HP ProDesk 600 G4 Istruzioni per l'installazione

EL-MF877-00

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PSGinstructions for this template are available atEL-MF877-01

ProductEnd-of-LifeDisassemblyInstructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP ProDesk 600 G4 Microtower Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.1

Items listed below are classified as requiring selective treatment.

1.2

Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

250W

EPA92

Acbel

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

Include the cartridges, print heads, tubes, vent

1.0 Items Requiring Selective Treatment

EL-MF877-00

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PSGinstructions for this template are available atEL-MF877-01

including liquids, semi-liquids (gel/paste) and toner

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

T-15

Micro

shear

170II

Screwdriver

PH1

Description

3.0 Product Disassembly Process

3.1

List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

Pull the latch and remove access panel.

Pull the HDD latch from HDD cage.

Disconnect SATA/Power cables from the HDD.

Disconnect SATA/Power cables from slim ODD.

Remove main bezel from chassis

Remove HDD cage from the chassis

Press slim ODD latch

Remove slim ODD from ODD cage

Disconnect HDD SATA cable from theMB.

10.

Disconnect HDD Power cable from theMB

11.

Disconnect P1 Power cable from the MB

12.

Disconnect P2 Power cable from the MB.

13.

Disconnect speaker cable from the MB

14.

Disconnect CPU power cable from theMB

15.

Disconnect ODD power cable from theMB

16.

Disconnect ODD SATA cable from theMB

17.

Poke clip and remove SATA & power cables

18.

Disconnect heat sink cable from the MB

19.

Disconnect system fan cable from the MBt

20.

Use T-15 screwdriver to loose the screws and remove heat sink

21.

Use PH1 screwdriver to loose the screws and remove the fan

22.

Separate the fan from CPU heat sink

23.

Disconnect memory from theMB

24.

Rotate the handle and open it up

25.

Remove CPU from MB

26.

Remove the battery from the MB

27.

Use T-15 to loose the screws of MB

28.

Remove MB from chassis

29.

Use PH1 screwdriver to loose screws of system fan and remove it

30.

Use T-15 screwdriver to loose the screws of speaker and remove it

PSGinstructions for this template are available atEL-MF877-01

31.

Use 170II micro shear to cut two cable ties of PSU cables from chassis

32.

Use T-15 screwdriver to loose the screws of PSU

33.

Press PSU latch and remove it

34.

Cut the cable tie

35.

Remove screw for bottom

36.

Remove screw for top

37.

Remove cover

38.

Remove FG screw

39.

Disconnect fan connector and inlet connector.

40.

Heat the solder of Electrolytic Capacitors greater than 2.5cm in diameter or height and remove it.

3.2

Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3

Template Revision B

PSGinstructions for this template are available atEL-MF877-01

Figure 1 Pull the latch and remove access panel

Figure 2 Pull the HDD latch from HDD cage

Figure 3 Disconnect SATA/Power cables from the HDD

Figure 4 Disconnect SATA/Power cables from slim ODD

Figure 5 Remove main bezel from chassis

Figure 6 Remove HDD cage from the chassis

EL-MF877-00 Page 4

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PSGinstructions for this template are available atEL-MF877-01

Figure 7 Press slim ODD latch

Figure 8 Remove slim ODD from ODD cage

Figure 9 Disconnect HDD SATA cable from the MB

Figure 10 Disconnect HDD Power cable from the MB

Figure 11 Disconnect P1 Power cable from the MB

Figure 12 Disconnect P2 Power cable from the MB

EL-MF877-00 Page 5

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PSGinstructions for this template are available atEL-MF877-01

Figure 13 Disconnect speaker cable from the MB

Figure 14 Disconnect CPU power cable from the MB

Figure 15 Disconnect ODD power cable from the MB

Figure 16 Disconnect ODD SATA cable from the MB

Figure 17 Poke clip and remove SATA & power cables

Figure 18 Disconnect heat sink cable from the MB

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PSGinstructions for this template are available atEL-MF877-01

Figure 19 Disconnect system fan cable from the MB

Figure 20 Use T-15 screwdriver to loose the screws and

remove heat sink

Figure 21 Use PH1 screwdriver to loose the screws and

remove the fan

Figure 22 Separate the fan from CPU heat sink

EL-MF877-00 Page 7

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PSGinstructions for this template are available atEL-MF877-01

Figure 23 Disconnect memory from the MB

Figure 24 Rotate the handle and open it up

Figure 25 Remove CPU from MB

Figure 26 Remove the battery from the MB

Figure 27 Use T-15 to loose the screws of MB

Figure 28 Remove MB from chassis

EL-MF877-00 Page 8

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PSGinstructions for this template are available atEL-MF877-01

Figure 29 Use PH1 screwdriver to loose screws of

system fan and remove it

Figure 30 Use T-15 screwdriver to loose the screws of

speaker and remove it

Figure 31 Use 170II micro shear to cut two cable ties of

PSU cables from chassis

Figure 32 Use T-15 screwdriver to loose the screws of

PSU

EL-MF877-00 Page 9

Template Revision B

PSGinstructions for this template are available atEL-MF877-01

Figure 33 Press PSU latch and remove it

Figure 34 Cut the cable tie

Figure 35 Remove screw for bottom

Figure 36 Remove screw for top

Figure 37 Remove cover

Figure 38 Remove FG screw

EL-MF877-00 Page 10

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