HP Chromebook x360 14 Istruzioni per il montaggio

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP Chromebook x360 14;

HP Chromebook x360 14X*

HP Chromebook x360 14 G1

HP Chromebook Enterprise x360 14E G1

Name / Model #5

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

MB & IO PCB

Batteries

All types including standard alkaline and lithium

coin or button style batteries battery

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps LCD

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Power cords,Adapter

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1

Philip #1 /

TORX T

Description #2

Philip #0 /

TORX T

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove Log Low

2. Remove Battery pack

3. Remove FAN & HEAT PIPE

4. Remove Hinge up

5. Remove Motherboard

6. Remove IO PCB

7. Remove Speaker module & K-lock bracket

8. Remove LCD Cover

9. Remove EDP cable / TS / Camera trans / G sensor PCB

10. Remove Antenna

11. Remove Hinge

12. Remove Hinge Cap

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Step1 Remove Log Low Step2 Remove Battery pack

Step3 Remove FAN & HEAT PIPE Step4 Remove Hinge up

Step5 Remove Motherboard Step6 Remove IO PCB

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Step7 Remove Speaker module & K-lock bracket Step8 Remove LCD Cover

Step9 Remove EDP cable / TS / Camera trans / G sensor PCB Step10 Remove Antenna

Step11 Remove Hinge Step12 Remove Hinge Cap

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