Murata LBEE58D1VF-TEMP Manuale utente

Preliminary Specification Number : SP-8D1VF-H

Preliminary & Confidential

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

W-LAN+Bluetooth Combo Module Data Sheet

Qualcomm Chipset QCA6390

for IEEE802.11a/b/g/n/ac/ax 2*2 MIMO + BT 5.1

Sample P/N : LBEE58D1VF-TEMP

Preliminary Specification Number : SP-8D1VF-H

1 / 31

Preliminary & Confidential

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

The revision history of the product specification

Revised No.

Revised Date

Note

2019.3.5

Initial Release

2019.3.29

2.1 Block Diagram Updated

3. ABSOLUTE MAXIMUM RATINGS Updated

4. OPERATING CONDITION Updated

5.1 Dimensions Update and <PIN SHAPE>

5.2 Pin Layput updated

9. LAND PATTERN (TOP VIEW) Updated

Added 5.3. Module PIN Descriptions

Added 6. POWER OF SEQUENCE

2019.5.29

5.1 UBM sizu Updated

2. Weight Updated

2019.6.3

5. Added Marking information(Tentative)

10. Added Dimensions of Tape(Tentative)

2019.7.1

2.1 Changed block diagram (remove xtal inside module)

5.1 Changed pin shape

5.2 Changed pin shape and pin description (XTALO->XTALI)

5.3 Changed pin description (XTALO->XTALI)

9 Changed pin shape

2019.8.23

3. ABSOLUTE MAXIMUM RATINGS updated

4. OPERATING CONDITION updated

2019.9.10

7. REFERENCE CIRCUIT

Added the latest circuit

10.TAPE AND REEL PACKING

(1) Dimensions of Tape (Plastic tape

Change tape dimensions for MP

(4) Leader and Tail tape

Changed packaging unit to 2000pcs/reel for MP

2019.12.15

8. ELECTRONICAL CHARACTERISTICS

Updated the value

2019.12.26

5.3 Revised pin description for terminal P1 and P2.

Preliminary Specification Number : SP-8D1VF-H

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Murata Manufacturing Co., Ltd.

TABLE OF CONTENTS

1. SCOPE..................................................................................................................................................... 3

2. KEY FEATURE ...................................................................................................................................... 3

2.1. Block Diagram .......................................................................................................................... 3

2.2. Ordering Information............................................................................................................... 3

2.3. RoHS Compliance..................................................................................................................... 3

3. ABSOLUTE MAXIMUM RATINGS...................................................................................................... 4

4. OPERATING CONDITION ................................................................................................................... 4

5. DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS ................................................. 5

5.1. Dimensions ............................................................................................................................... 5

5.2. Pin Layout................................................................................................................................. 7

5.3. Module PIN Descriptions....................................................................................................... 10

6. POWER OF SEQUENCE..................................................................................................................... 14

7. REFERENCE CIRCUIT....................................................................................................................... 15

8. ELECTORICAL CHARACTERISTICS (Chain 0/1) ........................................................................... 16

8.1. DC/RF Characteristics for IEEE802.11b - 2.4GHz.............................................................. 16

8.2. DC/RF Characteristics for IEEE802.11g - 2.4GHz .............................................................. 16

8.3. DC/RF Characteristics for IEEE802.11n - 2.4GHz.............................................................. 17

8.4. DC/RF Characteristics for IEEE802.11ax - 2.4GHz............................................................ 17

8.5. DC/RF Characteristics for IEEE802.11a - 5GHz ................................................................. 18

8.6. DC/RF Characteristics for IEEE802.11n(HT 20/40MHz) - 5GHz....................................... 18

8.7. DC/RF Characteristics for IEEE802. 11ac (VHT20/VHT40/VHT80) - 5GHz .................... 20

8.8. DC/RF Characteristics for IEEE802. 11ax (HE20/HE40/HE80) - 5GHz ........................... 21

8.9. DC/RF Characteristics for Bluetooth.................................................................................... 22

8.10. DC/RF Characteristics for Bluetooth（LE）.................................................................... 23

9. LAND PATTERN (TOP VIEW)............................................................................................................ 24

10. TAPE AND REEL PACKING........................................................................................................... 25

11. NOTICE............................................................................................................................................. 28

11.1. Storage Conditions: ............................................................................................................ 28

11.2. Handling Conditions: ......................................................................................................... 28

11.3. Standard PCB Design (Land Pattern and Dimensions):................................................. 28

11.4. Notice for Chip Placer: ....................................................................................................... 28

11.5. Soldering Conditions: ......................................................................................................... 29

11.6. Cleaning: ............................................................................................................................. 29

11.7. Operational Environment Conditions:.............................................................................. 29

11.8. Input Power Capacity:........................................................................................................ 30

12. PRECONDITION TO USE OUR PRODUCTS ............................................................................... 31

Please be aware that an important notice concerning availability, standard warranty and use in critical applications of

Murata products and disclaimers thereto appears at the end of this specification sheet.

Preliminary Specification Number : SP-8D1VF-H

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Preliminary & Confidential

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Murata Manufacturing Co., Ltd.

1. SCOPE

This specification is applied to the IEEE802.11a/b/g/n/ac/ax W-LAN + BT5.1 combo module.

2. KEY FEATURE

- Qualcomm QCA6390 inside

- Compliant with IEEE802.11a/b/g/n/ac/ax

- Supports W-LAN 2*2 MU-MIMO

- DBS(Dual band simultaneous) with dual MAC, up to 1774.5Mbps data rate (2*2 + 2*2, 11ax DBS)

- Compliant with BT specification

- 5G Rx Splitters inside for ANT sharing w/LAA

- Surface mount type 8.75 x 7.0 mm (Typical), H = 1.1 mm (Max)

- Extreme size efficient dual side mount structure with conformal shield.

- Weight : 0.19g

- MSL : 3

2.1. Block Diagram

2.2. Ordering Information

Ordering Part Number

Description

LBEE58D1VF-TEMP

In case of sample order

LBEE58D1VF-TEMP-D

EVK

2.3. RoHS Compliance

This module is compliant with the RoHS directive.

Preliminary Specification Number : SP-8D1VF-H

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Murata Manufacturing Co., Ltd.

3. ABSOLUTE MAXIMUM RATINGS

Parameter

min.

max.

Unit

Storage Temperature

-40

deg.C

Supply Voltage

RFA0P8_LDO_IN

-0.3

Vddx+0.2

RFA12_LDO_IN

-0.3

Vddx+0.2

RFA17_LDO_IN

-0.3

Vddx+0.2

PCIE0P92_LDO_IN

-0.3

Vddx+0.2

PCIE18_LDO_IN

-0.3

Vddx+0.2

CX_MX_BT_LDO_IN

-0.3

Vddx+0.2

AON_RFACMN_LDO_IN

-0.3

Vddx+0.2

VDD18_DIG_IO

-0.3

Vddx+0.2

VPH_PA_2G_CH0,

VPH_PA_2G_CH1,

VPH_PA_5G_CH0,

VPH_PA_5G_CH1

-0.3

5.25

* Vddx is the supply voltage associated with the input or output pin to whichthe test voltage is

applied.

* Stresses in excess of the absolute ratings may cause permanent damage. Functional operation

is not implied under these conditions. Exposure to absolute ratings for extended periods of time

may adversely affect reliability. No damage assuming only one parameter is set at limit at a time

with all other parameters are set within operating condition.

4. OPERATING CONDITION

Parameter

min.

typ.

max.

unit

Operating Temperature*1

-20

+75

deg.C

Supply Voltage

RFA0P8_LDO_IN

0.9

0.95

1.0

RFA12_LDO_IN

1.3

1.38

1.42

RFA17_LDO_IN

1.9

2.0

2.1

PCIE0P92_LDO_IN

1.28

1.35

1.45

PCIE18_LDO_IN

1.9

2.0

2.1

CX_MX_BT_LDO_IN

0.9

0.95

1.0

AON_RFACMN_LDO_IN

0.9

0.95

1.89

VDD18_DIG_IO

1.71

1.8

1.89

VPH_PA_2G_CH0,

VPH_PA_2G_CH1,

VPH_PA_5G_CH0,

VPH_PA_5G_CH1

3.0

3.85

4.6

* Functionality is guaranteed but specifications require derating at extreme temperatures.

Preliminary Specification Number : SP-8D1VF-H

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Preliminary & Confidential

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Murata Manufacturing Co., Ltd.

5. DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS

5.1. Dimensions

Preliminary Specification Number : SP-8D1VF-H

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Murata Manufacturing Co., Ltd.

(Marking information)

Lot No

2D code

1pin mark

Murata Logo

Module Type

Preliminary Specification Number : SP-8D1VF-H

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Murata Manufacturing Co., Ltd.

5.2. Pin Layout

Address

Net Name

0.325

0.35

GND

0.325

0.8

PCIE_TXN

0.325

1.25

GND

0.325

1.7

PCIE_RXP

0.325

2.15

GND

0.325

2.6

PCIE_REFCLKN

0.325

3.05

GND

0.325

3.5

WLAN_SW_CTRL

0.325

3.95

CLK_OUT_REF

A10

0.325

4.4

PCIE0P92_LDO_IN

A11

0.325

4.85

GND

A12

0.325

5.3

RFA0P8_LDO_IN

A13

0.325

5.75

CX_MX_BT_LDO_IN

A14

0.325

6.2

VDD18_DIG_IO

A15

0.325

6.65

GND

0.775

0.35

GND

0.775

0.8

PCIE_TXP

0.775

1.25

GND

0.775

1.7

PCIE_RXN

0.775

2.15

GND

0.775

2.6

PCIE_REFCLKP

0.775

3.05

GND

0.775

3.5

PCIE_CLKREQ#

0.775

3.95

WL_LED/PCIE_BAR_SIZE0

B10

0.775

4.4

GND

B11

0.775

4.85

PCIE18_LDO_IN

B12

0.775

5.3

GND

B13

0.775

5.75

CX_MX_BT_LDO_IN

Preliminary Specification Number : SP-8D1VF-H

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Murata Manufacturing Co., Ltd.

B14

0.775

6.2

GND

B15

0.775

6.65

RFA12_LDO_IN

1.225

0.35

PCIE_WAKE#

1.225

0.8

GND

C14

1.225

6.2

AON_RFACMN_LDO_IN

C15

1.225

6.65

GND

1.675

0.35

LF_CLK_IN

1.675

0.8

PCIE_RST#

D14

1.675

6.2

GND

D15

1.675

6.65

RFA17_LDO_IN

2.125

0.35

BT_I2S0_SDO/EDL_MODE

2.125

0.8

BT_I2S0_SCK/BT_SLIMBUS_CLK

E14

2.125

6.2

CLK_REQ_IN

E15

2.125

6.65

GND

2.575

0.35

BT_I2S0_SDI/BT_SLIMBUS_DATA

2.575

0.8

BT_I2S0_WS

F14

2.575

6.2

GND

F15

2.575

6.65

WLAN_EN

3.025

0.35

BT_SENS_RXD

3.025

0.8

BT_SENS_TXD/CPU_INIT_RESET

G14

3.025

6.2

GND

G15

3.025

6.65

BT_EN

3.475

0.35

XTAL_GND

3.475

0.8

XTAL_GND

H14

3.475

6.2

GND

H15

3.475

6.65

LAA_AS_EN

3.925

0.35

XTALI

3.925

0.8

XTAL_GND

J14

3.925

6.2

WL_PA_MUTE

J15

3.925

6.65

WL_TXEN

4.375

0.35

XTAL_GND

4.375

0.8

XTAL_GND

K14

4.375

6.2

LAA_TXEN

K15

4.375

6.65

LAA_RX

4.825

0.35

BT_UART_CTS

4.825

0.8

BT_UART_RXD

L14

4.825

6.2

GND

L15

4.825

6.65

GND

5.275

0.35

BT_UART_TXD

5.275

0.8

BT_UART_RTS

M14

5.275

6.2

GPS_COEX/PBL_BOOTSPEED_0

M15

5.275

6.65

CLK_REQ_OUT/PBL_FAST_BOOT

5.725

0.35

COEX_TXD/BOOT_FROM_ROM

5.725

0.8

COEX_RXD

N14

5.725

6.2

WL_UART_RXD

N15

5.725

6.65

WL_UART_RTS/PBL_AUTH_EN

6.175

0.35

HST_SLM_CH0_CTL0/CLK_REQ_0

6.175

0.8

HST_SLM_CH0_CTL1/CLK_REQ_1

P14

6.175

6.2

GND

P15

6.175

6.65

WL_UART_TXD/WDOG_DISABLE

6.625

0.35

HST_SLM_CH1_CTL0/PBL_BOOTSPEED_1

Preliminary Specification Number : SP-8D1VF-H

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6.625

0.8

HST_SLM_CH1_CTL1/XO_TCXO_SEL

Q14

6.625

6.2

GND

Q15

6.625

6.65

GND

7.075

0.35

GND

7.075

0.8

GND

R14

7.075

6.2

GND

R15

7.075

6.65

GND

7.525

0.35

5G_CH0_LTE-U_RX_AS

7.525

0.8

GND

S14

7.525

6.2

GND

S15

7.525

6.65

2G_CH1

7.975

0.35

GND

7.975

0.8

GND

7.975

1.25

VPH_PA_5G_CH0

7.975

1.7

GND

7.975

2.15

GND

7.975

2.6

GND

7.975

3.05

GND

7.975

3.5

GND

7.975

3.95

GND

T10

7.975

4.4

GND

T11

7.975

4.85

GND

T12

7.975

5.3

VPH_PA_5G_CH1

T13

7.975

5.75

GND

T14

7.975

6.2

GND

T15

7.975

6.65

GND

8.425

0.35

GND

8.425

0.8

GND

8.425

1.25

VPH_PA_2G_CH0

8.425

1.7

GND

8.425

2.15

2G_CH0

8.425

2.6

GND

8.425

3.05

GND

8.425

3.5

5G_CH0

8.425

3.95

GND

V10

8.425

4.4

5G_CH1_LTE-U_RX_AS

V11

8.425

4.85

GND

V12

8.425

5.3

VPH_PA_2G_CH1

V13

8.425

5.75

GND

V14

8.425

6.2

5G_CH1

V15

8.425

6.65

GND

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