard, RAM

Batteries

All types including standard alkaline and lithium coin

or button style batteries RTC battery

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps LCD

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

EPS, Power Cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

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Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdiver

TORX T8

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Removed Base Top Cover

2. Removed Base Front Cover

3. Removed Power Switch Board, Sensor Board

4. Remove 4 screws then disassembly the LID (LCD chassis)

5. Removed Fan Module

6. Removed Heat Sink

7. Removed Stand Arm Base, MB Protect Cover

8. Removed Side I/O Top Shielding

9. Remove SSHD

10. Removed Speaker module

11. Removed Wireless Card, Ram, CPU

12. Removed RTC battery

13. Removed Motherboard, Bottom Base Cover

14. Removed Stand Rear Cover, Stand Front Cover

15. Removed Stand Arm

16. Removed Rear Cover

17. Removed Hinge Stand, OSD board

18. Removed Scalar Shielding, Scalar Board, Scalar Bracket Bottom

19. Removed Camera Box, Camera Transfer Board

20. Removed Camera Module, Camera Bracket , DMIC Board, RGB Camera Box Cable

21. Removed Camera Holder, LCD Frame

22. Removed LCD Chin, LCD Chin Bracket, LCD Panel

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1. Removed Base Top Cover

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2. Removed Base Front Cover

3. Removed Power Switch Board, Sensor Board

4. Remove 4 screws then disassembly the LID (LCD chassis)

5. Removed Fan Module

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6. Removed Heat Sink

7. Removed Stand Arm Base, MB Protect Cover

8. Removed Side I/O Top Shielding

9. Remove SSHD

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10. Removed Speaker module

11. Removed Wireless Card, Ram, CPU

12. Removed RTC battery

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PSG instructions for this template are available at EL-MF877-01

13. Removed Motherboard, Bottom Base Cover

14. Removed Stand Rear Cover, Stand Front Cover

15. Removed Stand Arm

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PSG instructions for this template are available at EL-MF877-01

16. Removed Rear Cover

17. Removed Hinge Stand, OSD board

18. Removed Scalar Shielding, Scalar Board, Scalar Bracket Bottom

EL-MF877-00 Page 8

Template Revision B

PSG instructions for this template are available at EL-MF877-01

19. Removed Camera Box, Camera Transfer Board

20. Removed Camera Module, Camera Bracket , DMIC Board, RGB Camera Box Cable

21. Removed Camera Holder

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22. Removed LCD Chin, LCD Chin Bracket, LCD Frame, LCD Panel

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