Panasonic TH-42PX20U/P Operating Manuale utente

ORDERNO. ITD0309035C1

B19 Canada: B07

High Definition Plasma Television

TH-42PX20U-P

GPH6DU Chassis

SPECIFICATIONS

Specifications

Power

Source AC 120 V, 50 / 60 Hz

Power

Consumption Maximum:595 W

Stand-bycondition :0.9W

Plasma

Displaypanel Drivemethod :AC type42-inch, 16 :9aspect ratio

Screen

Size 36.22 “ (920 mm) (W) × 20.39 “ (518 mm) (H) × 41.57 “ (1056 mm) (diagonal)

Dimensions

× H × D ) 44.88 “ (1140mm) × 29.8“ (757 mm) × 5.47 “ (139 mm)

Mass

(Weight) 90.4lb.(41 kg)Net

Channel

Capability-181 VHF-12 :UHF-56 :Cable-125

Sound

Speaker Woofer 80mm × 2, Tweeter 16mm × 73mm × 8

AudioOutput 26 W[ 5W+ 5W, 8W+ 8W] (10 %THD )

Headphone M3(3.5mm) Jack × 1

FEATURES

Twoscreendisplayfuctions 3D Y / C FILTER

BBE VIVA LINEAR PIP

CLOSED CAPTION V-Chip

Accessories

Supplied Remotecontrol Transmitter EUR7603ZB0

AA Battery× 2 Ferritecores (large× 5, small × 5)

AC Cord F typeAntennaAdaptor(3C-2V × 2, 5C-2V × 2)

Pedestal

Operating

Conditions Temperature : 34 ° F- 104 ° F(0° - 40 ° C)

Humidity: 20 %- 80 %(non-condensing)

Connection

Terminals RGB input D-SUB 15pin R, G, B / 0.7Vp-p(75 )

HD, VD / 1.0-5.0Vp-p(high

impedance)

AV INPUT1-3 VIDEO

(Phono Jack Type) 1.0Vp-p(75 )

S-VIDEO

(Mini DIN 4-pin) Y :1.0Vp-p(75 ), C : 0.286

(75 )

AUDIO L-R

(Phono Jack Type× 2) 0.5Vrms

AV PROG.OUT VIDEO

(Phono Jack Type) 1.0Vp-p(75 )

AUDIO L-R

(Phono Jack Type× 2) 0.5Vrms

TO AUDIO AMP AUDIO L-R

(Phono Jack Type× 2) 0.5Vrms

COMPONENTVIDEO Y 1.0Vp-p(including

synchronization)

INPUT1-2 PB / PR ±0.35 Vp-p

AUDIO L-R

(Phono Jack Type× 2) 0.5Vrms

HDMI INPUT HDMI typeAconnector

AUDIO L-R

(Phono Jack Type× 2) 0.5Vrms

Note

Design

and Specifications are subject tochange without notice.Weight and Dimensions shownare

approximate.

Unauthorized copying and distribution isaviolation of law.

1. Applicable signals

2. Safety Precautions

2.1. General Guidelines

1. When servicing, observe the original lead dress. Ifashort circuit

isfound, replace all parts which have been overheated or

damaged bythe short circuit.

2. After servicing, see to itthat all the protective devices such as

insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to

prevent the customer from being exposed to shock hazards.

2.1.1. Leakage Current ColdCheck

1. Unplug the AC cord and connect ajumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the

jumpered AC plug and each exposed metalliccabinet part on the

equipment such as screwheads, connectors, control shafts, etc.

When the exposed metallicpart has areturn path to thechassis,

the reading shouldbe between 1M and 5.2M . / When the

exposed metal does not have areturn path to the chassis, the

reading must be . Figure 1

2.1.2. Leakage Current Hot Check (See Figure 1 .)

1. Plug the AC cord directlyinto the AC outlet. Donot use an

isolation transformer for thischeck.

2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F

capacitors, between each exposed metallicpart on the set and a

good earth ground such as awater pipe, as shownin Figure 1.

3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to

measure the potential across the resistor.

4. Check each exposed metallicpart, and measure the voltage at

each point.

5. Reverse the AC plug inthe AC outlet and repeat each of the above

measurements.

6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A

leakage current tester (Simpson Model 229 or equivalent) maybe

used to make the hot checks, leakage current must not exceed 1/2

milliamp. Incase ameasurement isoutsideof the limits specified,

there isapossibilityof ashock hazard, and the equipment should

be repaired and rechecked before itisreturned to the customer.

3. Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical

ES devices are integratedcircuits and some field-effect transistorsand semiconductor"chip"

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equipped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischarging ESDwrist strap,

whichshouldbe removed for potential shock reasons prior to

applying power to the unitunder test.

2. After removing an electrical assemblyequipped with ES devices,

place the assemblyon aconductive surface such as alminum foil,

to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan anti-staticsolder removal device. Some solder

removal devices not classified as "anti-static(ESDprotected)"

can generate electrical charge sufficient to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, alminum foil or

comparableconductive material).

7. Immediatelybefore removing the protective material from the

leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

Caution

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodilymotions when handling unpackaged replacement

ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricity(ESD)sufficient

todamage an ES device).

4. About lead free solder (PbF)

Note: Leadis listedas (Pb) inthe periodic table of elements.

Inthe information below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.

The LeadFree Solderusedinourmanufacturing process and discussedbelowis (Sn+Ag+Cu).

That is Tin(Sn), Silver(Ag) and Copper(Cu) although othertypes are available.

This model uses PbFree solderinit’s manufacture due toenvironmental conservation issues.

Forservice and repairwork, we’dsuggest the use of Pbfree solderas well, although Pbsolder

maybe used.

PCBs manufacturedusing leadfree solderwill have the PbF withina leaf Symbol

stampedon the back of PCB.

Caution

-Pb free solder has ahigher melting point than standard solder.

Typicallythe melting point is50 ~ 70 °F (30~40 °C)higher. Please

use ahigh temperature soldering iron and set itto 700 ± 20 °F (370

± 10 °C).

-Pb free solder will tend to splash when heated too high (about 1100

°F or 600 °C).

Ifyou must use Pb solder, please completelyremove all of the Pb

free solder on the pins or solder area before applying Pb solder. If

thisisnot practical, be sure to heat the Pb free solder until it

melts, before applying Pb solder.

-After applying PbF solder to doublelayered boards, please check

the component side for excess solder which mayflow onto the

opposite side. (see figure below)

SuggestedPbfree solder

There are several kinds of Pbfree solderavailable forpurchase. This product uses Sn+Ag+Cu

(tin, silver, copper) solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder

canalsobeused.

5. Service Hint

BoardName Function BoardName Function

C1 DATA DRIVER (UPPER

RIGHT) PF LINE FILTER

C2 DATA DRIVER (UPPER

LEFT) SC SCAN DRIVE

D DIGTALSIGINALPROCESS SD SCAN OUT(DOWN)

DG DIGTALCORE MICOM SS SUSTAIN DRIVE

GFRONTTERMINAL, SWITCH SS2 SUSTAIN CONNECTION (UP)

H REAE TERMINAL SS3 SUSTAIN CONNECTION

(DOWN)

KLED, REMOTE, SU SCAN OUT(UP)

P POWER SUPPLY TA MAIN TUNER

PA DC/DC, AUDIO TB SUB TUNER

C3 DATA DRIVER (LOWER

RIGHT) JG PC/SD CARD

C4 DATA DRIVER (LOWER

LEFT) DV HDMI

S POWER SW

6. Location of Lead Wiring

6.1. Lead of Wiring (1)

6.2. Lead of Wiring (2)

6.3. Lead of Wiring (3)

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