Panasonic TX-22LT2F Manuale utente

22”Diagonal LCD TV 1

Specifications1

1. SafetyPrecautions3

1.1. General Guidelines 3

1.2. Touch-CurrentCheck 3

2. Prevention ofElectro StaticDischarge(ESD) toElectrostaticallySensitive (ES)Devices 4

3. Aboutleadfree solder(PbF)5

4. SelfCheck 7

5. ChasisBoard Layout8

6. Servicing method 8

6.1. Removing tiltbase 9

6.2. Removing rearpanel 9

6.3. Removing speakerunit9

6.4. Removing chassis10

6.5. Removing A-Board 11

6.6. Removing B-Board (withtunerassembly)13

6.7. Removing DG-Board 13

6.8. Removing H1-Board and H2-Board 14

6.9. Removing P1-Board 14

6.10. Removing P2-Board 14

6.11. Removing K-Board 15

6.12. Removing V-Board 15

6.13. A-Board servicing 15

7. Service ModeFunction 16

7.1. HowtoenterSERVICE 116

7.2. HowtoenterSERVICE 216

7.3. Option Description 17

8. Conductor Views19

8.1. A-Board 19

8.2. B, H1, H2, K, P1and P2-Board 19

8.3. DG-Board 19

9. Block and SchematicDiagrams19

9.1. SchematicDiagram Notes 19

9.2. PowerBlock Diagram 20

9.3. Signal Block Diagram 20

9.4. Interconnection SchematicDiagram 20

9.5. A-Board (1of7)and H1-Board SchematicDiagram 20

9.6. A-Board (2of7)and H2-Board SchematicDiagram 20

9.7. A-Board (3of7)SchematicDiagram 20

9.8. A-Board (4of7), B-Board, K-Board and V-Board SchematicDiagram 20

9.9. A-Board (5of7), P1-Board and P2-Board SchematicDiagram 20

9.10. A-Board (6of7)and P1-Board SchematicDiagram 20

9.11. A-Board (7of7)SchematicDiagram 20

9.12. DG-Board (1of7)SchematicDiagram 20

9.13. DG-Board (2of7)SchematicDiagram 20

9.14. DG-Board (3of7)SchematicDiagram 20

9.15. DG-Board (4of7)SchematicDiagram 21

9.16. DG-Board (5of7)SchematicDiagram 21

9.17. DG-Board (6of7)SchematicDiagram 21

9.18. DG-Board (7of7)SchematicDiagram 21

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10. PartsLocation &Mechanical ReplacementPartsList21

10.1. PartsLocation 21

10.2. Packing ExplodedView21

10.3. Mechanical ReplacementPartsList22

11. ReplacementPartsList24

11.1. ReplacementPartsListNotes 24

11.2. Electrical ReplacementPartsList25

12. SchematicDiagram for printing withA4size46

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ORDERNO. ITD0203006C2

22”Diagonal LCD TV

TX-22LT2F

LH4Chassis

SPECIFICATIONS

Specifications

PowerSource

AC100~240V, 50/60Hz

PowerConsumption

Averageuse:67W

Stand-bycondition:5W

TVset: DC15V, 4.1Amax.

LCD

22-inch(558mm), 16:9aspectratio LCDpanel

Screen Size

19.17-inch (486.7mm)(W)x10.77-inch (273.6mm)(H)x/ 22-

inch (558mm)(Diagonal)

Sound

Speaker

Tweeter(4x7cm 2pcs, 8 ), Woofer( 5cm 2pcs, 4 )

Audio Output

9W (2.5W+2.5W+4.0W (Woofer)), 10%THD

Headphones

M3(3.5mm)Jack x18 impedance

FEATURES

Aero-Hammer DoubleWooferSystem (2Way

4SpeakerSystem)

Receiving Systems/ Band name

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PAL B,G,H, SECAMB,GSECAML/L’

VHF E2-E12 VHF H1-H2(ITALY)

VHF A-H(ITALY) UHF E21-E69

CATV(S01-S05) CATVS1-S10 (M1-M10)

CATVS11-S20 / (U1-

U10)

CATVS21-S41 (Hyperband)

PAL 525/60

Playback ofNTSCtapefromsome PAL video recorders

(VCR)

M.NTSC

Playback fromM.NTSCVideo recorders(VCR)

NTSC

Playback fromNTSCVideo recorders(VCR)

(AVINPUTONLY)

Aerial-Rear

UHF-VHF

Operating Conditions

Temperature:41°F-95°F(5-35°C)

Humidity:5%-90%RH(non-condensing)

Connection Terminals

AV1

21Pin socket(Audio/Video in, TVout, RGBin)

AV2

21Pin socket(Audio/Video in, Audio/Video out, S-Video, Q

-Link)

AV3

VIDEO

RCAPINTypex1

S-VIDEO

Mini DIN4-pin

AUDIOL-R

RCAPINTypex2

Dimensions(W xHxD)

Including TVStand

586mm x424mm x240mm

TVSetOnly

586mm x388mm x67mm

Weight(Mass)

11.5kg Net

Note:

Design and Specificationsaresubjectto changewithoutnotice.

Weightand Dimensionsshown areapproximate.

Unauthorizedcopying and distribution isaviolation oflaw.

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1. SafetyPrecautions

1.1. General Guidelines

1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit

isfound, replace all parts whichhavebeenoverheatedor

damagedbytheshortcircuit.

2. Afterservicing, see toitthat all theprotectivedevices suchas

insulation barriers, insulation papersshieldsareproperlyinstalled.

3. Afterservicing, make thefollowing leakagecurrentchecks to

preventthecustomerfrombeing exposedtoshock hazards.

1.2. Touch-CurrentCheck

1. Plug theACcorddirectlyintotheACoutlet. Donotuse an

isolation transformerforthischeck.

2. Connect ameasuring networkfortouchcurrents betweeneach

exposedmetallicparton theset and agood earthground suchas

awaterpipe, as showninFigure1.

3. Use LeakageCurrentTester(Simpson 228 orequivalent) to

measurethepotential across themeasuring network.

4. Check eachexposedmetallicpart, and measurethevoltageat

eachpoint.

5. ReservetheACplug intheACoutlet and repeat eachoftheabove

measure.

6. Thepotential at anypoint(TOUGHCURRENT)expressedas

voltageU1and U2, does notexceedthefollowing values:

Fora. c.:U1=35 V(peak) and U2=0.35 V(peak);

Ford. c.:U1=1.0V,

Note:

ThelimitvalueofU2=0.35 V (peak)for a. c. and U1=1.0V for d. c. correspond tothevalues 0.7

mA(peak)a. c. and 2.0mAd. c.

ThelimitvalueU1=35 V (peak)for a. c. correspond tothevalue70 mA(peak)a. c. for

frequencies greaterthan100 kHz.

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7. Incase ameasurementisoutofthelimits specified, thereisa

possibilityofashock hazard, and theequipmentshouldbe

repairedand recheckedbeforeitisreturnedtothecustomer.

Figure1

2. Prevention of ElectroStaticDischarge (ESD) to

ElectrostaticallySensitive(ES) Devices

Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such

componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical

ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor "chip"

components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of

componentdamagecausedbyelectro staticdischarge(ESD).

1. Immediatelybeforehandling anysemiconductorcomponentor

semiconductor-equippedassembly, drainoff anyESDon your

bodybytouching aknownearthground. Alternatively, obtainand

wearacommerciallyavailabledischarging ESDwrist strap,

whichshouldberemovedforpotential shock reasonspriorto

applying powertotheunitundertest.

2. Afterremoving anelectrical assemblyequippedwithES devices,

place theassemblyon aconductivesurface suchas alminumfoil,

topreventelectrostaticchargebuildup orexposureofthe

assembly.

3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES

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devices.

4. Use onlyananti-staticsolderremoval device. Somesolder

removal devices notclassifiedas "anti-static(ESDprotected)"can

generate electrical chargesufficienttodamageES devices.

5. Donotuse freon-propelledchemicals. These cangenerate

electrical charges sufficienttodamageES devices.

6. DonotremoveareplacementES device fromits protective

packageuntil immediatelybeforeyou arereadytoinstall it. (Most

replacementES devices arepackagedwithleadselectrically

shortedtogetherbyconductivefoam, alminumfoil or

comparableconductivematerial).

7. Immediatelybeforeremoving theprotectivematerial fromthe

leadsofareplacementES device, touchtheprotectivematerial to

thechassisorcircuitassemblyintowhichthedevice will be

installed.

Caution

Besureno powerisappliedtothechassisorcircuit, and observe

all othersafetyprecautions.

8. Minimizebodilymotionswhenhandling unpackagedreplacement

ES devices. (Otherwise hamless motion suchas thebrushing

togetherofyourclothes fabricorthelifting ofyourfootfroma

carpetedfloorcangenerate staticelectricity(ESD)sufficient

todamageanES device).

3. About lead free solder(PbF)

Note:Leadislistedas (Pb)intheperiodictableofelements.

Intheinformation below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.

TheLeadFree Solderusedinour manufacturing process and discussedbelowis(Sn+Ag+Cu).

ThatisTin(Sn), Silver(Ag)and (Cu)although othertypes areavailable.

Thismodel uses PbFree solderinit’smanufactureduetoenvironmental conservation issues.

For service and repairwork, we’dsuggesttheuse ofPbfree solderas well, although Pbsolder

may beused.

PCBsmanufacturedusing leadfree solderwill have thePbF withinaleafSymbol

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stampedon theback ofPCB.

Caution

-Pbfree solderhas ahighermelting pointthanstandardsolder.

Typicallythemelting pointis50 ~70 ~F(30~40~C)higher. Please

use ahigh temperaturesoldering iron and set itto700 ±20 ~F(370

±10 ~C).

-Pbfree solderwill tend tosplashwhenheatedtoo high (about1100

~For600~C).

Ifyou must use Pbsolder, please completelyremoveall ofthePb

free solderon thepinsorsolderarea beforeapplying Pbsolder. If

thisisnotpractical, besuretoheat thePbfree solderuntil itmelts,

beforeapplying Pbsolder.

-Afterapplying PbF soldertodoublelayeredboards, please check

thecomponentsideforexcess solderwhichmayflow ontothe

opposite side. (see figurebelow)

SuggestedPbfree solder

Thereareseveral kindsofPbfree solderavailablefor purchase. Thisproductuses Sn+Ag+Cu

(tin, silver, copper)solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth)soldercan

alsobeused.

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4. Self Check

1. Self-Check isusedtoautomaticallycheck thebuslines and

hexadecimal codeoftheTVset.

2. To get intotheSelf-Check modepress theDown( )

button on thecustomercontrolsat thefrontoftheset, at thesame

timepressing theRecall button on theremote control, andthe

screenwill show :

IftheCCU portshave beencheckedand found tobeincorrector notlocatedthen“--”will appear

inplace of“O.K.”.

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5. ChasisBoardLayout

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