HTC QUARTZ Manuale utente

Doc. No. DOC-00046130
REV.
Issued Date 2008/9/1
. Revised Date 2008/12/10 A05
Doc. Title QUARTZ Service Manual Page 1 of 80
HTC CONFIDENTIAL
SM-TP001-0704
HTC Corporation
QUARTZ
Service Manual
UHTC Proprietary
Confidential Treatment Requested
Rev. A05
HTC Corporation
Engineering Mobility

Doc. No. DOC-00046130
REV.
Issued Date 2008/9/1
. Revised Date 2008/12/10 A05
Doc. Title QUARTZ Service Manual Page 2 of 80
HTC CONFIDENTIAL
SM-TP001-0704
HTC Corporation
REVISION CONTROL TABLE
REV DATE CONTENTS DEPT REVISED STAGE
AX01 2008/04/14 Fist Draft PSE Jason.Cl_Lee DVT
A01 2008/10/7 Formal release PSE Jason.Cl_Lee PVT
A02 2008/10/29
1. Add tamper evident label.
2. Revise chapter 11.1 LCM and Bezel replacement.
3. Add internal storage content pre-load process.
4. Update chapter 9.1 SPL list for repair
PSE Jason.Cl_Lee MV
A03 2008/11/19
1. Add “write engineer ID” in the diagnostic process.
2. Add “Adjust the backlight to lowest” in the
power management for idle and sleep
current measurement.
PSE Jason.Cl_Lee MP
A04 2008/11/26
1. Remove some parts of board level 2.5.
2. Add document no for internal storage pre-load tool.
3. Add the last step of internal storage pre-load
process to check the internal storage content.
4. Add chapter 9.3 FRU M/B addition parts location.
5. Add unit water sensitive label location.
6. Update chapter 9.1 SPL for repair.
PSE Jason.Cl_Lee MP
A05 2008/12/10 1. Add TV out test in the chapter 4.1 Win CE test item PSE Jason.Cl_Lee MP

Doc. No. DOC-00046130
REV.
Issued Date 2008/9/1
. Revised Date 2008/12/10 A05
Doc. Title QUARTZ Service Manual Page 3 of 80
HTC CONFIDENTIAL
SM-TP001-0704
HTC Corporation
Table of Contents
1. INTRODUCTION......................................................................................................................................................4
1.1 Product overview...............................................................................................................................................6
2. DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE...........................................................................10
2.1 Tools List..........................................................................................................................................................10
2.2 Disassembling procedure................................................................................................................................11
2.3 Assembling procedure......................................................................................................................................17
3. ROM RE-FLASH PROCEDURE............................................................................................................................23
3.1 Internal storage pre-load .................................................................................................................................23
3.2 ROM upgrade thru RUU (Re-flash Upgrade Utility) ........................................................................................25
3.3 Rom Image upgrade thru SD card ..................................................................................................................29
4. DIAGNOSTIC PROGRAM .....................................................................................................................................31
4.1 List of Diagnostic / WinCE Test Items..............................................................................................................31
5. POWER MEASUREMENT TEST...........................................................................................................................45
5.1 Main board leakage current Test Procedure ...................................................................................................45
5.2 Battery rundown test procedure ......................................................................................................................48
6. COSMETIC INSPECTION CRITERIA....................................................................................................................54
6.1 Classes definition of inspective area...............................................................................................................54
6.2 Display inspection............................................................................................................................................55
6.3 Main unit inspection.........................................................................................................................................55
7. GENERIC TROUBLESHOOTING..........................................................................................................................56
8. GENERIC LABELING PLAN..................................................................................................................................61
9. GENERIC SPARE PART LIST AND PHOTOS.......................................................................................................65
9.1 SPL for Repair .................................................................................................................................................65
9.2 Board Level 2.5 Repairs..................................................................................................................................70
9.3 FRU M/B addition parts location......................................................................................................................73
10. RF ANTENNA SPECIFICATION ..........................................................................................................................74

Doc. No. DOC-00046130
REV.
Issued Date 2008/9/1
. Revised Date 2008/12/10 A05
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HTC CONFIDENTIAL
SM-TP001-0704
HTC Corporation
11. APPENDIX ...........................................................................................................................................................76
11.1 LCM and LCM bezel replacement...................................................................................................................76
11.2 2nd camera and daughter board assembly......................................................................................................80
1. Introduction
This manual provides the technical information to support the service activities of Diamond.
This document contains highly confidential information, so any or all of this document should not be revealed to
any third party.
zChapter 1: Introduction-This Chapter is about Products features and basic Product
function. After reading this chapter, you will know what feature the product has
and basic hardware operation. Also you will know how to perform soft-rest and
hard-rest in this chapter.
zChapter 2: Device Dissembling and Assembling Procedure- After reading this chapter,
you will learn how to disassemble and assemble the product. Also, you will
know what tools to use and the torque. Please follow the instruction to
dissemble the unit to prevent from damaging the unit.
zChapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to
perform the ROM image re-flesh by using RUU and SD-Card. Also you can
find the steps of enter the boot loader mode.
zChapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn
zHow to use the diagnostic program to perform unit function test
zHow to test some functions in Windows Mobile mode (ex. WLAN,
Bluetooth, and USB etc…)
zChapter 5: Power measurement test- After reading this chapter, you will learn how to use
MB leakage test procedure and battery run-down test (Battery Capacity
Measurement).
zChapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the
appearance quality inspection criteria, ex. Display, bezel, and housing etc…
zChapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do
generic trouble-shooting.
zChapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for
reference, ex. Regulation label, and battery label etc…
zChapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts

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REV.
Issued Date 2008/9/1
. Revised Date 2008/12/10 A05
Doc. Title QUARTZ Service Manual Page 5 of 80
HTC CONFIDENTIAL
SM-TP001-0704
HTC Corporation
reference list and photos for repairing, including unit and Board level.
zChapter 10: RF Antenna Specification- Reference Spec for RF test.
zAppendix: Additional information.

Doc. No. DOC-00046130
REV.
Issued Date 2008/9/1
. Revised Date 2008/12/10 A05
Doc. Title QUARTZ Service Manual Page 6 of 80
HTC CONFIDENTIAL
SM-TP001-0704
HTC Corporation
1.1 Product overview

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Issued Date 2008/9/1
. Revised Date 2008/12/10 A05
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HTC CONFIDENTIAL
SM-TP001-0704
HTC Corporation

Doc. No. DOC-00046130
REV.
Issued Date 2008/9/1
. Revised Date 2008/12/10 A05
Doc. Title QUARTZ Service Manual Page 8 of 80
HTC CONFIDENTIAL
SM-TP001-0704
HTC Corporation

Doc. No. DOC-00046130
REV.
Issued Date 2008/9/1
. Revised Date 2008/12/10 A05
Doc. Title QUARTZ Service Manual Page 9 of 80
HTC CONFIDENTIAL
SM-TP001-0704
HTC Corporation

Doc. No. DOC-00046130
REV.
Issued Date 2008/9/1
. Revised Date 2008/12/10 A05
Doc. Title QUARTZ Service Manual Page 10 of 80
HTC CONFIDENTIAL
SM-TP001-0704
HTC Corporation
2. Device Disassembling and Assembling Procedure
2.1 Tools List
level No. Item Vendor P/N
1 Mini USB DATA interface Cable
2 Earphone Headset
3 AC Adapter
4 WLAN AP
5 Micro Memory Card with Diag. test
program (need be encoded by
HTC)
HTC design DCT-00062
6 Micro memory card for ROM code
re-flash ( must be encoded by HTC) HTC design
7 Micro memory card for internal
storage pre-load
7 Universal leakage current tester HTC design MLT-00001
8 Battery holder HTC design
9 Unit current consumption test
fixture HTC design
10 Power supply
11 Current Meter
12 Mobile tester
13 TV out cable HTC option parts 73H00274-02M
L 1
14 TV
13 Special Made Plastic Stick HTC special tools RTT-00006
14 Hand tools
L 2 19 Label printer
( 400 dpi resolution and up )
18 Lead-free Soldering station
L 2.5 19 Air heater
Indice
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