Panasonic DMR-E50EB Manuale utente
ORDER NO.DSD0302003C8
DVD Video Recorder
DMR-E50EB
DMR-E50EG
DMR-E50GCS
Colour
(S).......................Silver Type
SPECIFICATIONS
Specifications
Power supply: AC220-240 V, 50 Hz (For
E50EB/ EG)
AC220-240 V, 50/ 60 Hz
(For E50GCS)
Power consumption: 29 W
Recording system: DVD video recording
standards (DVD-RAM),
DVD video standards (DVD-
R)
Recordable discs: 12 cm 4.7 GB DVD-RAM
12 cm 9.4 GB DVD-RAM
8 cm 2.8 GB DVD-RAM
12 cm 4.7 GB DVD-R
(for General Ver. 2.0)
www.electronicsrepair.net
Recording time: Maximum 360 min.
(with 4.7 GB disc)
XP: Approx.60 minutes
SP: Approx.120 minutes
LP: Approx.240 minutes
EP: Approx.360 minutes
Region Number: Region No.2 (E50EB/ EG)
Region No.3 (E50GCS)
Playable discs: 12 cm 4.7 GB DVD-RAM
12 cm 9.4 GB DVD-RAM
8 cm 2.8 GB DVD-RAM
12 cm 4.7 GB DVD-R
(for General Ver. 2.0)
DVD-Video
CD-Audio(CD-DA)
Video CD
CD-R/RW
(CD-DA,VideoCD MP3
formatted discs)
Audio
Recording system: Dolby Digital, 2ch
Audio In: AV1/AV2 (21 pin) AV3/AV4
(pin jack)
Input Level: Standard: 0.5 Vrms
Full scale: 2 Vrms at 1k Hz
Input Impedance: more than 10k ohm
Audio Out: AV1/AV2 (21 pin) Audio Out
(pin jack)
Output Level: Standard: 0.5 Vrms
Full scale: 2 Vrms at 1k Hz
Output Impedance
:less than 1k ohm
Digital AudioOut: Optical terminal (PCM,
Dolby Digital, DTS, MPEG)
Television System
Tuner System: PALI 75 ohm (For E50EB)
PALI 75 ohm terminated
(For E50EB)
PALB/ G/ H 75 ohm
terminated
(For E50EG/ GCS)
Channel Coverage:
DMR-E50EB only UHF: CH 21-68
DMR-E50EG only VHF: CH E2-E12, A-H2 (For
Italy)
UHF: CH 21-69
CATV
:CH S01-S05 (S1-S3)
S1-S20 (M1-U10)
S21-S41 [8MHz,
RASTER]
DMR-E50GCS only VHF: CH E2-E12
UHF: CH 21-69
CATV
:CH S01-S05
CH M1-M10
CH U1-U10
CH S21-S41
RF Converter
Output: UHF: CH21-68, 71 ± 3dB
75 ohm
(For the E50EB)
Not provided
(For the E50EG/ GCS)
Video
Video System: PALcolour signal, 625 lines,
50 fields
NTSC colour signal, 525
lines, 60 fields
Recording system: MPEG2 (Hybrid VBR)
Video in: AV1/AV2 (21 pin), AV3/AV4
(pin jack)
1Vp-p 75 ohm, terminated
S-Video in: AV2 (21 pin), AV3/AV4 (S
terminal)
1Vp-p 75 ohm, terminated
RGB In: AV2 (21 pin), 0.7Vp-p (PAL)
75 ohm, terminated
Video Out: AV1/AV2 (21 pin), Video Out
(pin jack)
1Vp-p 75 ohm, terminated
S-Video Out: AV1 (21 pin), S-Video Out(S
terminal)
1Vp-p 75 ohm, terminated
RGB Out: AV1 (21 pin) 0.7Vp-p (PAL)
75 ohm, terminated
Dimensions(W)x(H)x(D)
:Approx.430x79x283 mm
Mass: Approx.3.8 Kg
Operating
Temperature: 5 °C-40°C
Operating Humidity
range: 10 %-80 %RH (no
condensation)
LEASERSpecification
Class 1 LASER Product
Wave Length: 775-815nm, 655-666nm
Laser Power: No hazardous radiation is
emitted with the safety
protection
Notes:
Mass and dimensions shown are approximate.
Specifications are subject to change without notice.
Notes:
The part of DVD RAMDrive (VXY1772) is listed
separately.
Please refer to ORDER NO. RAM0301002C0.
1
1. SAFETY PRECAUTIONS
1.1. GENERAL GUIDELINES
1. When servicing, observe the original lead dress. If a short circuit is found, replace
all parts which have been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers,
insulation papers shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer
from being exposed to shock hazards.
1.1.1. LEAKAGE CURRENT COLD CHECK
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug
and each exposed metallic cabinet part on the equipment such as screwheads,
connectors, control shafts, etc. When the exposed metallic part has a return path to
thechassis, the reading should be between 1M and 5.2M .
When the exposed metal does not have a return path to the chassis, the reading
must be .
Figure 1
1.1.2. LEAKAGE CURRENT HOT CHECK (See Figure 1 .)
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for
this check.
2. Connect a 1.5k , 10 watts resistor, in parallel with a 0.15 F capacitors, between
each exposed metallic part on the set and a good earth ground such as a water
pipe, as shown in Figure 1 .
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the
potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current
tester (Simpson Model 229 or equivalent) may be used to make the hot checks,
leakage current mu3st not exceed 1/2 milliamp. In case a measurement is outsideof
the limits specified, there is a possibility of a shock hazard, and the equipment
should be repaired and rechecked before it is returned to the customer.
2. PREVENTION OF ELECTRO STATIC DISCHARGE
(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)
DEVICES
Some semiconductor (solid state) devices can be damaged easily by static electricity.
Such components commonly are called Electrostatically Sensitive (ES) Devices.
Examples of typical ES devices are integrated circuits and some field-effect
transistorsand semiconductor "chip" components. The following techniques should
be used to help reduce the incidence of component damage caused by electro static
discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-
equipped assembly, drain off any ESD on your body by touching a known earth
ground. Alternatively, obtain and wear a commercially available discharging ESD
wrist strap, whichshould be removed for potential shock reasons prior to applying
power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the
assembly on a conductive surface such as alminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not
classified as "anti-static (ESD protected)" can generate electrical charge sufficient
to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges
sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until
immediately before you are ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by conductive foam, alminum foil
or comparableconductive material).
7. Immediately before removing the protective material from the leads of a replacement
ES device, touch the protective material to the chassis or circuit assembly into
which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety
precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices.
(Otherwise hamless motion such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient todamage an ES device).
3. Precaution of Laser Diode
4. How to replace the Lithium Battery
REPLACEMENT PROCEDURE
1. Remove the Top cover and DVD-RAM drive unit with Main P.C.B. by referring the
Disassembling Procedure.
2. Unsolder the Lithium Batteries: B7501 and then replace it into new one.
( As shown in 16.2. The Main P.C.B. )
NOTE:
The lithium battery is a critical component. ( Type No.: CR2354-1GUF Manufactured by
Panasonic. )
It must never be subjected to excessive heat or discharge.
It must therefore only be fitted in equipment designed specifically for its use.
Replacement batteries must be of the same type and manufacture.
They must be fitted in the same manner and location as the original battery, with the
correct polarity contacts observed.
Do not attempt to re-charge the old battery or re-use it for any other purpose.
It should be disposed of in waste products destined for burial rather than incineration.
5. Handling the Lead-free Solder
5.1. About lead free solder (PbF)
Distinction of PbF P.C.B.:
P.C.B.s (manufactured) using lead free solder will have a PbF stamp on the P.C.B.
Caution:
- Pb free solder has a higher melting point than standard solder; Typically the melting
point is 50 - 70°F (30 - 40°C) higher. Please use a high temperature soldering iron. In
case of the soldering iron with temperature control,please set it to 700 ± 20°F (370 ±
10°C).
- Pb free solder will tend to splash when heated too high (about 1100°F/600°C).
- When soldering or unsoldering, please completely remove all of the solder on the
pins or solder area, and be sure to heat the soldering points with the Pb free solder
until it melts enough.
6. Service Explorer
The Service Explorer provides information about all possible causes based on the
symptoms and gives step by step instructions making parts. It consists of two parts,
based on applications: the first is the “Service Explorer Express” andthe second is
“Service Explorer in Detail”.
1. For details about the service / test modesetting mentioned in the description, refer
to the “List of various modes”.
- Service mode setting: While the power is off, press TIME SLIP, STOP, and
OPEN / CLOSE simultaneously for five seconds.
- Process mode 1 setting: While the power is off, press SKIP(R), TIME SLIP, and
OPEN / CLOSE simultaneously for five seconds.
2. For disassembly and replacement procedures, refer to the “Assembling and
Disassemling”.
6.1. Service Explorer Express
The following steps allow you to check each block separately (Digital P.C.B., RAM
drive, Main / Power Supply / Front P.C.B.).
Items needed: RAM drive, Digital P.C.B., Digital extension cable, Remote control.
Conditions: Nothing special.
Questo manuale è adatto per i seguenti modelli
2
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