HP Omni Pro 110 Istruzioni per l'installazione

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP Omni Pro 110 PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic

instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as

defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display

backlights, scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or

PCAs already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and

toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where

components and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective

treatment:

1) Place the system face down

2) Disassemble hinge cover & access door

3) Disassemble stand

4) Remove ODD&TOP Perf (grill)

5) Disassemble rear cover

6) Disassemble HDD

7) Disassemble CPU&I/O Shielding

8) Disassemble stand support

9) Disassemble CPU H/S

10) Disassemble speaker

11) Unplug cable

12) Disassemble ODD& HDD cable and fan

13) Disassemble WLAN

14) Disassemble INVERTER

15) Disassemble MB and MB Battery

16) Remove CPU & DDR

17) Disassemble power switch card

18) Disassemble webcam & antenna cable

19) Disassemble basepan

20) Disassemble LCD

21) Separate BASE pan& beze

22) Remove CCFLs from panel (up to 4)

23) Remove Battery from MB, KB & Mouse.

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