Panasonic KX-TG4031CB Manuale utente

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of law.

ORDER NO. KM41003043CE

F22

Telephone Equipment

Model No. KX-TG4031CB

KX-TG4032CB

KX-TG4033CB

KX-TG4034CB

KX-TGA401CB

Expandable Digital Cordless Answering

System

B: Black Version

(for Canada)

KX-TG4031CB/KX-TG4032CB/KX-TG4033CB/KX-TG4034CB/KX-TGA401CB

TABLE OF CONTENTS

PAGE

1 Safety Precautions----------------------------------------------- 4

1.1. For Service Technicians --------------------------------- 4

2 Warning -------------------------------------------------------------- 4

2.1. Battery Caution--------------------------------------------- 4

2.2. About Lead Free Solder (PbF: Pb free)-------------- 4

2.3. Discarding of P. C. Board-------------------------------- 5

3 Specifications ----------------------------------------------------- 6

4 Location of Controls and Components ------------------- 7

5 Installation Instructions ---------------------------------------- 7

6 Operating Instructions------------------------------------------ 7

7 Schematic Diagram ---------------------------------------------- 8

7.1. For Schematic Diagram---------------------------------- 8

7.2. Schematic Diagram (Base Unit_Main) --------------10

7.3. Schematic Diagram (Base Unit_Operation) -------12

7.4. Schematic Diagram (Handset_Main) ----------------14

7.5. Schematic Diagram (Handset_LED)-----------------16

7.6. Schematic Diagram (Charger Unit) -----------------17

8 Exploded View and Replacement Parts List -----------18

KX-TG4031CB/KX-TG4032CB/KX-TG4033CB/KX-TG4034CB/KX-TGA401CB

1 Safety Precautions

1.1. For Service Technicians

•Repair service shall be provided in accordance with repair technology information such as service manual so as to

prevent fires, injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled.

2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.

3. FASTON terminals shall be plugged straight in and unplugged straight out.

•ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on worktable.

4. Do not grasp IC or LSI pins with bare fingers.

2Warning

2.1. Battery Caution

Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instructions.

2.2. About Lead Free Solder (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that

contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),

Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair

work we suggest using the same type of solder.

Caution

• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with

temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).

• Exercise care while using higher temperature soldering irons.:

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).

KX-TG4031CB/KX-TG4032CB/KX-TG4033CB/KX-TG4034CB/KX-TGA401CB

2.2.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper

(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the

manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other

materials.

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

2.3. Discarding of P. C. Board

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

KX-TG4031CB/KX-TG4032CB/KX-TG4033CB/KX-TG4034CB/KX-TGA401CB

3 Specifications

Note:

• Design and specifications are subject to change without notice.

Note for Service:

•Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.

•Analog telephone connection: Telephone Line

•Optional headset: RP-TCA94, RP-TCA95, KX-TCA400, KX-TCA430

KX-TG4031CB/KX-TG4032CB/KX-TG4033CB/KX-TG4034CB/KX-TGA401CB

4 Location of Controls and Components

Refer to the Operating Instructions.

Note:

You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

5 Installation Instructions

Refer to the Operating Instructions.

Note:

You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

6 Operating Instructions

Refer to the Operating Instructions.

Note:

You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

KX-TG4031CB/KX-TG4032CB/KX-TG4033CB/KX-TG4034CB/KX-TGA401CB

7 Schematic Diagram

7.1. For Schematic Diagram

7.1.1. Base Unit (Schematic Diagram (Base Unit_Main))

Notes:

1. DC voltage measurements are taken with voltmeter from the negative voltage line.

2. The schematic diagrams may be modified at any time with the development of new technology.

7.1.2. Handset (Schematic Diagram (Handset_Main))

Notes:

1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.

2. The schematic diagrams may be modified at any time with the development of new technology.

7.1.3. Charger Unit (Schematic Diagram (Charger Unit))

Notes:

1. DC voltage measurements are taken with voltmeter from the negative voltage line.

2. The schematic diagrams may be modified at any time with the development of new technology.

KX-TG4031CB/KX-TG4032CB/KX-TG4033CB/KX-TG4034CB/KX-TGA401CB

Memo

KX-TG4031CB/KX-TG4032CB/KX-TG4033CB/KX-TG4034CB/KX-TGA401CB

7.2. Schematic Diagram (Base Unit_Main)

NC: No Components

KEYIN2

KEYIN3

KEYS_D

KEYS_E

KEYIN1

KEYS_C

MSG_LED

ANS_LED

UTX

URX

JTAG_TDO

JTAG_TCK

JTAG_TMS

JTAG_TDI

JTAG_RTCK

JTAG_TCK

JTAG_TDO

JTAG_TDI

JTAG_TMS

VBAT

UTX

URX

GND

*WBX01

AP1

10pin

PARALLEL WIRE

2APVCC

MSG_LED

ANS_LED

KEYIN1

KEYIN2

KEYIN3

KEYS_C

KEYS_D

KEYS_E

*SW1

RA501 33

RA502

10k

C516 0.1u

C515

K1u

VBAT

VDDC

C517 0.1u

C518 0.1u

+3.0V

C651 NC

C652 NC

C655 NC

C656 NC

C658 NC

C659 NC

*C661

RSTN

VBAT

DA801

TXn

RXON

RXp

RXn

GND

R806

470 GND

TXON

R807

470

TXp

GND

DA802

ANT2

ANT1

R892

470

GND

R891

470

ANT2

GND

ANT1

GND

GND ANT2

TXON

RXON

RXn

ANT1

TXp

TXn

RXp

GND

STM/CKM/P15

GND

GNDGND

CL1

CL2

*Q651

5C1

4C2

C893

GND

TDI

TMS

TCK

TDO

C895

1.2p

C896

2.2p C859

2.2p

C805

2.7p

C806

2.7p

C820

1.5p

C863

1.5p

R502

RTCK

C660 NC

C810

2.4p

C813

L809

7.5n

C891

C892

C811

10p

C826

10p

C822

10p

C825

10p

C653 NC

C654 NC

C812

0.9p

C827

10p

GND

C894

2.2p

*R651 680

*R652 680

*R507

+3.0V

*R512

TXp

RXp

RXn

GND_RF

TRSW_p

ANT_n

ATST_n

ATST_p

TEST

RSTN

VCC_VCO

GPIO[27]

VDDUSB

DM_USB/GPI28

DP_USB/GPI29

VDDC1

JTAG_TDO

JTAG_TDI

JTAG_TCK

JTAG_TMS

JTAG_RTCK

FCT

TO RF BLOCK

W 0.2mm

L mm

1st layer

W 0.2mm

L 10.0mm

1st layer

W 0.15mm

L 20mm

3rd layer

W 0.15mm

L 20mm

3rd layer

W 0.2mm

L 10mm

1st layer

W 0.2mm

L 10mm

1st layer

W 0.2mm

L mm

1st layer

W 0.15mm

L 5.0mm

1st layer

W 0.15mm

L 5.0mm

1st layer

(1)

(2)

(3)

(4)

(5)

(6)

* Start Monitor

* When "SFR" command

is executed, 13.824MHz

frequency will be output.

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