Panasonic TH-80LF50ER Manuale utente

Service Manual

FULL HD LCD Display

TH-80LF50ER

LA40 Chassis

Unauthorized copying and

distribution is a violation of law.

ORDER No. PCZ1212158CE

This service information is designed for experienced repair technicians only and is not designed for use by the general public. It does not

contain warnings or cautions to advise non-technical individuals of potencial dangers in attempting to service a product. Products

powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service or repair the

product or products deal within this service information by anyone else could result in serious injury or death.

Warning

CONTENTS

SAFETY PRECAUTIONS ........................................... 3

GENERAL GUIDE LINES...................................... 3

TOUCH – CURRENT CHECK.................................

PREVENTION OF ELECTROSTATIC DISCHARGE

(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)

DEVICES................................................................... 4

ABOUT LEAD FREE SOLDER (PBF)......................... 5

SUGGESTED PB FREE SOLDER........................ 5

APPLICABLE INPUT SIGNALS.................................. 6

SERVICE HINTS......................................................... 9

CHASSIS BOARD LAYOUT ..................................... 10

OPERATING INSTRUCTIONS................................. 11

OPTION MENU......................................................... 12

SERVICE MODE....................................................... 13

CAT (COMPUTER AIDED TEST) MODE ................. 13

IIC MODE.................................................................. 13

CD MODE, SD MODE .............................................. 14

MS MODE, ID MODE.................................................15

IIC MODE STRUCTURE............................................16

SELF CHECK ........................................................... 17

POWER LED BLINKING TIMING CHARD................ 18

ADJUSTMENT METHOD ......................................... 19

WIRING DIAGRAM................................................... 20

BLOCK DIAGRAM ................................................... 21

PARTS LOCATION................................................... 24

LOCATION OF LEAD WIRING................................. 26

REPLACEMENT PARTS LIST NOTE....................... 27

SCHEMATIC DIAGRAMS NOTE.............................. 64

A-BOARD (1 OF 13) SCHEMATIC DIAGRAM.... 65

HX-BOARD SCHEMATIC DIAGRAM.................. 78

DS-BOARD (1 OF 2) SCHEMATIC DIAGRAM ... 79

V1-BOARD SCHEMATIC DIAGRAM .................. 81

V2-BOARD SCHEMATIC DIAGRAM .................. 82

CONDUCTOR VIEWS.............................................. 83

Safety Precautions

General Guide Lines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated

or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following touch current checks to prevent the customer from being exposed to shock hazards.

4. Always adjustment sheet TBMV100 is correctly replaced before returning to customer (see Fig.1).

Touch-Current Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth

ground such as a water pipe, as shown in Fig. 2.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reserve the AC plug in the AC outlet and repeat each of the above measure.

6. The potential at any point (TOUCH CURRENT) expressed as voltage U1 and U2, does not exceed the following values:

For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);

For d. c.: U1 = 1.0 V,

Note:

The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and

2.0 mA d. c.

The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100

kHz.

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should

be repaired and rechecked before it is returned to the customer.

Fig. 2

APPLIANCES

EXPOSED

METAL PARTS

Resistance values in ohms ()

R0=500



RS=1500



CS=0.22



10k



0.022



COLD

WATER PIPE

(EARTH GROUND)

V: Voltmetr or oscilloscope

(r.m.s. or peak reading)

Measuring network for TOUCH CURRENTS

Input resistance: 1M



Input capacitance:200pF

Frequency range: 15Hz to 1MHz and d.c.respectively

NOTE – Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms

U2(V)

Fig. 1

U1(V)

Prevention of Electrostatic Discharge (ESD) to Electrostatically

Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are

called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect

transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of

component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on

your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD

wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD

protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil

or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective

material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity

(ESD) sufficient to damage an ES device).

There are special components used in this equipment which are important for safety.

These parts are marked by in schematic diagrams, exploded views and replacement parts list. It is essential that

these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire, or other hazards. Do

not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work,

we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

stamped on the back of PCB.

Caution

Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C)

higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before

applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

After applying PbF solder to double layered boards, please check the component side for excess solder which may

flow onto the opposite side. (see Fig.3)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.

However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used. (see Fig.4)

Fig.3

Fig.4

Applicable Input Signals

*Mark: applicable input signal

Signal name

Horizontal

frequency

(kHz)

Vertical

frequency

(Hz)

RGB IN

(Dot clock (MHz) PC IN

(Dot clock (MHz)

DVI-D IN

(Dot clock (MHz)

HDMI

1 640x400@70Hz 31.46 70.07 * (25.17) * (25.17)

2 640x480@60Hz 31.47 59.94 * (25.18) * (25.18) * (25.18) *

3 640x480@72Hz 37.86 72.81 * (31.5) * (31.5)

4 640x480@75Hz 37.50 75.00 * (31.5) * (31.5)

5 640x480@85Hz 43.27 85.01 * (36.0) * (36.0)

6 800x600@56Hz 35.16 56.25 * (36.0) * (36.0)

7 800x600@60Hz 37.88 60.32 * (40.0) * (40.0) * (40.0) *

8 800x600@72Hz 48.08 72.19 * (50.0) * (50.0)

9 800x600@75Hz 46.88 75.00 * (49.5) * (49.5)

10 800x600@85Hz 53.67 85.06 * (56.25) * (56.25)

11 852x480@60Hz 31.47 59.94 * (33.24) *

12 1,024x768@50Hz 39.55 50.00 * (51.89) *

13 1,024x768@60Hz 48.36 60.00 * (65.0) * (65.0) * (65.0) *

14 1,024x768@70Hz 56.48 70.07 * (75.0) * (75.0)

15 1,024x768@75Hz 60.02 75.03 * (78.75) * (78.75)

16 1,024x768@85Hz 68.68 85.00 * (94.5) * (94.5)

17 1,066x600@60Hz 37.64 59.94 * (53.0) *

18 1,152x864@60Hz 53.70 60.00 * (81.62) *

19 1,152x864@75Hz 67.50 75.00 * (108.0) * (108.0)

20 1,280x768@60Hz 47.70 60.00 * (80.14) * (80.14)

21 1,280x960@60Hz 60.00 60.00 * (108.0) * (108.0)

22 1,280x960@85Hz 85.94 85.00 * (148.5) * (148.5)

23 1,280x1,024@60Hz 63.98 60.02 * (108.0) * (108.0) * (108.0) *

24 1,280x1,024@75Hz 79.98 75.02 * (135.0) * (135.0)

25 1,280x1,024@85Hz 91.15 85.02 * (157.5) * 1

26 1,366x768@50Hz 39.55 50.00 * (69.92) *

27 1,366x768@60Hz 48.36 60.00 * (86.71) * (86.71) * (87.44) *

28 1,400x1,050@60Hz 65.22 60.00 * (122.61) *

29 1,600x1,200@60Hz 75.00 60.00 * (162.0) * (162.0) * (162.0) *

30 1,920x1,080@60Hz 67.50 60.00 * (148.5) * (148.5) * (148.5) *

31 1,920x1,200@60Hz 74.04 59.95 * (154.0) *

32 Macintosh 13‘‘ (640 x 480) 35.00 66.67 * (30.24) * (30.24)

33 Macintosh 16‘‘ (832 x 624) 49.72 74.55 * (57.28) * (57.28)

34 Macintosh 21‘‘ (1,152 x 870) 68.68 75.06 * (100.0) * (100.0)

PC signals

*Mark:applicable input signal

*1: Based on SMPTE 274M standard.

*2: Based on SMPTE RP211 standard.

Signal name

Horizontal

frequency

(kHz)

Vertical

frequency

(Hz)

Component IN

(Dot clock (MHz) DVI_IN

(Dot clock (MHz) HDMI

1 525(480)/60i 15.73 59.94 *(13.5) *(27.0) *

2 525(480)/60p 31.47 59.94 *(27.0) *(27.0) *

3 625(575)/50i 15.63 50.00 *(13.5)

4 625(576)/50i 15.63 50.00 *(27.0) *

5 625(575)/50p 31.25 50.00 *(27.0)

6 625(576)/50p 31.25 50.00 *(27.0) *

7 750(720)/60p 45.00 60.00 *(74.25) *(74.25) *

8 750(720)/50p 37.50 50.00 *(74.25) *(74.25) *

9 1.125(1.080)/60p 67.50 60.00

*(148.5)*1 *(148.5) *

10 1.125(1.080)/60i 33.75 60.00

*(74.25)*1 *(74.25) *

11 1.125(1.080)/50p 56.25 50.00

*(148.5)*1 *(148.5) *

12 1.125(1.080)/50i 28.13 50.00

*(74.25)*1 *(74.25) *

13 1.125(1.080)/24sF 27.00 48.00

*(74.25)*2

14 1.125(1.080)/30p 33.75 30.00

*(74.25)*1 *(74.25) *

15 1.125(1.080)/25p 28.13 25.00

*(74.25)*1 *(74.25) *

16 1.125(1.080)/24p 27.00 24.00

*(74.25)*1 *(74.25) *

Signal name

Horizontal

frequency

(kHz)

Vertical

frequency

(Hz)

1 NTSC 15.73 59.94

2 PAL 15.63 50.00

3 PAL60 15.73 59.94

4 SECAM 15.63 50.00

5 NTSC 4.43 15.73 59.94

6 PAL N 15.63 50.00

7 PAL M 15.73 59.94

Component signals

Video signals (VIDEO)

Specifications

Power Source: 220-240V AC, 50/60 Hz

Power Consumption:

Power on: 380W

Stand-by condition: 0.5W

Power off condition: 0.3W

LCD Display panel: L5EDDYY00434

16:9 aspect ratio

Screen size: Wight: Height: Diagonal:

1,771mm 996mm 2,032mm

(No. of pixels) 2,073.600 (1,920 (W) x 1,080 (H))

Operating Conditions: Temperature: 0°C ÷40°C

Humidity: 20% ÷80%

Applicable signals:

Colour System: NTSC, PAL, PAL60, SECAM, NTSC 4.43, PAL M, PAL N

Scanning Format: 525 (480) / 60i, 60p

625 (575) / 50i, 50p

750 (720) / 60p, 50p

1,125 (1,080) / 60i, 60p, 50i, 50p, 24p, 25p, 30p, 24sF

PC signals: VGA, SVGA, XGA, SXGA, UXGA ....(compressed)

Horizontal scanning frequency 30 – 110 kHz

Vertical scanning frequency 48 – 120 Hz

Connection Terminals:

VIDEO IN BNC 1.0 Vp-p (75Ω)

AUDIO L-R RCA Pin jack x 2 0.5 Vrms

HDMI Type A Connectors

COMPONENT/RGB IN:

G/Y BNC with sync 1.0 Vp-p (75Ω)

B/PB/CB BNC 0.7 Vp-p (75Ω)

R/PR/CR BNC 0.7 Vp-p (75Ω)

AUDIO L-R RCA Pin jack x 2 0.5 Vrms

DVI-D IN DVI-D 24 Pin x 2 Compliance with DVI Revision 1.0

Content Protection Compatible with HDCP 1.1

AUDIO Stereo mini jack (M3) x 1 0.5 Vrms (Shared with PC IN)

DVI-D OUT DVI-D 24 Pin x 2 Compliance with DVI Revision 1.0

PC IN High-Density Mini D-sub 15PIN G: with sync 1.0 Vp-p (75Ω)

: without sync 0.7 Vp-p (75Ω)

B: 0.7 Vp-p (75Ω)

R: 0.7 Vp-p (75Ω)

HD/VD: 1.0-5.0 Vp-p (hight impedance)

AUDIO Stereo mini jack (M3) x 1 0.5 Vrms (Shared with DVI-D IN)

SERIAL IN External Control Terminal

SERIAL OUT D-sub 9 Pin x 2 RS-232C compatible

SLOT 2.0 Yes

AUDIO OUT L-R RCA PIN JACK x 2 (INPUT 1 kHz / 0 dB, 10 KΩLoad)

LAN RJ45 10BASE-T/100BASE-TX, compatible with PJLink™

Accessories supplied : Remote Control 2 x R6 (UM3) Batteries

Dimensions:

Width: Height: Depth:

1,848mm 1,073mm 89mm

Weight: 60.0 kg

Specifications are subject to change without notice.

Mass and dimensions shown are approximate.

Service Hints

How to remove the backcover

Remove the 46 fixing screws and 4 caps.

(1)

SCREWS

(1) XYN4+F10FJK /33pcs/

(2) THEL0429 /11pcs/

(3) XTV3+12JFJK /2pcs/

(4) TKKL5493 /4pcs/

(1)

(2)

(3)

(2)

(4)

Chassis Board Layout

Board Name Function

A-Board ST micro, YUV, Video IN, HDMI, DVI-IN/OUT, PC, LAN

DS-Board Slot Interface

HX-Board RS-232C_IN/OUT, AUDIO IN

V1-Board Remote Control Sensor, Power Indicator, Brightness Sensor

V2-Board Power Switch, Key Switch

P-Unit Power Supply

P-UNIT

V1-BOARD

A-BOARD

DS-BOARD

HX-BOARD

V2-BOARD

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