Panasonic TX-15LV1 Manuale utente

ORDERNO. ITD0209027C2

Combination 15.2”Diagonal LCD TV/DVDPlayer

TX-15LV1

LH5Chassis

SPECIFICATIONS

Specifications

Power Source

AC100-240V, 50/60Hz

Power Consumption

Averageuse:52W

Stand-bycondition:3.0W

TVset:DC 15 V2.8AMAX.

LCD

385 mm

16:9aspectratio LCD panel

Screen Size

(W)336 mm (H)189 mm

Receiving System

PAL I, PAL-525/60

M.NTSC

NTSC(AVonly)

Receiving Channels

UHF E21-E59

Sound

Speaker

Tweeter (4× 8cm 2pcs, 8 )

Woofer ( 5cm, 8 )

Audio Output

6.5W(2.0W+2.0W+2.5W](woofer)), 10%THD

Headphones

M3(3.5mm)Jack× 1

8 impedance

Features

DVDplayer, Aero-Hammer Woofer System

(2Way3Speaker System)

Disc Played

DVD-VIDEO disc

12cm single-sided, single-layer

12cm single-sided, dual-layer

12cm double-sided, single-layer

8cm single-sided, single-layer

8cm single-sided, dual-layer

8cm double-sided, single-layer

COMPACT disc (CD-DA, VIDEO CD)

12cm disc

8cm disc

Connection Terminals

AV1IN Video (21 pin) 1Vp-p 75

Audio (21 pin) 500mVrms 10k

RGB(21 pin)

AV1OUT Video (21 pin) 1Vp-p 75

Audio (21 pin) 500mVrms 1k

AV2IN S-Video IN(4pin) Y: 1Vp-p 75

C:0.3Vp-p 75

Audio (RCA×2) 500mVrms 10k

Video (RCA×1) 1Vp-p 75

DVDOUT S-Video OUT (4

pin) Y: 1Vp-p 75

C:0.3Vp-p 75

AUDIO L-R/ DIGITAL AUDIO (STEREO

M3Jack)1.3Vrms (1kHz, 0dB)/

BITSTREAM, Linear PCM

Operating Conditions

Temperature

42°F -95°F(5°C-35°C)

Humidity

20%-80%(non-condensing)

Dimensions(WxHxD)

Including TVStand

424 mm× 319 mm× 180 mm

TVSetOnly

424 mm× 283 mm× 80 mm

Weight(Mass)

6.0kg Net

DVDOUT

Audio output

Outputlevel

1.3Vrms (1kHz, 0dB)

Outputterminal

Mixed output(L/R)

RCA(1system), AV1/AV2

5.1ch discreteoutputOptical terminal

Audio signal outputcharacterstics

(1)Frequencyresponse

DVD(linear audio)

4Hz-22 kHz(48 kHzsampling)

4Hz-44 kHz(96 kHzsampling)

CD audio

115 dB(EIAJ)

(2)S/Nratio

CD audio:115 dB(EIAJ)

(3)Dynamicrange

DVD(linear audio)103 dB

CD audio 99dB(EIAJ)

(4)Total harmonicdistortion

CD audio 0.002%(EIAJ)

Digital audio output

Optical digital output

Optical terminal

Pickup

Wavelength:665 nm

Laser power

CLASS 1

Note:

Design and Specificationsare subjectto changewithoutnotice.

Weightand Dimensionsshown are approximate.

Unauthorizedcopying and distribution isaviolation oflaw.

1. SafetyPrecautions

1.1. General Guidelines

1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit

isfound, replace all parts whichhavebeenoverheatedor

damagedbytheshortcircuit.

2. Afterservicing, see toitthat all theprotectivedevices suchas

insulation barriers, insulation papersshieldsareproperly

installed.

3. Afterservicing, make thefollowing leakagecurrentchecks to

preventthecustomerfrom being exposedtoshock hazards.

1.2. Touch-CurrentCheck

1. Plug theACcord directlyintotheACoutlet. Donotuse an

isolation transformerfor thischeck.

2. Connect ameasuring networkfor touchcurrents betweeneach

exposedmetallicparton theset and agood earthground suchas

awaterpipe, as showninFigure1.

3. Use LeakageCurrentTester(Simpson 228 or equivalent) to

measurethepotential across themeasuring network.

4. Check eachexposedmetallicpart, and measurethevoltageat

eachpoint.

5. ReservetheACplug intheACoutlet and repeat eachoftheabove

measure.

6. Thepotential at anypoint(TOUGHCURRENT)expressedas

voltageU1and U2, does notexceedthefollowing values:

For a. c.:U1=35 V (peak) and U2=0.35 V (peak);

For d. c.:U1=1.0V,

Note:

The limitvalue of U2=0.35 V(peak)fora. c. and U1=1.0 Vford. c. correspond to the values 0.7

mA(peak)a. c. and 2.0 mAd. c.

The limitvalue U1=35 V(peak)fora. c. correspond to the value 70 mA(peak)a. c. for

frequencies greaterthan100 kHz.

7. Incase ameasurementisoutofthelimits specified, thereisa

possibilityofashock hazard, and theequipmentshouldbe

repairedand recheckedbeforeitisreturnedtothecustomer.

Figure 1

2. Prevention ofElectro StaticDischarge (ESD) to

ElectrostaticallySensitive(ES)Devices

Some semiconductor(solidstate)devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostaticallySensitive (ES)Devices. Examples of typical

ES devices are integratedcircuits and some field-effecttransistorsand semiconductor"chip"

components. The following techniques shouldbe usedto helpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybeforehandling anysemiconductor componentor

semiconductor-equippedassembly, drainoff anyESDon your

bodybytouching aknownearthground. Alternatively, obtainand

wearacommerciallyavailabledischargingESDwrist strap, which

shouldberemovedfor potential shock reasonsprior toapplying

powertotheunitundertest.

2. Afterremoving anelectrical assemblyequippedwithES devices,

place theassemblyon aconductivesurface suchas alminum foil,

topreventelectrostaticchargebuildup or exposureofthe

assembly.

3. Use onlyagrounded-tipsoldering iron tosolderor unsolderES

devices.

4. Use onlyananti-staticsolderremoval device. Somesolder

removal devices notclassifiedas "anti-static(ESDprotected)"

cangenerate electrical chargesufficienttodamageES devices.

5. Donotuse freon-propelledchemicals. These cangenerate

electrical charges sufficienttodamageES devices.

6. DonotremoveareplacementES device from its protective

packageuntil immediatelybeforeyou arereadytoinstall it. (Most

replacementES devices arepackagedwithleadselectrically

shortedtogetherbyconductivefoam, alminum foil or

comparableconductivematerial).

7. Immediatelybeforeremoving theprotectivematerial from the

leadsofareplacementES device, touchtheprotectivematerial to

thechassisor circuitassemblyintowhichthedevice will be

installed.

Caution

Besureno powerisappliedtothechassisor circuit, and observe

all othersafetyprecautions.

8. Minimizebodilymotionswhenhandling unpackagedreplacement

ES devices. (Otherwise hamless motion suchas thebrushing

togetherofyour clothes fabricor thelifting ofyour footfrom a

carpetedfloor cangenerate staticelectricity(ESD) sufficient

todamageanES device).

3. Precaution ofLaser Diode

Caution

Thisunitutilizes aclass I laser. Invisiblelaserradiation isemitted

from theoptical pickup lenswhentheunitisturnedon:

1. Donotlookdirectlyintothepickup lens.

2. Donotuse optical instruments tolookat thepickup lens.

3. Donotadjust thepreset variableresistor on theoptical pickup.

4. Donotdisassembletheoptical pickup unit.

5. Iftheoptical pickup isreplaced, use themanufactures specified

replacementpickup only.

6. Use ofcontrol or adjustmentor performance ofprocedures other

thanthose specifiedherinmayresultinhazardousradiation

exposure.

4. Handling Precautions For Traverse Deck

The laserdiode inthe optical pickup maybreak downdue to potential difference causedby

static electricityof clothes orhumanbody.

Sobe careful of electrostatic break downduring repairof the optical pickup.

4.1. Handling ofoptical pickup

1. Donotsubject theoptical pickup tostaticelectricityas itis

extremelysensitivetoelectrical shock.

2. Topreventthebreakdownofthelaserdiode, anantistatic

shorting pinisinsertedintotheflexibleboard (FPCBoard). /

Whenremoving or connecting theshortpin, finishthejob inas

shorttimes as possible.

3. Becareful nottoapplyexcessivestress totheflexibleboard (FPC

Board).

4. Donotturn thevariableresistor (Laserpoweradjustment).

4.2. Grounding for electrostaticbreakdownprevention

1. Humanbodygrounding / Use theantistaticwrist strapto

dischargethestaticelectricityfrom your body.

2. Worktablegrounding / Putaconductivematerial (sheet) or steel

sheet on thearea wheretheoptical pickup isplacedand ground

thesheet.

Caution

Thestaticelectricityofyour clothes will notbegroundedthrough

thewrist strap. Sotake carenottolet your clothes touchthe

optical pickup.

5. Aboutlead free solder (PbF)

Note:Leadis listedas (Pb) inthe periodic table of elements.

Inthe information below, Pbwill referto Leadsolder, and PbF will referto LeadFree Solder.

The LeadFree Solderusedinourmanufacturing process and discussedbelowis (Sn+Ag+Cu).

Thatis Tin(Sn), Silver(Ag) and (Cu) although othertypes are available.

This model uses PbFree solderinit’s manufacture due to environmental conservation issues.

Forservice and repairwork, we’dsuggestthe use of Pbfree solderas well, although Pbsolder

maybe used.

PCBs manufacturedusing leadfree solderwill have the PbF withina leafSymbol

stampedon the back of PCB.

Caution

-Pbfree solderhas ahighermelting pointthanstandard solder.

Typicallythemelting pointis50 ~70 ~F(30~40~C) higher. Please

use ahigh temperaturesoldering iron and set itto700 ±20 ~F

(370 ±10 ~C).

-Pbfree solderwill tend tosplashwhenheatedtoo high (about

1100 ~For600~C).

Ifyou must use Pbsolder, please completelyremoveall ofthePb

free solderon thepinsor solderarea beforeapplying Pbsolder. If

thisisnotpractical, besuretoheat thePbfree solderuntil it

melts, beforeapplying Pbsolder.

-Afterapplying PbF soldertodoublelayeredboards, please check

thecomponentsidefor excess solderwhichmayflowontothe

opposite side. (see figurebelow)

SuggestedPbfree solder

There are several kinds of Pbfree solderavailable forpurchase. This productuses Sn+Ag+Cu

(tin, silver, copper)solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder

canalsobeused.

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