HP 240 G2 Istruzioni per l'installazione

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category:

Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP 240 G2 Notebook PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0

Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm

Mother board 1

Batteries All types including standard alkaline and lithium coin

or button style batteries Battery Pack,RTC 2

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries 0

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps LCD 1

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height 0

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations. 0

Components and waste containing asbestos

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

refractory ceramic fibers 0

Components, parts and materials containing

radioactive substances 0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Automatic Screw Driver Philip #1

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Disassembly and remove Service Door

2. Remove battery module

3. Disassemble Motherboard and thermal module

4. Diassemble Keyboard and touchpad

5. Diassemble C cover

6. Disassemble LCD module

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

3.21 Total part disassembly

3.22 Remove battery module

3.23 Remove service door

3.24 LCD module set disassembly

3.25 Top case disassembly

3.26 Thermal module and mother board disassembly

3.27 Bottom case disassembly

Tabulator: Nathan Ho

EL-MF877-00 Page 3

Template Revi ion B

PSG in truction for thi template are available at EL-MF877-01

Work Instructs

Document No. :Disassembly WI Step : 1

Name :Get Battery

Date : 2013-11-13

Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty

Philip #1 1

Point for attention: If finding some defects, notice the gaffer and assess.

Step:

1. Remove Batter pack.

2. Loosen screws in D cover,

Tabulator: Nathan Ho

EL-MF877-00 Page 4

Template Revi ion B

PSG in truction for thi template are available at EL-MF877-01

Work Instructs

Document No. :Disassembly WI Step : 2

Name :Disassemble C cover

Date : 2013-11-13

Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty

Philip #1 1

Point for attention: If finding some defects, notice the gaffer and assess.

Step:

1. Remove service door, get

memory card, WLAN card.

2. Open t e notebook.

Disassemble t e C cover.

Tabulator: Nathan Ho

EL-MF877-00 Page 5

Template Revi ion B

PSG in truction for thi template are available at EL-MF877-01

Work Instructs

Document No. :Disassembly WI Step : 3

Name :Disassemble C cover

Date : 2013-11-13

Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty

Philip #1 1

Point for attention: If finding some defects, notice the gaffer and assess.

Step:

1. Remove C cover.

2. Disassemble power button,

Touc pad board, and

keyboard.

Tabulator: Nathan Ho

EL-MF877-00 Page 6

Template Revi ion B

PSG in truction for thi template are available at EL-MF877-01

Work Instructs

Document No. :Disassembly WI Step : 4

Name :Disassemble MB

Date : 2013-11-13

Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty

Philip #1 1

Point for attention: If finding some defects, notice the gaffer and assess.

Step:

1. Loosen screws on MB.

2. Get mot er board.

Tabulator: Nathan Ho

EL-MF877-00 Page 7

Template Revi ion B

PSG in truction for thi template are available at EL-MF877-01

Work Instructs

Document No. :Disassembly WI Step :5

Name :Disassemble MB

Date : 2013-11-13

Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty

Cross Head of Screws Driver 1

Point for attention: If finding some defects, notice the gaffer and assess.

Step:

1. Get t e HDD, ODD and USB board

from C cover.

2. Disassemble t ermal module.

Tabulator: Nathan Ho

EL-MF877-00 Page 8

Template Revi ion B

PSG in truction for thi template are available at EL-MF877-01

Work Instructs

Document No. :Disassembly WI Step :6

Name :Disassemble MB Date : 2013-11-13

Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty

Philip #1 1

Point for attention: If finding some defects, notice the gaffer and assess.

Step:

1. Get t e t ermal module and

mot er board.

Tabulator: Nathan Ho

EL-MF877-00 Page 9

Template Revi ion B

PSG in truction for thi template are available at EL-MF877-01

Work Instructs

Document No. :Disassembly WI Step : 7

Name :Disassemble D cover

Date : 2013-11-13

Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty

Philip #1 1

Point for attention: If finding some defects, notice the gaffer and assess.

Step:

1. Tear down DC in cable,

speaker.

2. Disassemble LCD panel and

Touc screen.

Tabulator: Nathan Ho

EL-MF877-00 Page 10

Template Revi ion B

PSG in truction for thi template are available at EL-MF877-01

Work Instructs

Document No. :Disassembly WI Step : 8

Name :Disassemble LCD Module

Date : 2013-11-13

Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty

Philip #1 1

Point for attention: If finding some defects, notice the gaffer and assess.

Step:

Disassemble LCD module,

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