Panasonic DMR-E60PP Manuale utente

ORDERNO.DSD0304007C1

B24

DVDVideo Recorder

DMR-E60PP

Colour

(S).......................Silver Type

SPECIFICATIONS

Specifications

Power supply: AC120 V, 60 Hz

Power consumption: 28 W

Recording system: DVD videorecording

standards(DVD-RAM),

DVD videostandards(DVD-

Optical pick-up: System with1lens, 2

integration units(662 nm

wavelengthforDVDs, 790

nmwavelengthforCDs)

Recordablediscs: 12 cm 4.7GB DVD-RAM

discs

12 cm 9.4GB DVD-RAM

discs

8cm 2.8GB DVD-RAM discs

12 cm 4.7GB DVD-R discs

8cm 1.4GB DVD-R discs

(forGeneral Ver. 2.0)

Recording time: Max. 6hours

(using 4.7GB disc)

XP: 60 minutes

SP: 120 minutes

LP: 240 minutes

EP: 360 minutes

Region number: Region No.1

Discs played: 12 cm 4.7GB DVD-RAM

discs

12 cm 9.4GB DVD-RAM

discs

8cm 2.8GB DVD-RAM discs

12 cm 4.7GB DVD-R discs

8cm 1.4GB DVD-R discs

(forGeneral Ver. 2.0)

DVD-VIDEO discs

CD-Audiodiscs (CD-DA)

VideoCD discs DVD Audio

CD-R/ CD-RWdiscs

(CD-DA, VideoCD, MP3

formatteddiscs)

PC CardSlot: PC CardTypell

CompatibleMedia: APC Cardadaptor

conforming toPC Card

Standards

ATAFlashPC Card, PC

CardAdaptor

(SD memoryCard,

MultiMediaCard, Compact

Flash, Smart Media, Memory

Stick, Dpicture card,

Microdrive)

Format: FAT12, FAT16,

ImageFormat: JPEG DCF(Design rulefor

camera fileSystem) (sub

sampling 4:2:2, 4:2:0)

TIFF (UncompressedRGB

chunky)

DPOFCompatibleNumber

of Pixels320×240-6144×4096

Thawing Time: Approx. 7sec (2Mpixels

JPEG)

Videosystem

TV system: NTSC system, 525 lines, 60

fields

Recording system: MPEG2(HybridVBR)

Input: LINE (pinjack) ×3, 1.0Vp-p;

S connector×3

Y: 1.0Vp-p; 75

C: 0.286 Vp-p; 75

Output: LINE (pinjack) ×2, 1.0Vp-p;

S connector×2

Y: 1.0Vp-p; 75

C: 0.286 Vp-p; 75

Component videooutput (480p/

480i): Y: 1.0Vp-p; 75

PB: 0.7Vp-p; 75

PR: 0.7Vp-p; 75

D-connectoroutput: Not provided

Antennareception input: TV Channel: 2ch-69ch, 75

CATV Channel: 1ch-125ch,

RFconverter output: Not provided

Audiosystem

Recording system: DolbyDigital (XP/SP/LP/EP)

LINEAR PCM (XP modeonly)

Input: LINE (pinjack) ×3

Reference input: 309 mVrms

FS: 2Vrms (1kHz, 0dB)

Input impedance: 47 k

Output: LINE (pinjack) ×2

Reference output: 309

mVrms

FS: 2Vrms (1kHz, 0dB)

Output impedance: 1k

(Loadimpedance: 10 k )

Number of channels: Recording: 2channels

Playback: 2channels

Other input/output connectors: Digital audiooptical output

connector(PCM, Dolby

Digital, DTS)

Dimensions: Approx.

430 (W)×79 (H)×283 (D) mm

[Approx. 1615 /16 ” (W)×31/8

” (H)×113/16 ” (D)]

(excludingprotrusions)

Mass: Approx. 3.9kg(8.58 lbs)

Operating temperature range: 5 °C-40°C (41 °F-104 °F)

Operating humidityrange: 10 %-80 %RH (no

condensation)

Clock unit: Quartz-controlled12-hour

digital display

LASER Specification

Class LASER Product

Wavelength: 775-815 nm655-666 nm

Laser power: Nohazardousradiation is

emittedwiththesafety

protection.

Power consumption instandbymode:

approx. 3.2W

DV Input: IEEE 1394 Standard, 4pin

Solder:

Thismodel uses leadfree solder (PbF).

Notes:

Mass and dimensionsare approximate.

Specificationsare subject tochangewithout notice.

Notes:

Thepart of DVD RAM Drive(VXY1772) islistedseparately.

Please refer toORDER NO. RAM0301002C0.

Unauthorized copying and distribution isaviolation of law.

1. SAFETY PRECAUTIONS

1.1. GENERALGUIDELINES

1. When servicing, observe the original lead dress. Ifashort circuit

isfound, replace all parts which have been overheated or

damaged bythe short circuit.

2. After servicing, see to itthat all the protective devices such as

insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to

prevent the customer from being exposed to shock hazards.

1.1.1. LEAKAGE CURRENTCOLD CHECK

1. Unplug the AC cord and connect ajumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the

jumpered AC plug and each exposed metalliccabinet part on the

equipment such as screwheads, connectors, control shafts, etc.

When the exposed metallicpart has areturn path to thechassis,

the reading shouldbe between 1M and 5.2M . / When the

exposed metal does not have areturn path to the chassis, the

reading must be . Figure 1

1.1.2. LEAKAGE CURRENTHOTCHECK (See Figure 1 .)

1. Plug the AC cord directlyinto the AC outlet. Donot use an

isolation transformer for thischeck.

2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F

capacitors, between each exposed metallicpart on the set and a

good earth ground such as awater pipe, as shownin Figure 1 .

3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to

measure the potential across the resistor.

4. Check each exposed metallicpart, and measure the voltage at

each point.

5. Reverse the AC plug inthe AC outlet and repeat each of the above

measurements.

6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A

leakage current tester (Simpson Model 229 or equivalent) maybe

used to make the hot checks, leakage current mu3st not exceed 1/

2milliamp. Incase ameasurement isoutsideof the limits

specified, there isapossibilityof ashock hazard, and the

equipment shouldbe repaired and rechecked before itisreturned

to the customer.

2. PREVENTION OF ELECTRO STATIC DISCHARGE

(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)

DEVICES

Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical

ES devices are integratedcircuits and some field-effect transistorsand semiconductor"chip"

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equipped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischarging ESDwrist strap,

whichshouldbe removed for potential shock reasons prior to

applying power to the unitunder test.

2. After removing an electrical assemblyequipped with ES devices,

place the assemblyon aconductive surface such as alminum foil,

to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan anti-staticsolder removal device. Some solder

removal devices not classified as "anti-static(ESDprotected)"

can generate electrical charge sufficient to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, alminum foil or

comparableconductive material).

7. Immediatelybefore removing the protective material from the

leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

Caution

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodilymotions when handling unpackaged replacement

ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricity(ESD)sufficient

todamage an ES device).

3. Precaution of Laser Diode

4. How to replace the Lithium Battery

REPLACEMENTPROCEDURE

1. Remove the Top cover and DVD-RAMdrive unitwith MainP.C.B.

byreferring the Disassembling Procedure.

2. Unsolder the Lithium Batteries: B7501 and then replace itinto

new one.

(Asshownin15.2.1. The MainP.C.B. )

NOTE:

The lithiumbatteryis a critical component. ( Type No.: CR2032-1GUFManufacturedby

Panasonic. )

It must neverbe subjectedtoexcessive heat ordischarge.

It must therefore onlybe fittedinequipment designedspecificallyforits use.

Replacement batteries must be of the same type and manufacture.

Theymust be fittedinthe same mannerand location as the original battery, withthe correct

polaritycontacts observed.

Donot attempt tore-charge the oldbatteryorre-use it foranyotherpurpose.

It shouldbe disposedof inwaste products destinedforburial ratherthanincineration.

5. Handling the Lead-free Solder

5.1. About lead free solder (PbF)

Caution:

-Pb free solder has ahigher melting point than standard solder;

Typicallythe melting point is50 -70°F (30 -40°C)higher. Please

use ahigh temperature soldering iron. Incase of the soldering

iron with temperature control,please set itto 700 ± 20°F (370 ±

10°C).

-Pb free solder will tend to splash when heated too high (about

1100°F/600°C).

-When soldering or unsoldering, please completelyremove all of

the solder on the pins or solder area, and be sure to heat the

soldering points with the Pb free solder until itmelts enough.

6. Service Explorer

The Service Explorerprovides information about all possible causes basedon the symptoms

and gives stepbystepinstructions making parts. It consists of twoparts, basedon applications:

the first is the “Service ExplorerExpress” andthe second is “Service ExplorerinDetail”.

1. For detailsabout the service / test modesetting mentioned inthe

description, refer to the “List of various modes”.

-Service mode setting: Whilethe power isoff, press TIME

SLIP, STOP, and OPEN/ CLOSE simultaneouslyfor five

seconds.

-Process mode 1setting: Whilethe power isoff, press

SKIP(R), TIME SLIP, and OPEN/ CLOSE simultaneouslyfor

five seconds.

2. For disassemblyand replacement procedures, refer to the

“Assembling and Disassemling”.

6.1. Service Explorer Express

The following steps allowyou tocheck eachblock separately(Digital P.C.B., RAM drive, Main/

PowerSupply/ Front P.C.B.).

Items needed: RAM drive, Digital P.C.B., Digital extension cable, Remote control.

Conditions: Nothing special.

6.2. Service Explorer inDetail

6.2.1. Does not operate

items needed: RAM drive, digital P.C.B., remote control.

Conditions: Nothing special.

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