Intel DG45ID - CARACTERISTIQUES TECHNIQUES Guida alla configurazione

une

2008

Order Number: E35960-001US

The Intel®Desktop Board DG45ID may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current

characterized errata are documented in the Intel Desktop Board DG45ID Specification Update.

Intel® Desktop Board

DG45ID

Technical Product Specification

Revision History

Revision Revision History Date

-001 First release of the Intel®Desktop Board DG45ID Technical Product

Specification.

June 2008

This product specification applies to only the standard Intel®Desktop Board DG45ID with BIOS

identifier IDG4510H.86A.

Changes to this specification will be published in the Intel Desktop Board DG45ID Specification

Update before being incorporated into a revision of this document.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE,

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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”

or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for

conflicts or incompatibilities arising from future changes to them.

Intel®desktop boards may contain design defects or errors known as errata, which may cause the product

to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your

product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel

literature, may be obtained from:

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* Other names and brands may be claimed as the property of others.

iii

Preface

This Technical Product Specification (TPS) specifies the board layout, components,

connectors, power and environmental requirements, and the BIOS for the Intel®

Desktop Board DG45ID. It describes the standard product and available

manufacturing options.

Intended Audience

The TPS is intended to provide detailed, technical information about the Intel Desktop

Board DG45ID and its components to the vendors, system integrators, and other

engineers and technicians who need this level of information. It is specifically not

intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardware used on the board

2 A map of the resources of the board

3 The features supported by the BIOS Setup program

4 A description of the BIOS error messages, beep codes, and POST codes

5 Regulatory compliance and battery disposal information

Typographical Conventions

This section contains information about the conventions used in this specification. Not

all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings



NOTE

Notes call attention to important information.

INTEGRATOR’S NOTES

Integrator’s notes are used to call attention to information that may be useful to

system integrators.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DG45ID Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)

GB Gigabyte (1,073,741,824 bytes)

GB/sec Gigabytes per second

Gbit Gigabit (1,073,741,824 bits)

KB Kilobyte (1024 bytes)

Kbit Kilobit (1024 bits)

kbits/sec 1000 bits per second

MB Megabyte (1,048,576 bytes)

MB/sec Megabytes per second

Mbit Megabit (1,048,576 bits)

Mbit/sec Megabits per second

xxh An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V Volts. Voltages are DC unless otherwise specified.

* This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

Contents

1Product Description .............................................................. 9

1.1 Overview.......................................................................................... 9

1.1.1 Feature Summary .................................................................. 9

1.1.2 Board Layout ....................................................................... 11

1.1.3 Block Diagram ..................................................................... 13

1.2 Legacy Considerations...................................................................... 14

1.3 Online Support................................................................................ 14

1.4 Processor ....................................................................................... 14

1.5 System Memory .............................................................................. 16

1.5.1 Memory Configurations ......................................................... 17

1.6 Intel®G45 Express Chipset.............................................................. 19

1.6.1 Intel G45 Graphics Subsystem ............................................... 19

1.6.2 Intel®Viiv™ Processor Technology.......................................... 22

1.6.3 USB ................................................................................... 23

1.6.4 Serial ATA Interfaces ............................................................ 23

1.7 Real-Time Clock Subsystem .............................................................. 25

1.8 Legacy I/O Controller....................................................................... 26

1.8.1 Consumer Infrared (CIR)....................................................... 26

1.8.2 Serial Port ........................................................................... 26

1.9 Audio Subsystem............................................................................. 27

1.9.1 Audio Subsystem Software .................................................... 28

1.9.2 Audio Connectors and Headers ............................................... 28

1.10 LAN Subsystem............................................................................... 29

1.10.1 Intel®82567LF Gigabit Ethernet Controller............................... 29

1.10.2 LAN Subsystem Software....................................................... 30

1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 30

1.11 Hardware Management Subsystem .................................................... 31

1.11.1 Hardware Monitoring and Fan Control...................................... 31

1.11.2 Fan Monitoring..................................................................... 31

1.11.3 Chassis Intrusion and Detection.............................................. 31

1.11.4 Thermal Monitoring .............................................................. 32

1.12 Power Management ......................................................................... 33

1.12.1 ACPI................................................................................... 33

1.12.2 Hardware Support ................................................................ 36

1.12.3 ENERGY STAR* .................................................................... 40

2Technical Reference............................................................ 41

2.1 Memory Map................................................................................... 41

2.1.1 Addressable Memory............................................................. 41

2.2 Connectors and Headers................................................................... 44

2.2.1 Back Panel Connectors .......................................................... 45

2.2.2 Component-side Connectors and Headers ................................ 46

2.3 Jumper Block .................................................................................. 55

Intel Desktop Board DG45ID Technical Product Specification

2.4 Mechanical Considerations ................................................................ 57

2.4.1 Form Factor......................................................................... 57

2.5 Electrical Considerations................................................................... 58

2.5.1 Power Supply Considerations ................................................. 58

2.5.2 Fan Header Current Capability................................................ 58

2.5.3 Add-in Board Considerations .................................................. 59

2.6 Thermal Considerations.................................................................... 59

2.7 Reliability ....................................................................................... 61

2.8 Environmental ................................................................................ 61

3Overview of BIOS Features ................................................. 63

3.1 Introduction ................................................................................... 63

3.2 BIOS Flash Memory Organization....................................................... 64

3.3 Resource Configuration .................................................................... 64

3.3.1 PCI* Autoconfiguration.......................................................... 64

3.4 System Management BIOS (SMBIOS)................................................. 65

3.5 Legacy USB Support ........................................................................ 66

3.6 BIOS Updates ................................................................................. 67

3.6.1 Language Support ................................................................ 67

3.6.2 Custom Splash Screen .......................................................... 67

3.7 BIOS Recovery................................................................................ 68

3.8 Boot Options................................................................................... 69

3.8.1 CD-ROM Boot ...................................................................... 69

3.8.2 Network Boot....................................................................... 69

3.8.3 Booting Without Attached Devices........................................... 69

3.8.4 Changing the Default Boot Device During POST ........................ 69

3.9 Adjusting Boot Speed....................................................................... 70

3.9.1 Peripheral Selection and Configuration..................................... 70

3.9.2 BIOS Boot Optimizations ....................................................... 70

3.10 BIOS Security Features .................................................................... 71

4Error Messages and Beep Codes ......................................... 73

4.1 Speaker ......................................................................................... 73

4.2 BIOS Beep Codes ............................................................................ 73

4.3 BIOS Error Messages ....................................................................... 73

4.4 Port 80h POST Codes ....................................................................... 74

5Regulatory Compliance and Battery Disposal Information .. 79

5.1 Regulatory Compliance..................................................................... 79

5.1.1 Safety Standards.................................................................. 79

5.1.2 European Union Declaration of Conformity Statement................ 80

5.1.3 Product Ecology Statements................................................... 81

5.1.4 EMC Regulations .................................................................. 85

5.1.5 Product Certification Markings (Board Level)............................. 86

5.2 Battery Disposal Information............................................................. 87

Contents

vii

Figures

Figure 1. Major Board Components............................................................... 11

Figure 2. Block Diagram.............................................................................. 13

Figure 3. Memory Channel and DIMM Configuration ........................................ 18

Figure 4. Back Panel Audio Connector Options................................................ 28

Figure 5. LAN Connector LED Locations ......................................................... 30

Figure 6. Thermal Sensors and Fan Headers .................................................. 32

Figure 7. Location of the Standby Power Indicator LED .................................... 40

Figure 8. Detailed System Memory Address Map............................................. 42

Figure 9. Back Panel Connectors .................................................................. 45

Figure 10. Component-side Connectors and Headers....................................... 46

Figure 11. Connection Diagram for Front Panel Header.................................... 52

Figure 12. Connection Diagram for Front Panel USB Headers............................ 54

Figure 13. Connection Diagram for IEEE 1394a Header.................................... 54

Figure 14. Location of the Jumper Block ........................................................ 55

Figure 15. Board Dimensions....................................................................... 57

Figure 16. Localized High Temperature Zones ................................................ 60

Tables

Table 1. Feature Summary............................................................................ 9

Table 2. Board Components Shown in Figure 1............................................... 12

Table 3. Supported Memory Configurations.................................................... 16

Table 5. HDMI Port Status Conditions ........................................................... 21

Table 6. DVI Port Status Conditions.............................................................. 21

Table 7. Audio Jack Retasking Support.......................................................... 27

Table 8. LAN Connector LED States .............................................................. 30

Table 9. Effects of Pressing the Power Switch................................................. 33

Table 10. Power States and Targeted System Power ....................................... 34

Table 11. Wake-up Devices and Events......................................................... 35

Table 12. System Memory Map .................................................................... 43

Table 13. Component-side Connectors and Headers Shown in Figure 10 ............ 47

Table 14. HD Audio Link Header................................................................... 48

Table 15. Front Panel Audio Header.............................................................. 48

Table 16. Serial ATA Connectors .................................................................. 48

Table 17. Serial Port Header........................................................................ 48

Table 18. Chassis Intrusion Header .............................................................. 49

Table 19. Front and Rear Chassis (3-Pin) Fan Headers..................................... 49

Table 20. Processor (4-Pin) Fan Header......................................................... 49

Table 21. Back Panel CIR Emitter (Output) Header ......................................... 49

Table 22. Front Panel CIR Receiver (Input) Header ......................................... 49

Table 23. S/PDIF Connector ........................................................................ 50

Table 24. Auxiliary Front Panel Power/Sleep LED Header ................................. 50

Table 25. Processor Core Power Connector .................................................... 51

Table 26. Main Power Connector .................................................................. 51

Table 27. Front Panel Header....................................................................... 52

Intel Desktop Board DG45ID Technical Product Specification

viii

Table 28. States for a One-Color Power LED .................................................. 53

Table 29. States for a Two-Color Power LED .................................................. 53

Table 30. BIOS Setup Configuration Jumper Settings ...................................... 56

Table 31. Recommended Power Supply Current Values.................................... 58

Table 32. Fan Header Current Capability ....................................................... 58

Table 33. Thermal Considerations for Components.......................................... 60

Table 34. Intel®Desktop Board DG45ID Environmental Specifications........ 61

Table 35. BIOS Setup Program Menu Bar ...................................................... 64

Table 36. BIOS Setup Program Function Keys ................................................ 64

Table 37. Acceptable Drives/Media Types for BIOS Recovery............................ 68

Table 38. Boot Device Menu Options............................................................. 69

Table 39. Supervisor and User Password Functions ......................................... 71

Table 40. Beep Codes................................................................................. 73

Table 41. BIOS Error Messages.................................................................... 73

Table 42. Port 80h POST Code Ranges .......................................................... 74

Table 43. Port 80h POST Codes.................................................................... 75

Table 44. Typical Port 80h POST Sequence .................................................... 78

Table 45. Safety Standards ......................................................................... 79

Table 46. Lead-Free Board Markings............................................................. 84

Table 47. EMC Regulations .......................................................................... 85

Table 48. Product Certification Markings........................................................ 86

1Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the Intel Desktop Board DG45ID.

Table 1. Feature Summary

Form Factor Micro-ATX (9.60 inches by 9.60 inches [243.84 millimeters by

243.84 millimeters])

Processor Support for the following:

•Intel®Core™2 Quad processor in an LGA775 socket

•Intel®Core™2 Duo processor in an LGA775 socket

•Intel®Pentium®Dual-Core processor in an LGA775 socket

•Intel®Celeron®Dual-Core processor in an LGA775 socket

•Intel®Celeron®processor 400 Sequence in an LGA775 socket

Memory •Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets

•Support for DDR2 800 MHz or DDR2 667 MHz DIMMs

•Support for up to 8 GB of system memory using DDR2 800 MHz or DDR2 667

MHz DIMMs

Chipset Intel®G45 Express Chipset, consisting of:

•Intel®82G45 Graphics and Memory Controller Hub (GMCH)

•Intel®82801JR I/O Controller Hub (ICH10R)

Audio 8-channel (7.1) audio subsystem using the IDT* 92HD73E high definition audio

codec and Dolby* Home Theater certification

Video Intel® Graphics Media Accelerator X4500HD (Intel®GMA X4500HD) onboard

graphics subsystem.

Legacy I/O Control Legacy I/O controller for serial port header and Consumer Infrared (CIR)

Peripheral

Interfaces

•Twelve USB 2.0 ports: six back panel connectors and six front panel headers

•Two IEEE-1394a interfaces: one back panel connector and one front-panel

header

•Six Serial ATA (3 Gbps) interfaces, including one red-colored external Serial

ATA (eSATA) interface on the back panel

•One serial port header (may require specialized chassis or cable for use)

LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel®82567LF

Gigabit Ethernet Controller

BIOS •Intel®BIOS (resident in the SPI Flash device)

•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,

and SMBIOS

continued

Intel Desktop Board DG45ID Technical Product Specification

Table 1. Feature Summary (continued)

Instantly Available

PC Technology

•Support for PCI* Local Bus Specification Revision 2.3

•Support for PCI Express* Revision 1.0a

•Suspend to RAM support

•Wake on PCI, RS-232, front panel, USB ports, LAN, and CIR

Expansion

Capabilities

•One PCI Express 2.0 x16 bus add-in card connector

•Two PCI Express x1 bus add-in card connectors

•One PCI Conventional bus connector

Hardware Monitor

Subsystem

•Intel®Quiet System Technology implemented through the Intel®Management

Engine (Intel®MEI) in ICH10R

•Voltage sense to detect out of range power supply voltages

•Thermal sense to detect out of range thermal values

•Three fan headers

•Three fan sense inputs used to monitor fan activity

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