Intel Xeon Guida

Intel®Xeon™ Processor and

Intel®E7500/E7501 Chipset

Compatible Platform

Design Guide Addendum for Embedded Applications

July 2003

Order Number: 273707-004

2Platform Design Guide Addendum

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The Intel®Xeon™ Processor with 512 KB L2 Cache, the Intel®E7500 chipset and the Intel®7501 chipset may contain design defects or errors known

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Platform Design Guide Addendum 3

Contents

1.0 Introduction......................................................................................................................................7

1.1 Reference Documentation....................................................................................................7

2.0 Uni-processor System Bus Routing Guidelines...............................................................................9

2.1 Routing Guidelines for the 2X and 4X Signal Groups.........................................................11

2.1.1 Design Recommendations.....................................................................................12

2.2 Routing Guidelines for Common Clock Signals..................................................................13

2.2.1 Wired-OR Signals..................................................................................................13

2.3 Routing Guidelines for Asynchronous GTL+ and Miscellaneous Signals...........................14

2.3.1 Asynchronous GTL+ Signals Driven by the Processor..........................................15

2.3.1.1 Voltage Translation for FERR#..............................................................15

2.3.1.2 Proper THERMTRIP# Usage.................................................................16

2.3.2 Asynchronous GTL+ Signals Driven by the Chipset..............................................17

2.3.2.1 Voltage Translation for INIT#.................................................................17

2.3.3 BR[3:0] Routing Guidelines for Uni-processor Designs.........................................18

3.0 Memory Interface Routing Guidelines ...........................................................................................21

3.1 DIMM Types .......................................................................................................................22

3.2 Dual Channel DDR Overview .............................................................................................22

3.2.1 Dual Channel Source Synchronous Signal Group Routing ...................................23

3.2.2 Dual Channel Command Clock Routing................................................................25

3.2.3 Dual Channel Source Clocked Signal Group Routing ...........................................26

3.2.4 Dual Channel Chip Select Routing ........................................................................27

3.2.5 Dual Channel Clock Enable Routing .....................................................................28

3.2.6 2.5 Volt Decoupling Requirements ........................................................................28

3.3 Single Channel DDR Overview...........................................................................................30

3.3.1 Unused Channel B.................................................................................................31

3.3.2 Single Channel Source Synchronous Signal Group Routing.................................32

3.3.3 Single Channel Command Clock Routing..............................................................36

3.3.4 Single Channel Source Clocked Signal Group Routing.........................................37

3.3.5 Single Channel Chip Select Routing......................................................................38

3.3.6 Single Channel Clock Enable Routing...................................................................39

3.3.7 Single Channel DC Biasing Signals.......................................................................40

3.3.7.1 Single Channel Receive Enable Signal (RCVEN#) ...............................40

3.3.7.2 Single Channel DDRCOMP...................................................................41

3.3.7.3 Single Channel DDRVREF and ODTCOMP..........................................41

3.3.7.4 Single Channel DDRCVO......................................................................41

3.3.8 Single Channel DDR Signal Termination and Decoupling.....................................42

3.3.9 2.5 V Decoupling Requirements............................................................................42

4Platform Design Guide Addendum

Contents

Figures

1 Uni-processor System Bus Topology.........................................................................................10

2 Topology for Asynchronous GTL+ Signals Driven by the Processor..........................................15

3 FERR# Routing Topology for Low Voltage Intel®Xeon™ Processors.......................................16

1 Recommended THERMTRIP# Circuit........................................................................................16

4 Topology for Asynchronous GTL+ Signals Driven by the Chipset..............................................17

5 INIT# Routing Topology for a Uni-processor System.................................................................18

6 Voltage Translator Circuit...........................................................................................................18

7 BR[3:0]# Connection for UP Configuration.................................................................................19

8 DIMM Connector Styles Supported............................................................................................22

9 1-DIMM per Channel Implementation.........................................................................................23

10 2-DIMMs per Channel Implementation.......................................................................................23

11 Dual Channel 2-DIMM Command Clock Topology.....................................................................26

12 1-DIMM Per Channel Decoupling...............................................................................................29

13 2-DIMMs Per Channel Decoupling.............................................................................................30

14 Single Channel 2-DIMM Implementation....................................................................................31

15 Single Channel 4-DIMM Implementation....................................................................................31

16 Single Channel Source Synchronous Topology DIMM Solution ................................................35

17 Trace Length Matching Requirements for Single Channel Source Synchronous Routing.........35

18 Single Channel 2-DIMM Command Clock Topology..................................................................36

19 SIngle Channel Source Clocked Signal Topology......................................................................37

20 Single Channel Chip Select Topology........................................................................................38

21 Single Channel CKE Topology...................................................................................................39

22 Single Channel Receive Enable Signal Routing Guidelines.......................................................40

23 Single Channel DDRCOMP Resistive Compensation................................................................41

24 Single Channel DDRCVO Single Channel Routing Guidelines..................................................42

25 Single Channel 2-DIMM Decoupling ..........................................................................................43

26 Single Channel 4-DIMM Decoupling ..........................................................................................44

Tables

1 Reference Documents..................................................................................................................7

2 System Bus Signal Groups...........................................................................................................9

3 Uni-processor System Bus Routing Summary ...........................................................................10

4 2X and 4X Signal Groups...........................................................................................................11

5 Source Synchronous Signals and Associated Strobes ..............................................................11

6 Common Clock Signals ..............................................................................................................13

7 Asynchronous GTL+ and Miscellaneous Signals.......................................................................14

8 Dual Channel Source Synchronous Signal Group Routing Guidelines......................................24

9 Dual Channel Command Clock Pair Routing Guidelines ...........................................................25

10 Dual Channel Source Clocked Signal Group Routing Guidelines..............................................26

11 Dual Channel Chip Select Routing Guidelines...........................................................................27

12 Dual Channel Clock Enable Routing Guidelines ........................................................................28

13 Channel B Signal Terminations..................................................................................................32

14 Single Channel DQ/CB to DQS Mapping ...................................................................................32

15 Single Channel Source Synchronous Signal Group Routing Guidelines ...................................34

16 Single Channel Command Clock Pair Routing Guidelines.........................................................36

Platform Design Guide Addendum 5

Contents

17 Single Channel Source Clocked Signal Group Routing Guidelines............................................37

18 Single Channel Chip Select Routing Guidelines.........................................................................38

19 Single Channel Clock Enable Routing Guidelines......................................................................39

20 Single Channel Receive Enable Routing Guidelines..................................................................40

21 DDRCOMP Routing Guidelines..................................................................................................41

22 DDRCVO Routing Guidelines.....................................................................................................42

Revision History

Date Revision Description

July 2003 -004 Updated memory interface routing information and added Low

Voltage Intel®XeonTM processor information.

January 2003 -003 Updated and expanded memory interface routing information.

Added E7501 chipset information.

June 2002 -002 Document Update

January 2002 -001 Initial Release

6Platform Design Guide Addendum

Contents

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Intel®Xeon™ Processor and Intel®E7500/E7501 Chipset Compatible Platform

Platform Design Guide Addendum 7

1.0 Introduction

This document is an addendum to the Intel®Xeon™ Processor and Intel®E7500/E7501 Chipset

Compatible Platform Design Guide. It contains applied computing-specific guidelines, such as uni-

processor design guidelines, angled Double Data Rate (DDR) guidelines and single channel DDR

guidelines.

Carefully follow the design information and recommendations provided in this document. These

design guidelines have been developed to ensure maximum flexibility for system designers while

reducing the risk of board-related issues.

Note that the guidelines recommended in this document are based on experience and preliminary

simulation work done at Intel.

1.1 Reference Documentation

Table 1. Reference Documents (Sheet 1 of 2)

Document Location

Intel®E7501 Chipset Memory Controller Hub (MCH)

Datasheet http://developer.intel.com/design/chipsets/datashts/

251927.htm

Intel®Xeon™ Processor and Intel®E7500/E7501

Chipset Compatible Platform Design Guide http://developer.intel.com/design/chipsets/designex/

251929.htm

Intel®Xeon™ Processor with 512 KB L2 Cache and

Intel E7500 Chipset Platform Design Guide http://developer.intel.com/design/chipsets/e7500/

guides/298649.htm

Intel®Xeon™ Processor with 512 KB L2 Cache at

1.80 GHz to 2.40 GHz Datasheet http://developer.intel.com/design/Xeon/datashts/

298642.htm

Intel®E7500 Chipset Memory Controller Hub (MCH)

Datasheet http://developer.intel.com/design/chipsets/e7500/

datashts/290730.htm

Intel®82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2)

Datasheet http://developer.intel.com/design/chipsets/e7500/

datashts/290732.htm

Intel 82801CA I/O Controller Hub 3 (ICH-3) Datasheet http://developer.intel.com/design/chipsets/e7500/

datashts/290733.htm

Intel®82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2)

Specification Update http://www.intel.com/design/chipsets/e7500/

specupdt/290735.htm

Intel®82801CA I/O Controller Hub 3 (ICH3-S)

Specification Update http://www.intel.com/design/chipsets/e7500/

specupdt/290739.htm

603-Pin Socket Design Guidelines http://developer.intel.com/design/Xeon/guides/

249672.htm

VRM 9.1 DC-DC Converter Design Guidelines http://developer.intel.com/design/Xeon/guides/

298646.htm

Intel®Xeon™ Processor Voltage Regulator Down

(VRD) Design Guidelines http://developer.intel.com/design/Xeon/guides/

298644.htm

Intel®Xeon™ Processor with 512 KB L2 Cache

System Compatibility Guidelines http://developer.intel.com/design/Xeon/guides/

298645.htm

Intel®Xeon™ Processor Thermal Design Guidelines http://developer.intel.com/design/Xeon/guides/

298348.htm

Intel®E7500 Chipset Thermal and Mechanical Design

Guidelines http://developer.intel.com/design/chipsets/e7500/

guides/298647.htm

Intel®Xeon™ Processor and Intel®E7500/E7501 Chipset Compatible Platform

8Platform Design Guide Addendum

Intel®Xeon™ Processor Thermal Solution Functional

Specifications http://developer.intel.com/design/Xeon/applnots/

249673.htm

Intel®Xeon™ Processor with 512 KB L2 Cache

Thermal Models http://developer.intel.com/design/Xeon/devtools/

Intel®Xeon™ Processor with 512 KB L2 Cache

Mechanical Model in IGES http://developer.intel.com/design/Xeon/devtools/

Intel®Xeon™ Processor with 512 KB L2 Cache

Mechanical Model in ProE* Format http://developer.intel.com/design/Xeon/devtools/

AP-728 Intel ® ICH Family Real Time Clock (RTC)

Accuracy and Considerations Under Test Conditions http://developer.intel.com/design/chipsets/applnots/

292276.htm

ITP700 Debug Port Design Guide http://developer.intel.com/design/Xeon/guides/

249679.htm

Intel®Xeon™ Processor with 512 KB L2 Cache Signal

Integrity Models http://developer.intel.com/design/Xeon/devtools

PCI Bus Power Management Interface Specification,

Revision 1.1 http://www.pcisig.com/specifications/conventional/

pci_bus_power_management_interface

PCI Hot Plug Specification, Revision 1.1 http://www.pcisig.com/specifications/conventional/

pci_hot_plug

PCI Local Bus Specification, Revision 2.2 http://www.pcisig.com/specifications/conventional/

conventional_pci

PCI-PCI Bridge Architecture Specification, Revision

1.1 http://www.pcisig.com/specifications/conventional/

pci_to_pci_bridge_architecture

PCI Standard Hot-Plug Controller and Subsystem

Specification, Revision 1.0 http://www.pcisig.com/specifications/conventional/

pci_hot_plug

PCI-X Specification, Revision 1.0a http://www.pcisig.com/specifications/pcix_20/pci_x/

System Management Bus Specification (SMBus),

Revision 1.1 http://www.sbs-forum.org/

Universal Serial Bus Specification, Revision 1.1 http://www.usb.org/developers/docs/

Low Voltage Intel®XeonTM processor at 1.6 GHz and

2.0 GHz Datasheet http://www.intel.com/design/intarch/datashts/

273766.htm

Intel®XeonTM processor with 533 MHz System Bus at

2.0 GHz to 2.8 GHz Datasheet http://www.intel.com/design/xeon/datashts/

252135.htm

Low Voltage Intel®XeonTM processor for Embedded

Applications Thermal Design Guidelines http://www.intel.com/design/intarch/designgd/

273764.htm

Table 1. Reference Documents (Sheet 2 of 2)

Document Location

Intel®Xeon™ Processor and Intel®E7500/E7501 Chipset Compatible Platform

Platform Design Guide Addendum 9

2.0 Uni-processor System Bus Routing Guidelines

This section covers the system bus source synchronous (data, address, and associated strobes) and

common clock signal routing for Intel®Xeon™ processor with 512 KB L2 cache (400/533 MHz

FSB)/Low Voltage Intel®Xeon™ processor (400 MHz FSB) and Intel®E7500/E7501 chipset-

based systems, in a uni-processor (UP) configuration. Table 2 lists the signals and their

corresponding signal types.

Figure 1 describes the uni-processor system bus topology.

Table 2. System Bus Signal Groups

Signal Group Type Signals

AGTL+ Common Clock Input Synchronous to BCLK BPRI#, BR[3:1]#1,2, DEFER#, RESET#1,

RS[2:0]#, RSP#, TRDY#

AGTL+ Common Clock I/O Synchronous to BCLK

ADS#, AP[1:0]#, BINIT#3, BNR#3,

BPM[5:0]#1, BR0#1, DBSY#, DP[3:0]#,

DRDY#, HIT#3, HITM#3, LOCK#,

MCERR#3

AGTL+ Source Synchronous I/O:

4X Group Synchronous to

associated strobe D[63:0]#, DBI[3:0]#

AGTL+ Source Synchronous I/O:

2X Group Synchronous to

associated strobe A[35:3]#4, REQ[4:0]#

AGTL+ Strobes Synchronous to BCLK

[1:0] ADSTB[1:0]#, DSTBN[3:0]#, DSTBP[3:0]#

Async GTL+ Input1Asynchronous A20M#, IGNNE#, INIT#4, LINT0/INTR,

LINT1/ NMI, PWRGOOD, SMI#4, SLP#,

STPCLK#

Async GTL+ Output1Asynchronous FERR#, IERR#, THERMTRIP#,

PROCHOT#7

System Bus Clock Clock BCLK0, BCLK1

TAP Input6Synchronous to TCK TCK, TDI, TMS, TRST#

TAP Output6Synchronous to TCK TDO

SMBus Interface1Synchronous to SM_CLK SM_EP_A[2:0], SM_TS_A[1:0], SM_DAT,

SM_CLK, SM_ALERT#, SM_WP

Power/Other Power/Other

GTLREF[3:0], COMP[1:0], OTDEN,

RESERVED, SKTOCC#, TESTHI[6:0],

VID[4:0], VCC_CPU, SM_VCC5, VCCA,

VSSA, VCCIOPLL, VSS, VCCSENSE,

VSSSENSE

NOTES:

1. These signals do not have on-die termination on the processor. They must be terminated properly on the

system board. If the signal is not connected, it must be pulled to the appropriate voltage level through a 1

kΩ ± 5% resistor.

2. Xeon processors use only BR0# and BR1#.

3. These signals are ‘wired-OR’ signals and may be driven simultaneously by multiple agents. For further

details on how to implement wired-OR signals, refer to the routing guidelines in Section 2.2.1.

4. The value of these pins driving the active edge of RESET# determine processor configuration options.

5. SM_VCC has critical power sequencing requirements.

6. Terminations and routing for TAP signals and all debug port signals are found in the ITP700 Debug Port

Design Guide.

7. PROCHOT# is input/output on Low Voltage Intel® Xeon™ processor D-stepping and beyond.

Intel®Xeon™ Processor and Intel®E7500/E7501 Chipset Compatible Platform

10 Platform Design Guide Addendum

Refer to Table 3 for a summary of the uni-processor system bus routing recommendations. Use this

as a quick reference only. The following sections provide more information for each parameter.

Intel strongly recommends simulation of all signals to ensure that setup and hold times are met.

Figure 1. Uni-processor System Bus Topology

A9044-01

Processor MCH

Pad

Length L1 = 3.5 - 10"

Pad

Note: Package trace

Motherboard PCB trace

Table 3. Uni-processor System Bus Routing Summary

Parameter Platform Routing Guidelines

Trace width/spacing 5/15 mils

4X signal group line lengths 3.5“– 10“pin-to-pin

Length must be added to the system board trace between agents to

compensate for the stub created by the processor package

DSTBn/p[3:0]# line lengths DSTB# signals should follow the same routing rules as the data signals

A 25 mil spacing should be maintained around each strobe signal (between

DSTBp# and DSTBn#, and any other signal.)

2X signal group line lengths Address signals should follow the same routing rules as the data signals.

ADSTB[1:0]# line lengths ADSTB# signals should follow the same routing rules as the DSTB# signals.

Common clock signal line

lengths Common clock signals should follow the same routing rules as the data

signals, however no length compensation is necessary.

Topology The processor must have on-die termination enabled.

Routing priorities All signals within the same strobe group must be routed on same layer for the

entire length of the bus.

Reference plane requirements

Ground reference only.

Avoid changing layers when routing system bus signals.

If a layer change must occur,use vias connecting the two reference planes to

provide a low impedance path for the return current. Vias should be as close

as possible to the signal via.

System board Impedance 50 Ω ± 10%

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