Intel Celeron 847 Manuale utente

TECHNICAL MANUAL

Intel Celeron 847/807 + Intel NM70 Chipset

Based Mini-ITX M/B

NO. G03-NC9R-F

Revision: 1.0

Release date: January 28, 2013

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize

pollution and ensure environment protection of mother earth, please recycle.

ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii

USER’S NOTICE .......................................................................................................................iv

MANUAL REVISION INFORMATION.......................................................................................iv

ITEM CHECKLIST.....................................................................................................................iv

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD................................................................................1

1-2 SPECIFICATION.........................................................................................................2

1-3 LAYOUT DIAGRAM....................................................................................................3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING.....................................................................................................8

2-2 CONNECTORS AND HEADERS................................................................................11

2-2-1 CONNECTORS .............................................................................................11

2-2-2 HEADERS .....................................................................................................13

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP.....................................................................................................18

3-2 BIOS MENU SCREEN ................................................................................................19

3-3 FUNCTION KEYS .......................................................................................................19

3-4 GETTING HELP ..........................................................................................................20

3-5 MAIN BARS.................................................................................................................20

3-6 MAIN MENU................................................................................................................21

3-7 ADVANCED MENU.....................................................................................................22

3-8 CHIPSET MENU..........................................................................................................27

3-9 BOOT MENU...............................................................................................................31

3-10 SECURITY MENU.......................................................................................................33

3-11 SAVE & EXIT MENU...................................................................................................36

TABLE OF CONTENT

iii

Environmental Safety Instruction

zAvoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

z0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

zGenerally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from

the welding spots’ that connect components and PCB. Computer should go

through an adaptive phase before it boots when it is moved from a cold

environment to a warmer one to avoid condensation phenomenon. These water

drops attached on PCB or the surface of the components can bring about

phenomena as minor as computer instability resulted from corrosion and oxidation

from components and PCB or as major as short circuit that can burn the

components. Suggest starting the computer until the temperature goes up.

zThe increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher

temperature in the inner of the case.

zAttention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

USER’S NOTICE

INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED

OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN

PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE

DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME

WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY

KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL

DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,

INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE

REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE

USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT

INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

1.0 First Edition 2013-01-28

Item Checklist

5Motherboard

5DVD for motherboard utilities

5User’s Manual

5Cable(s)

5I/O Back panel shield

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard

zIntel®Celeron 847/807 processor+ Intel®NM70 express chipset

zSupport 2 * DDRIII SO-DIMM 1066-1333 MHz up to 16GB and dual channel

function

zSupport PCI Express x16 and Mini-PCIE slot

zIntegrated with 24-bit dual channel LVDS header

zSupport 3 * Serial ATAII (3Gb/s) & 1 * Serial ATAIII (6Gb/s) Devices

zHDMI, DVI-D and VGA Video Outputs

zSupport CPU Smart FAN

zSupports ACPI S3 Function

zCompliance with EuP Standard

zSupport Watchdog Timer Technology

zSupport Windows8 OS

1-2 Specification

Spec Description

Design z6-layer Mini-ITX form factor ;

zPCB size: 17.0x17.0cm

Embedded CPU

zIntel®Celeron 847 Dual Core Processor (1.1GHz)/Intel®

Celeron 807 Single Core Processor (1.0GHz), depending on

project

Chipset zIntel®NM70 Express Chipset

Memory Slot

zDDRIII SO-DIMM slot x2

zSupport DDRIII 1066/1333 MHz DDRIII SO-DIMM

expandable to 16GB

zSupport dual channel function

Expansion Slot z1 pcs of PCI Express x16 slot

z1 pcs of halt-size Mini-PCIE slot

LAN Chip

zIntegrated with Realtek RTL8111F PCI-E Gigabit LAN chip

zSupport Fast Ethernet LAN function of providing

10/100/1000Mbps Ethernet data transfer rate

Audio Chip zRealtek ALC662 6-channel Audio Codec integrated

zAudio driver and utility included

BIOS z32M DIP Flash ROM

Multi I/O

Rear Panel I/O:

zCOM port connector x 2

zHDMI port connector x1

zDVI-D port connector x 1

zVGA port connector x1

zUSB 2.0 port connector x4

zRJ-45 LAN connector x1

zAudio connector x3 (Line-in, Line-out, MIC)

Internal I/O Connectors& Headers

z24-Pin ATXPWR connector x 1

zSATAII Connector x3

zSATAIII Connector x1

zFront panel audio header x1

zFront panel header x1

zPWRLED & Speaker header x1

zLVDS header x1

zLVDS Inverter header x1

z4-Pin USB 2.0 header x1 (support one expansion USB 2.0

ports)

z9-Pin USB 2.0 header x1 (support two expansion USB 2.0

ports)

1-3 Layout Diagram

Rear IO Diagram

MIC-IN

VGA Port

Line-IN

Line-OUT

HDMI Port

RJ-45 LAN Port

DVI-D Port

USB 2.0 Ports

Serial Port

PS2 KB & MS Combo Port

Motherboard Internal Diagram

USB 2.0 Heade

ATX Power connector

DDRIII SODIMM Slo

x 2

（DDRIII 1066

1333）

DVI-D Port

over VGA Port

Audio Connecto

Intel Celeron

847/807 CPU

Intel NM70 Chi

set

PCI Express x16 Slot

CPUFAN Header

PS/2 KB & MS

Combo Port

over USB 2.0 Ports

LVDS Heade

Front Panel

Audio Heade

Front Panel Heade

YSFAN2 Header

SATAII Po

(

SATA2/3/4

)

RJ-45 Port over

USB 2.0 Ports

Serial Ports

ini-PCIE Slo

HDMI Port

LVDS Inverte

SYSFA

eade

SATAIII Port

(

SATA1

)

PWRLED Header/

eaker Heade

LAN Activity

LED Header

Motherboard Jumper Position

JBAT

JP1

COPEN JP2

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