Inrevium TB-6V-LX760-LSI Istruzioni per l’uso

TB-6V-LX760-LSI Hardware User Manual

Rev.

TB-6V-LX760-LSI

Hardware User Manual

Rev.3.00

TB-6V-LX760-LSI Hardware User Manual

Rev.

Revision History

Version Date Description Publisher

Rev.1.xx 2009/xx/xx Preliminary

Rev.2.00 2010/05/06

Initial release Sen

Odajima

Rev.2.01 2010/06/25 -Added J66, J53 to figure 12-1

-Modified table 12-1

Added J66,J53

Separate SW5,SW6

Changed initial settings : No1, 6 ,7 ,18, 20.21

Yoshioka

Rev.2.02 2010/07/07

- Modified table 6-1, table 6-2, table 6-3

- Modified figure 6-1, figure 7-3

- Delete wrong information on 8-3 FMC connector

- Modified explaining of clock signal of each FMC connectors

- Modified figure 9-1

- Add DIP SW pin number on table 9-1 and 9-2

- Changed connector for FAN on 6.5 Power supply for FAN

Yoshioka

Rev.2.03 2012/04/24

-Modified Q’ty of TB-FMCH-STACK and

Q’ty of TB-FMCH-CONNECTRO Yoshioka

Rev.3.00 2012/07/17

- Modified revision of pin assign table

- Modified PCB dimension and surface coating

- Modified External view

- Modified Table 8-1 LA06_P/N, LA33_P/N, CLK1_M2C_P/N

and CLK0_M2C_P/N

- Add comment to Table 8-1, 8-2, 8-6, 8-7: LA33_P/N. these

are not differential pair

- Modified Table 8-2 LA15_P/N, LA19_P/N, LA33_P/N,

CLK1_M2C_P/N and CLK0_M2C_P/N

- Modified Table 8-4 CLK1_M2C_P/N and CLK0_M2C_P/N

- Modified Table 8-5 CLK1_M2C_P/N and CLK0_M2C_P/N

- Modified Table 8-6 LA11_P/N, LA33_P/N, CLK1_M2C_P/N

and CLK0_M2C_P/N

- Modified Table 8-7 CLK1_M2C_P/N and CLK0_M2C_P/N

- Modified Table 8-8 CLK1_M2C_P/N and CLK0_M2C_P/N

- Modified Table 8-9 CLK1_M2C_P/N and CLK0_M2C_P/N

- Modified Table 8-10 CLK1_M2C_P/N and CLK0_M2C_P/N

- Modified Figure 1-3 Power Supply Arrangement for FPGA

Banks

- Modified Spec of FAN

- Added 11-4 Pin header and Table 11-4 pin assign of pin

header

- Modified Figure 12-1 Default settings

- Modified Table 12-1 Initial Settings (removed J66)

Yoshioka

TB-6V-LX760-LSI Hardware User Manual

Rev.

Table of Contents

1. Related Documents and Accessories ......................................................................................... 9

2. Overview...................................................................................................................................... 9

3. Feature ........................................................................................................................................ 9

4. Block Diagram............................................................................................................................11

5. External View of the Board........................................................................................................ 12

5.1. TB-6V-LX760-LSI .................................................................................................................... 12

5.2. TB-FMCH-STACK and TB-FMCH-CONNECTOR................................................................... 13

6. Board Specifications.................................................................................................................. 14

6.1. TB-6V-LX760-LSI Board Structure .......................................................................................... 14

6.2. TB-FMCH-STACK Board Structure ......................................................................................... 14

6.3. TB-FMCH-CONNECTER Board Structure.............................................................................. 15

6.4. Layout of TB-6V-LX760-LSI Board Components .................................................................... 16

6.5. Layout of the TB-FMCH-STACK Board Components ............................................................. 17

6.6. Layout of the TB-FMCH-CONNECTER Board Components .................................................. 17

7. Description of Components....................................................................................................... 18

7.1. DDR3 SDRAM......................................................................................................................... 18

7.2. SPI FLASH .............................................................................................................................. 19

7.3. BPI FLASH .............................................................................................................................. 19

7.4. MicroSD/NAND FLASH (these are only for Virtex-6 configuration) ........................................ 20

8. Interfaces................................................................................................................................... 21

8.1. USB and I2C............................................................................................................................ 21

8.2. Method of Rewriting an EEPROM for USB PHY..................................................................... 21

8.3. FMC Connector ....................................................................................................................... 22

8.3.1. FMC1 LPC MC / CC Connector ...................................................................................... 23

8.3.2. FMC2 LPC MC / CC Connector ...................................................................................... 25

8.3.3. FMC3 LPC MC / CC Connector ...................................................................................... 27

8.3.4. FMC4 LPC MC / CC Connector ...................................................................................... 29

8.3.5. FMC5 LPC MC / CC Connector ...................................................................................... 31

8.3.6. FMC6 LPC MC / CC Connector ...................................................................................... 33

8.3.7. FMC7 LPC MC / CC Connector ...................................................................................... 35

8.3.8. FMC8 LPC MC / CC Connector ...................................................................................... 37

8.3.9. FMC9 LPC MC / CC Connector ...................................................................................... 39

8.3.10. FMC10 LPC MC / CC Connector .................................................................................... 41

9. Clock System Diagram.............................................................................................................. 45

9.1. PLL Setting .............................................................................................................................. 46

10. Power Supply System........................................................................................................... 48

10.1. Power Consumption Estimation .......................................................................................... 48

10.2. Power Supply System Diagram........................................................................................... 49

10.3. Power Supply Monitor ......................................................................................................... 50

10.4. Power Supply Arrangement for FPGA Banks...................................................................... 51

10.5. Power Supply for Fan.......................................................................................................... 51

TB-6V-LX760-LSI Hardware User Manual

Rev.

11. LED/SW/JUMPER ................................................................................................................ 52

11.1. LED.......................................................................................................................................... 52

11.2. Switch ...................................................................................................................................... 53

11.3. JUMPER.................................................................................................................................. 54

11.4. Pin Header............................................................................................................................... 55

12. Initial Settings........................................................................................................................ 56

List of Figures

Figure4-1 Block Diagram ..................................................................................................................11

Figure5-1 Component Side.............................................................................................................. 12

Figure5-3 External view of the TB-FMCH-STACK and TB-FMCH-CONNECTOR .......................... 13

Figure6-1 Layout of TB-6V-LX760-LSI Board Components............................................................. 16

Figure6-2 Layout of the TB-FMCH-STACK Board Components...................................................... 17

Figure6-3 Layout of the TB-FMCH-CONNECTER Board Components........................................... 17

Figure7-1 DDR3 Peripheral Connections......................................................................................... 18

Figure7-2 SPI Flash Peripheral Connections................................................................................... 19

Figure7-3 BPI Flash Peripheral Connections................................................................................... 19

Figure7-4 CONFIG Peripheral Connections .................................................................................... 20

Figure7-5 JTAG Chain...................................................................................................................... 20

Figure8-1 USB and I2C Peripheral Connections ............................................................................. 21

Figure8-2 FMC Connector Peripheral Connections......................................................................... 22

Figure8-3 Low-Pin Count Pinouts .................................................................................................... 22

Figure8-4 SDA,SCL,GA1/0 TDI/TDO Circuit.................................................................................... 43

Figure8-5 PG_C2M Circuit............................................................................................................... 43

Figure8-6 VREF_A_M2C Circuit...................................................................................................... 43

Figure8-7 FMC_VREF Select Circuit............................................................................................... 44

Figure8-8 VADJ Circuit..................................................................................................................... 44

Figure9-1 Clock System Diagram .................................................................................................... 45

Figure10-1 Power Supply System Diagram..................................................................................... 49

Figure10-2 Power Supply Monitor.................................................................................................... 50

Figure10-3 Power Supply Arrangement for FPGA Banks................................................................ 51

Figure10-4 Fan Connector Peripheral Circuit .................................................................................. 51

Figure12-1 Default Settings (component side) ................................................................................ 56

TB-6V-LX760-LSI Hardware User Manual

Rev.

List of Tables

Table6-1 TB-6V-LX760-LSI Board Structure.................................................................................... 14

Table6-2 TB-FMCH-STACK Board Structure................................................................................... 14

Table6-3 TB-FMCH-CONNECTER Board Structure........................................................................ 15

Table8-1 FMC1 Connector Pinouts on Component and Solder Sides............................................. 23

Table8-2 FMC2 Connector Pinouts on Component and Solder Sides............................................. 25

Table8-3 FMC3 Connector Pinouts on Component and Solder Sides............................................. 27

Table8-4 FMC4 Pinouts on Component and Solder Sides .............................................................. 29

Table8-5 FMC5 Pinouts on Component and Solder Sides .............................................................. 31

Table8-6 FMC6 Connector Pinouts on Component and Solder Sides............................................. 33

Table8-7 FMC7 Connector Pinouts on Component and Solder Sides............................................. 35

Table8-8 FMC8 Connector Pinouts on Component and Solder Sides............................................. 37

Table8-9 FMC9 Connector Pinouts on Component and Solder Sides............................................. 39

Table8-10 FMC10 Connector Pinouts on Component and Solder Sides......................................... 41

Table9-1 PLL’s M Divide Setting Table............................................................................................. 46

Table9-2 PLL’s N Divide Setting Table ............................................................................................. 47

Table11-1 LED Functions ................................................................................................................. 52

Table11-2 Switch Functions.............................................................................................................. 53

Table11-3 Jumper Functions............................................................................................................ 54

Table11-4 Pin assign of Pin header.................................................................................................. 55

Table12-1 Initial Settings.................................................................................................................. 57

TB-6V-LX760-LSI Hardware User Manual

Rev.

Introduction

Thank you for purchasing the TB-6V-LX760-LSI board. Before using the product, be sure to carefully

read this user manual and fully understand how to correctly use the product. First read through this

manual, and then always keep it handy.

SAFETY PRECAUTIONS Besuretoobservethese precautions

Observe the precautions listed below to prevent injuries to you, other personnel or damage to property.

Before using the product, read these safety precautions carefully to assure safe use.

These precautions contain serious safety instructions that must be observed.

After reading through this manual, be sure to always keep it handy.

The following conventions are used to indicate the possibility of injury/damage and classify precautions if

the product is handled incorrectly.

Indicates the high possibility of serious injury or death if the product is handled

incorrectly.

Indicates the possibility of serious injury or death if the product is handled

incorrectly.

Indicates the possibility of injury or physical damage in connection with property if

the product is handled incorrectly.

The following graphical symbols are used to indicate and classify precautions in this manual.

(Examples)

Turn off the power switch.

Do not disassemble the product.

Do not attempt this.

Danger

Warning

Caution

TB-6V-LX760-LSI Hardware User Manual

Rev.

In the event of a failure, disconnect the power supply.

If the product is used as is, a fire or electric shock may occur. Disconnect the power supply

immediately and contact technical support.

If an unpleasant smell or smoking occurs, disconnect the power supply.

If the product is used as is, a fire or electric shock may occur. Disconnect the power supply

immediately. After verifying that no smoking is observed, contact our sales personnel for

repair.

Do not disassemble, repair or modify the product.

Otherwise, a fire or electric shock may occur due to a short circuit or heat generation. For

inspection, modification or repair, contact our sales personnel.

Do not touch a cooling fan.

As a cooling fan rotates at high speed, do not put your hand close to it or touch it.

Otherwise, it may cause injury.

Do not place the product in an unstable position.

Otherwise, it may drop or fall, resulting in injury to persons or failure.

If the product is dropped or damaged, do not use it as is.

Otherwise, a fire or electric shock may occur.

Do not touch the product with a metallic object.

Otherwise, a fire or electric shock may occur.

Do not place the product in dusty or humid locations or where water may

splash on it.

Otherwise, a fire or electric shock may occur.

Do not get the product wet or touch it with a wet hand.

Otherwise, the product may be damaged and break down or it may cause a fire or electric

shock.

Do not touch a connector on the product (gold-plated portion).

Otherwise, the surface of a connector may be contaminated with sweat or skin oil, resulting

in contact failure of a connector or it may cause a malfunction, fire or electric shock due to

static electricity.

Warning

TB-6V-LX760-LSI Hardware User Manual

Rev.

Do not use or place the product in the following locations.

Humid and dusty locations

Airless locations such as closet or bookshelf

Locations which receive oily smoke or steam

Locations exposed to direct sunlight

Locations close to heating equipment

Closed inside of a car where the temperature becomes high

Static locations

Locations close to water or chemicals

Otherwise, a fire, electric shock, accident or deformation may occur due to a short circuit or heat

generation.

Do not place heavy things on the product.

Otherwise, the product may be damaged.

■Disclaimer

This product is a Xilinx Virtex6 FPGA evaluation board. Tokyo Electron Device Limited assumes no

responsibility for any damages resulting from the use of this product for purposes other than those

stated.

Even if the product is used properly, Tokyo Electron Device Limited assumes no responsibility for any

damages caused by:

(1) Earthquake, thunder, natural disaster or fire resulting from the use beyond our responsibility, acts by

a third party or other accidents, the customer’s willful or accidental misuse or use under other

abnormal conditions.

(2) Secondary impact arising from use of this product or its unusable state (business interruption or

others)

(3) Use of this product against the instructions given in this manual.

(4) Malfunctions due to connection to other devices.

Tokyo Electron Device Limited assumes no responsibility or liability for:

(1) Erasure or corruption of data arising from use of this product.

(2) Any consequences or other abnormalities arising from use of this product, or

(3) Damage of this product not due to our responsibility or failure due to modification

This product has been developed for research, testing or evaluation. It is not authorized for use in any

system or application that requires high reliability.

Repair of this product is carried out by replacing it on a chargeable basis, not repairing the faulty devices.

However, non-chargeable replacement is offered for initial failure if such notification is received within

two weeks after delivery of the product.

The specification of this product is subject to change without prior notice.

The product is subject to discontinuation without prior notice.

Caution

TB-6V-LX760-LSI Hardware User Manual

Rev.

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