Panasonic A4S Manuale utente

ACCTF6E-2

2015.06

industrial.panasonic.com/ac/e/

A4S

Narrow-pitch Connectors

onnector

Operation manual

Operation manual for Narrow-pitch connectors A4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2015

ACCTF6E-2 201506

- 1 -

Contents

01.Introduction.............................................................................................2

02.Precautions for product design ...............................................................3

03.Precautions for mounting and reflow soldering.....................................14

04.Precautions for mating and unmating ...................................................20

05.Connectors for inspection and precautions for use...............................22

Operation manual for Narrow-pitch connectors A4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2015

ACCTF6E-2 201506

- 2 -

01. Introduction

Our Advanced series A4S consists of ultra-small connectors with a terminal pitch of 0.4

mm, a stacking height of 0.8mm, and a shorthand width of 2.5 mm. This connector is

designed for board-to-FPC connections that require a more space-saving connector than

our F4 and F4S Series.

For this purpose, the size and thickness of the molded part has been further reduced.

Select the types best suited to the conditions of use. Read this document before

designing a product and starting production.

A4S

F4S

Space-

saving

Excellent

Very good

Width:

2.5mm

Width:

3.6mm

Width:

5.0mm

Low-profile

Excellent

Very good

Mated height

0.8mm

Mated height

1.0～1.2mm

Mated height

0.9mm

Wiring

underneath

Good

Exposed

metal part

Good

Exposed

metal part

Excellent

No exposed

metal part

Exposed

metal part on

the rear face

Exposed metal

part on the

rear face

Contact

reliability

Excellent

Ultra slim but

highly-reliable

Excellent

V-notch and

double contact

Excellent

double contact

V-notch and

double contact

Drop

resistance

Very good

Bellows-type

contact

Thin plastic part

Very good

Bellows-type

contact

Thin plastic part

Excellent

Bellows-type

contact

Mountability

Very good

Excellent

Header needs

special nozzle

Header needs

special nozzle

No pick up

cover

Clicking

feedback

Excellent

Very good

5.0

3.6

2.5

0.9mm

0.8mm

1.0

～

1.2mm

Header

pickup

space:

Pick up the

0.7mm-

wide

bottom.

Header

pickup

space:

Pick up the

0.8 mm-

wide

bottom.

Header

pickup

space:

2.3 mm-

wide.

Operation manual for Narrow-pitch connectors A4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2015

ACCTF6E-2 201506

- 3 -

02. Precautions for product design

02-1. Considerations in mechanical design

1) Position of the connector on a board

Rigid boards tend to warp in a direction perpendicular to the rolling direction

during the production process. Poor soldering may occur depending on the

warping direction. Make sure to place the connector in a direction which reduces

warpage.

2) Position of the connector in the mounting process

Design multi-pin connector layouts that do not require a swinging movement

during pickup and mounting.

In many cases, deviation of the connector mounting position is caused by the

inertia of the swinging movement of the mounter. A layout that does not require

swinging is thus required.

●Example of a connector layout requiring a swinging movement in the mounting process

△

○

This space causes poor

soldering.

Pickup and mounting positions

Connector

Tends to warp in the

manufacturing (lateral) direction.

Embossed tape

Motherboard

No rotation inertia

Poor soldering can be reduced by

designing a mounting pattern to place

the connector in a lateral direction.

Connector

Rotary inertia is applied

Operation manual for Narrow-pitch connectors A4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2015

ACCTF6E-2 201506

- 4 -

3) Prevention of problems during use

(1)The connectors have a simple locking structure, but make sure to consider

preventive measures against the detachment of mated connectors during

practical use.

- Make sure to eliminate any gaps between the casing and board.

- We recommend that the holding force is set greater than the insertion force of

the connector.

- Select an appropriate cushioning material with a suitable shape and dimensions,

and hold down the connector at the center. (If the holding position is off the

center, it may cause detachment of mated connectors.)

(2)If the board is insufficiently fixed as in the following drawing, the inertial

load applied to the connector may damage it. Pay attention to the following

points.

Cushioning material

Casing

Sub-board

(flexible board)

Connector

Reinforcing plate

Motherboard

When an impact such as dropping as shown in the

drawing is applied:

(1) If both boards are not sufficiently fixed,

the connector will be damaged due to the

impact applied to the connector.

(2) In particular, if there is no gap between

the casing and sub-board (A<B), the sub-

board side will hit the casing wall first.

This impact may damage the connector.

Securely fix both the motherboard and sub-board.

(1) Fixing motherboard

(Prevents inertial movement by drop impact

by fixing the side with a greater mass.)

(2) Hold down the sub-board to prevent it from

moving using a rubber cushioning material,

etc.

(3) It is safer if board gaps are set to AB so as

to prevent shearing damage on deviation of

the board by impact.

× A<B

○ AB

Sub-board

(FPC)

Connector

Casing

Motherboard

(not fixed)

Connector

Casing

Motherboard

(not fixed)

Holding cushion

Sub-board (FPC)

Operation manual for Narrow-pitch connectors A4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2015

ACCTF6E-2 201506

- 5 -

(3)To facilitate the mating of connectors, we recommend that you pay attention

to the following points when designing the motherboard.

- Provide a reference mark.

- Design a layout that allows easy-checking of the connector mating condition.

Flexible board

Reinforcing plate

Motherboard

Provide a reference

mark using:

-Silk printing

-Pattern (copper foil)

Operation manual for Narrow-pitch connectors A4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2015

ACCTF6E-2 201506

- 6 -

02-2. Precautions for board design

1) Circuit design

(1)When designing the terminal foot pattern, check the latest specifications and

examine the recommended foot pattern and dimensions of the metal mask opening.

The current recommendations are indicated on pages 12 and 13.

(2)This connector is provided with soldering metals for preventing solder from

peeling off the terminal.

Make sure to design a foot pattern for the soldering terminal.

(3)Pay attention to the following points when providing a through hole by

extending the foot pattern.

If a through-hole is created simply by extending the foot pattern by the same

width, solder is absorbed into the through-hole during the reflow process, which

may cause defective or poor soldering of the terminals.

①Thin and extend the tip of the foot

pattern before creating a through-hole.

②Prevent solder from reaching the land

by using a coverlay or resist.

Soldering terminal

Socket

Header

In general, 1/3 the

terminal pattern

width.

Operation manual for Narrow-pitch connectors A4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2015

ACCTF6E-2 201506

- 7 -

(4)Pay attention to the following point as a pattern

peeling preventive measure when removing the

connector.

- Make the foot pattern length longer than the

coverlay opening.

In general, at least 0.3 mm.

(5)Foot pattern dimensions indicated in the drawings are

intended to achieve the minimum area on the premise

that the reflow-soldering process is used. For manual

soldering or for ensuring solder reworkability, make

a longer pattern at the terminal tip.

(6)When it is needed to provide pattern wiring and through-hole underneath the

socket, it is possible to use it by designing the pattern as shown below in case

insulation underneath the socket is not assured.

- Secure space for applying the soldering

iron tip.

Terminal looseness and unwanted

solder creep are preventable by

applying the soldering iron tip here.

Through hole diameter ：Example of φ0.30

The area where there is a possibility

that the contacts touch.

Operation manual for Narrow-pitch connectors A4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2015

ACCTF6E-2 201506

- 8 -

2) FPC board design

(1)Positions of connectors on the FPC

The FPC board is made by laminating a polyimide layer, copper foil, and adhesive

layers. Since each material has slightly different heat-shrinkable properties,

warpage may occur typically due the reflow heat in the following cases. This may

cause poor soldering. Make sure to arrange the board in a direction that minimizes

warpage.

■Example of the Assist carrier (ShinEtsu Polymer)

In case of a one-sided FPC board, warpage is

more likely to occur if a pattern is laid in a line,

or if the copper foil is applied over the entire

FPC board for noise-prevention purposes.

Since the FPC is soft, it is

difficult to keep it flat.

●Typical transfer jigs for the board

mounting process

- Magic resin (Daisho Denshi)

- Keiju board (Mitsubishi Resin)

- Assist carrier (ShinEtsu Polymer)

To keep the FPC board flat during

mounting, we recommend the use of a

“Sticky transfer jig” for the wiring board

mounting process.

Workpiece

(FPC board, etc.)

Elastomer

(Weak adhesive layer)

Elastomer

(Strong adhesive layer)

Substrate

Workpiece (FPC, etc.)

Assist carrier

Layout pin

STEP 1:

Provisional fixing of workpiece

STEP 2:

Mounting complete

STEP 3:

Removal of

workpiece

Removal pin

Operation manual for Narrow-pitch connectors A4S

Panasonic Corporation

industrial.panasonic.com/ac/e/

©Panasonic Corporation 2015

ACCTF6E-2 201506

- 9 -

(2)FPC board specifications

Control the thicknesses of the coverlay and adhesive to prevent poor

soldering.

This connector has no stand-off.

Therefore, minimize the thickness of the coverlay, etc. so as to prevent the

occurrence of poor soldering.

If poor soldering occurs frequently, check the actual thickness of each insulation

layer. Generally, the coverlay thickness is set to about 30 μm, including the

adhesive. If the thickness exceeds 30 μm, design the board so as to remove the

coverlay under the connector.

(3)This connector is often used for connecting the motherboard and FPC board. In

this case, if the FPC board is too short, a load that causes deviation will be applied

to the connector.

Make sure to create a design that provides some allowance in the FPC board.

Connector

terminal

Solder

Molded part of the connector

Coverlay (polyimide)

Adhesive (epoxy adhesive recommended)

Copper foil

Base material (polyimide)

Reinforcing plate + Adhesive

(epoxy adhesive recommended)

X Too long

Fixed

Connector

X Too short

Positional deviation

Motherboard

Part where FPC board is

fixed

Indice

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