Panasonic TY-FB9FDD Manuale utente

1 Safety Precautions 2

1.1. General Guidelines 2

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 3

3 About lead free solder (PbF) 4

4 Replacement 5

5 Connection 6

6 Circuit Board Layout 7

6.1. HDD-Board 7

7 Block and Schematic Diagram 9

rights reserved. Unauthorized copying and

distribution is a violation of law.

TY-FB9FDD

7.1. Schematic Diagram Notes 9

7.2. HDD-Board Block Diagram 10

7.3. HDD-Board (1 of 2) Schematic Diagram 11

7.4. HDD-Board (2 of 2) Schematic Diagram 12

8 Replacement Parts List 13

8.1. Replacement Parts List Notes 13

8.2. Electrical Replacement Parts List 14

8.3. Mechanical Replacement Parts List 16

8.4. Parts Location (1) 17

8.5. Parts Location (2) 18

DVI-D Terminal Board for PF Series

Specifications

Terminals Video Input DVI-D 24 Pin × 1

compliance with DVI Revision 1.0

udio Input Stereo mini jack (M3) × 1

0.5Vrms

Content Protection Compatible with HDCP 1.1

CONTENTS

Page Page

ORDER NO. ITD0608047CE

B34 Canada: D10

1 Safety Precautions

1.1. General Guidelines

1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. Leakage Current Cold Check

1.Unplug the AC cord and connect a jumper between the two prongs on the plug.

2.Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on

the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the

chassis, the reading should be between 1MWand 5.2MW.

When the exposed metal does not have a return path to the chassis, the reading must be .

Figure 1

1.1.2. Leakage Current Hot Check (See Figure 1.)

1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2.Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a

good earth ground such as a water pipe, as shown in Figure 1.

3.Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4.Check each exposed metallic part, and measure the voltage at each point.

5.Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6.The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may

be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits

specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to

the customer.

TY-FB9FDD

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage

caused by electro static discharge (ESD).

1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum

foil, to prevent electrostatic charge buildup or exposure of the assembly.

3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can

generate electrical charge sufficient to damage ES devices.

5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable

conductive material).

7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to

damage an ES device).

TY-FB9FDD

3 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.

Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb

solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto

the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.

However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

TY-FB9FDD

4 Replacement

TY-FB9FDD

5 Connection

TY-FB9FDD

6 Circuit Board Layout

6.1. HDD-Board

ABCDEFGH I

HDD-BOARD (FOIL SIDE)

TXNHD10YQT

TY-FB9FDD

HDD-BOARD TXNHD10YQT TY-FB9FDD

HDD-BOARD TXNHD10YQT

R226

R227

R228

FL021

JK501

C101

C102

C103

Q100

C104

Q101

C105

C108

C110

C112

C113

C114

C115

R101

R102

R103

R104 R105

IC104

IC105

C143

C144

R125

R126

C924 D902

C928

D904

R901

R904

R134

R135

R137

C930

R139

C931

TP001

TP002

C932

TP003

TP004

C934

TP005

IC906

TP006

TP007

R141

R912

R142

R913

R914

R915

R145

R146

R149

C946

C947

R150

R924

R925

R926

R927

R157

R928

R158

C951

R929

R930

R931

R932

R933

R934

R173

R175

JK001

R178

R179

R180

R181

R182

R183

R184

R185

R186

FL907

C205 C214

C215

C216

C217

R001

R201

D011

R202

R203

R204

R205

R206

R207 R208

R209

IC201

R210 R211

D021

R212

D022

R213

D023

D024

R021

D025

R022

CR NO.3

TNPA4052

HDD

PbF

A40

A39

B39

B40

128

ORDER NO.

Parts Location

HDD-BOARD

IC3104 C-3

IC3105 C-3

IC3201 D-2

IC3906 C-2

TP3001 E-5

TP3002 B-3

TP3003 B-2

TP3004 B-3

TP3005 B-4

TP3006 B-5

TP3007 B-5

Q3100 D-3

Q3101 D-3

ICIC

TRANSISTOR

TY-FB9FDD

ABCDEFGH I

HDD-BOARD (COMPONENT SIDE)

TXNHD10YQT

TY-FB9FDD

HDD-BOARD TXNHD10YQT TY-FB9FDD

HDD-BOARD TXNHD10YQT

R224

R225

R229

L901

L551

L552

L553

JK501

C106

C107 C109

C111

C116

C117 C118

C501

Q501

C511

Q511

R108

R109

C901

IC101

C902

IC102

C903

IC103

C904

C905

R110 R111 R112 R113

R114 R115

R116

R117

R118

C141

R119

C911

R501

C912

R502

C142

C913

R503R504

C915

R505

R506

R507

R120R121

R122R123

R124

C921

R511

C922

R512

C923

R513R514

C925

D901

R515

C926

R516

C927

D903

R517

D905

C929

R131

R902

R132

R903

R133

R905

R906

R136

R907

R138

IC901

IC902

IC903

C933

IC904

IC905

S501

R911

C551

C552

R143

R144

R916

R147

R148

C941

C942

C943

C944

C945

S511

C948

C949

R921

R151

R922

R152

R923

R153

R154

R155

R156

C950

C952

C953

C954

C955

C956

C957

C958

R160

C959

R161

R162

R163

R164

R935

R165

R166

R167

C960

R168

R169

JK001

R187

R188

FL901

FL902

FL903

FL904

FL905

FL906

FL908

JS501

JS502

JS503

C201

C202

C203

C204

C206

C207

C208

C209

C210

C211

C212

C213

C021

D001

D002

D003D004 D005D006

D007

D008

D009

IC001

D010

R214

R215

R216

R217

R023

R218

R024

R219

R025

R026

R220

R221

R222

R223

CR NO.3

HDD

TNPA4052

PbF

SEE REVERSE FOR ORDER NO.

A39

A40

B39

B40

125

100

Parts Location

HDD-BOARD

IC3001 B-4

IC3101 C-5

IC3102 B-5

IC3103 D-3

IC3901 A-3

IC3902 A-2

IC3903 D-2

IC3904 D-3

IC3905 D-4

Q3501 C-4

Q3511 D-4

ICIC

TRANSISTOR

TY-FB9FDD

7 Block and Schematic Diagram

7.1. Schematic Diagram Notes

TY-FB9FDD

7.2. HDD-Board Block Diagram

RX2+

RX1+

RX0+

RX2-

RX1-

RX0-

+5V

+9V

LAN15V

+3.3V

STB+5V

JK3001

106

70 697374 7177 7275

11 14 151310 1612 17

99 8

4748 4446

104

121

122

120

119

227 43

123 124 126 127 128

11011

98 97 86 83 79 78

30 34 63

JK3501

TMDS

INTERFACE

PANEL

AND

DVI I/F RECEIVER

LATCH

SYNCHRONIZATION

DATA RECOVERY

DECODER

IC3101

DDC+5V

B14

TX9+

SLOT SCL

TX5+

TX8-

SLOT5V

B25

S2DETECT

SLOT1

B12

A10

B40

LAN+15V

TX2-

STB5V

TX6+

TX6-

B15

TX8+

SLOT9V

A22

SLOT3.3V

A19

A26

B21

SLOT3.3V

B19

A21

TX1-

TX4+

DS11

B24

TX1+

TX7+

TX0-

A17

TX0+

A15

B11

TX3+

A13

TX3-

SLOT5V

A12

TXC+

B17

AUDIO IN L

A40

SLOT9V

TXC-

A14

TX4-

LAN+15V

TX2+

TX9-

TX5-

B36

TX7-

A28

AUDIO IN R

DVI IN

SCL

SDA5

SCL0

SDA0 3

2SCL17

EEPROM

IC3001

6SDA1

IIC BUS REPEATER

IC3902

B1 A1

/OE2

LEVEL SHIFT

IC3102

(3.3V <-> 5V)

SCL_HDCP

SDA_HDCP

LATCH

PLL

3B2

(3.3V <-> 5V)

VCC

IC3105

2A1

LEVEL SHIFT

SCL_EQ

SDA_EQ

8 VCC

+5V

B23

SRQ

+5V

16 VCC 6

SDA1

SCL1 P6

LEVEL SHIFT

IC3103

(3.3V <-> 5V)

ODD_G7

ODD_G6

ODD_G5

ODD_G4

ODD_G3

ODD_G0

ODD_G2

ODD_G1

ODD_B7

ODD_B2

ODD_B3

ODD_B0

ODD_B4

ODD_B1

ODD_B6

ODD_B5

ODD_R7

ODD_R2

ODD_R3

ODD_R0

ODD_R4

ODD_R1

ODD_R6

ODD_R5

HSYNC

VSYNC

ODCK

+3.3V

EVEN_B5

EVEN_B6

EVEN_B0

EVEN_B3

EVEN_B4

EVEN_B7

EVEN_B2

EVEN_B1

EVEN_B6

EVEN_B0

EVEN_B5

EVEN_B2

EVEN_B7

EVEN_B4

EVEN_B3

EVEN_B1

EVEN_G6

EVEN_G0

EVEN_G5

EVEN_G2

EVEN_G7

EVEN_G4

EVEN_G3

EVEN_G1

TXEC6

TXEC5

TCLKIN

TXEC4

SCDT

PRESET

TXOA+

TXOB-

TXOC-

TXOD+

TXOD-

TXOB+

TXOE+

TXOE-

TXOC+

TXOA-

TCLKOUT-

TCLKOUT+

TXEB-

TXED+

TXED-

TXEB+

TXEA-

TXEC-

TXEE-

TXEC+

TXEA+

TXEE+

TXOD2

TXOD3

TXOB0

TXOB5

TXOA0

TXOD1

TXOA5

TXOD0

TXED1

TXEA5

TXED0

TXEA0

TXEA4

TXED2

TXEB0

TXED3

TXEA6

TXED4

TXED5

TXEC0

TXEC1

TXEC2

TXEC3

TXEB6

TXEB5

TXOB6

TXOB5

TXOC3

TXOC0

TXOD5

TXOD4

TXC-

TX5+

TX7+

TX8-

TX0-

TX0+

TX4-

TX3+

TX6+

TX6-

TX9-

TX3-

TX5-

TX7-

TX1-

TXC+

TX8+

TX4+

TX1+

TX9+

TX2+

TX2-

ODCK

HSYNC

VSYNC

ODCK

VSYNC

HSYNC

LVDS TX

IC3201

TXC-

TX5+

TX7+

TX8-

TX0-

TX0+

TX2-

TX4-

TX3+

TX6+

TX6-

TX2+

TX9-

TX3-

TX5-

TX7-

TX1-

TXC+

TX8+

TX4+

TX1+

TX9+

PWDDNB

MODE0

RESRVD

ODD_R0-R7

ODD_G0-G7

ODD_B0-B7

EVEN_R0-R7

EVEN_G0-G7

EVEN_B0-B7

+3.3V

A23

SRQ

VCC 8

Q3100,Q3101

DVI AUDIO IN

Q3511

Q3501

AUDIO_R

AUDIO_L

AUDIO_R

TMDS_RX2-

TMDS_RX2+

TMDS_RX1+

TMDS_RX1-

TMDS_RX0+

TMDS_RX0-

TMDS_RXC+

TMDS_RXC-

DVI_SDA

DVI_SCL

C_SCL

C_SDA

SLOT_SCL

SLOT_SDA

LVDS_PD

PRESET

SYNC_DET

BUFFER

IC3906

C_SDA

C_SCL

SLOT_SDA

SLOT_SCL

DVI_SCL

DVI_SDA

STB 5V

SRQ

DVI_SCL

DVI_SDA

SCL

SDA

WP(CONFIG)

WP(EDID)

STB+5V

LVDS_PD

FHD:H

+5V

SLOT SDA

STB+5V

SCL

SDA5

EEPROM

IC3001

VCC

DVI_SDA

DVI_SCL

TY-FB9FDD

HDD-Board Block Diagram TY-FB9FDD

HDD-Board Block Diagram

TY-FB9FDD

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