HPE Primera 6 Series Istruzioni per il montaggio

MF877-00 Page 1

Template Revision A

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Storage

Marketing Name / Model

[List multiple models if applicable.]

HPE Primera 6xx Storage Controllers (600, 630, 650, 670)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU

directive 2012/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Nodes =1 ea

Power supply =1 ea

IOM = 1 ea

Midplanes =1 ea

Temp sensor boards = 1ea

1 per node

1 per

power

supply

1 per IOM

1 per

Enclosure

1 per temp

sensor

Batteries

All types including standard alkaline and lithium

coin or button style batteries : 1EA Coin cell in

Node module; Up to 4 Li ion battery pack in Power

Cooling Battery Module

2 Li Ion per

2Node

4 Li Ion per

4Node

1 Coin per

node

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

PCV insulation on external power cords.

Gas Discharge Lamps

MF877-00 Page 2

Template Revision A

HPE instructions for this template are available at MF877-01

Item Description Notes

Quantity

of items

included

in product

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Phillips screw driver

#0,#1, #2

Pry Bar

Small

Torx Driver

T10, T15

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove SFP/Transceivers from HBA’s if present:

2. Use thumb screw on installed HBA’s to remove from controllers.

3. Remove HBA PCBA from HBA frame.

4. Pull release handle on Node(s) to remove from node enclosure.

5. Remove top cover by depressing the latches on each side of the nodes

6. Remove air flow dividers if present and heat sync/s from PCA with a T10 Torx driver and pry bar if needed.

7. Remove processor/s from the PCA.

8. Remove DIMM’s and blanks from the PCA.

9. Remove coin battery from PCA and recycle according to local government rules.

10. Remove SAS connector daughter card from frame using a phillips screw driver.

11. Remove PCBA from the frame using a Phillips screw driver.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3

Template Revision A

HPE instructions for this template are available at MF877-01

Remove HBA from node:

Remove top cover of node:

Remove boot drive/s, DIMM’s, Processor/s and air baffles. Nodes may have different amounts of boot drives, DIMM’s and Processors.

MF877-00 Page 4

Template Revision A

HPE instructions for this template are available at MF877-01

Remove PCA from sheet metal frame. All phillips screws must be removed.

Remove SAS port riser card from Sheetmetal base. Phillips screws must be removed.

Remove Battery

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