Panasonic SA-HT535EE Manuale utente

ORDERNO. MD0508309C3

DVDHome Theater Sound System

SA-HT535EE

Colour

(S)...Silver Type

SPECIFICATIONS

Specification

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Amplifier Section

RMS Output Power: DolbyDigital Mode

Front Ch

55 Wper channel (6), 1kHz, 10%THD

Surround Ch

55 Wper channel (6), 1kHz, 10%THD

Center Ch

160 Wper channel (6), 1kHz, 10%THD

Subwoofer Ch

220 Wper channel (4), 100 Hz, 10%THD

Total RMS DolbyDigital Mode

Power

600 W

DIN Output Power: DolbyDigital Mode

Front Ch

40 Wper channel (6), 1kHz, 1%THD

Surround Ch

40 Wper channel (6), 1kHz, 1%THD

Center Ch

120 Wper channel (6), 1kHz, 1%THD

Subwoofer Ch

150 Wper channel (4), 100 Hz, 1%THD

Total DIN DolbyDigital Mode

Power

430 W

FM/AM Tuner, Terminals

Section

Preset station FM 15 stations

AM/MW15 stations

FrequencyModulation (FM)

FrequencyRange

87.50-108.00 MHz (50-kHz step)

Sensitivity 1.5V (IHF)

S/N 26 dB 1.2V

Antennaterminals 75 (unbalanced)

AmplitudeModulation (AM/MW)

FrequencyRange 522-1629 kHz (9-kHz step)

AM SensitivityS/N 20 dB at 999

kHz

560 V/m

PhoneJack

Terminal Stereo, 3.5mm jack

MicJack

Sensitivity 0.7mV, 1.2k

Terminal Mono, 6.3mm jack (2

systems)

Disc Section

Disc played[8cm or12 cm]

1. DVD (DVD-Video, DVD-Audio, DivX*1, 2)

2. DVD-RAM (DVD-VR, JPEG*2, 3, MPEG4*2, 4, DivX*1, 2)

3. DVD-R (DVD-Video, DivX*1, 2)

4. DVD-RW(DVD-Video, DVD-VR, DivX*1, 2)

5. +R/+RW(Video)

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6. CD, CD-R/RW[CD-DA, Video-CD, SVCD*5, MP3*2, 6, WMA*2, 7,

JPEG*2, 3, MPEG*2, 4, DivX*1, 2, HIGHMATLevel 2(Audioand

Image)]

*1 DivX 3.11, 4.x, 5.x

GMC (Global Motion Compensation) isnot supported.

*2 Thetotal combinedmaximumnumber of recognizableaudio,

picture and videocontentsand groups: 4000 audio, picture and

videocontentsand 400 groups.

*3 Exif Ver 2.1JPEG Baselinefiles

Picture resolution: between160 X 120 and 6144 X 4096 pixels

(Sub sampling is4:2:2or4:2:0)

*4 MPEG4datarecordedwithPanasonicSD multi-cameras or

DVD videorecorders

Conforming toSD VIDEO specifications(ASFstandard)/MPEG4

(SimpleProfile) videosystem/G.726 audiosystem

*5 Conforming toIEC62107.

*6 MPEG-1Layer 3, MPEG-2Layer 3.

*7 WindowsMediaAudioVer.9.0L3.

Not compatiblewithMultipleBit Rate(MBR)

Pick up

Wavelength CD 785 nm

DVD 662 nm

Laser power CLASS 2/CLASS 3A

Audiooutput (Disc)

Number of channels 5.1ch(FL, FR, C, SL, SR, SW)

VideoSection

VideoSystem

Signal system PAL625/50, PAL525/60, NTSC

Compositevideooutput

Output level 1 Vp-p(75 )

Terminal Pinjack (1system)

Scart jack (1system)

S-videooutput

Y output level 1 Vp-p(75 )

C output level PAL; 0.3Vp-p(75 )

NTSC; 0.286 Vp-p(75 )

Terminal S terminal (1system)

Scart jack (1system)

Component VideoOutput

[NTSC: 525 (480) p/525 (480) i, PAL: 625 (576) p/625 (576)i]

Y output level 1 Vp-p(75 )

PBoutput level 0.7Vp-p(75 )

PRoutput level 0.7Vp-p(75 )

Terminal

Pinjack (Y: green, PB: blue, PR: red) (1system)

RGB videooutput

R output level 0.7Vp-p(75 )

G output level 0.7Vp-p(75 )

B output level 0.7Vp-p(75 )

Terminal Scart jack (1system)

General

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Power Supply AC 230 V, 50 Hz

Power consumption 25 W(SA-HT535), / 250 W(SB

-WA535)

Dimensions(WxH xD) 430 x60 x348.3mm

Mass 2.7kg(SA-HT535)

Operating temperature range +5°C to+35 °C

Operating humidityrange

5%to90 %RH (no condensation)

Power consumption instandbymode: approx. 0.7W

*8Rating withlowcut filter equippedamplifier

System

System: SC-HT535 (EE)

Mainunit: SA-HT535 (EE-S)

Satellitespeaker: SB-HT535 (EG-S)

Activesubwoofer: SB-WA535 (EE-S)

Speakers: SB-HT535 (EG)

Front speakers: SB-FS535 (EG-S)

Surround speakers: SB-FS536 (EG-S)

Center speaker: SB-PC535 (EG-S)

Note:

1. Specificationsaresubject to changewithoutnotice. Mass and

dimensionsareapproximate.

2. Total harmonicdistortion ismeasured bythedigital spectrum analyzer.

Unauthorized copying and distribution isaviolation of law.

1. Use of Active Subwoofer

1.1. Checking MainUnitwhen Active Subwoofer isUsed

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1.2. Checking MainUnitUsing Power Jig

If the active subwooferis not available during time of repairtothe unit, the following equipment

couldbe used.

Jigproduct number

RFKZ0182 (110V , 127V, 220V, 230V - 240V forwithvoltage selectoroverseas domestic use).

2. Before Repair and Adjustment (Using Active

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Subwoofer Unit)

Disconnect AC power, discharge PowerSupplyCapacitors C2080 through a 10 , 10 W resistor

toground.

DO NOTSHORT-CIRCUITDIRECTLY (witha screwdriverblade, forinstance), as this may

destroysolidstate devices.

Afterrepairs are completed, restore powergraduallyusing a variac, toavoidovercurrent.

Current consumption at AC 230V, 50Hz inNO SIGNALmode shouldbe ~850 mA (Active

Subwoofer).

3. SAFETY PRECAUTIONS

3.1. GENERALGUIDELINES

1. When servicing, observe the original lead dress. Ifashort circuit

isfound, replace all parts which have been overheated or

damaged bythe short circuit.

2. After servicing, ensure that all the protective devices such as

insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to

prevent the customer from being exposed to shock hazards.

3.1.1. LEAKAGE CURRENTCOLD CHECK (FOR ACTIVE SUBWOOFER)

1. Unplug the AC cord and connect ajumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the

jumpered AC plug and each exposed metalliccabinet part on the

equipment such as screwheads, connectors, control shafts, etc.

When the exposed metallicpart has areturn path to the chassis,

the reading shouldbe between 1M and 5.2 . / When the

exposed metal does not have areturn path to the chassis, the

reading must be .

Fig. 1

3.1.2. LEAKAGE CURRENTHOTCHECK (See Figure1.)

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1. Plug the AC cord directlyinto the AC outlet. Donot use an

isolation transformer for thischeck.

2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F

capacitor, between each exposed metallicpart on the set and a

good earth ground such as awater pipe, as showninFigure 1.

3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to

measure the potential across the resistor.

4. Check each exposed metallicpart, and measure the voltage at

each point.

5. Reverse the AC plug inthe AC outlet and repeat each of the above

measurements.

6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A

leakage current tester (Simpson Model 229 or equivalent) maybe

used to make the hot checks, leakage current must not exceed 1/2

milliamp. Incase ameasurement isoutside of the limits specified,

there isapossibilityof ashock hazard, and the equipment should

be repaired and rechecked before itisreturned to the customer.

4. Handling the Lead Solder

4.1. About lead free solder (PbF)

Distinction of PbF P.C.B. :

P.C.B.s (manufactured) using leadfree solderwill have a PbF stampon the P.C.B.

Caution:

-Pb free solder has ahigher melting point that standard solder;

Typicallythe melting point is50 -70°F (30 -40°C)higher. / Please

use ahigh temperature soldering iron. Incase of the soldering

iron with temperature control, please set itto 700 ± 20°F (370 ±

10°C).

-Pb free solder will tend to splash when heated too high (about

1100°F/600°C).

-When soldering or unsoldering, please completelyremove all of

the solder on the pins or solder area, and be sure to heat the

soldering points with the Pb free solder until itmelts enough.

5. Protection Circuitry

The protection circuitrymayhave operatedif eitherof the following conditions are noticed:

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-Nosound isheard when the power isturned on.

-Sound stops during aperformance.

The function of this circuitryis toprevent circuitrydamage if, forexample, the positive and

negative speakerconnection wires are

“shorted”, orif speakersystems withanimpedance less thanthe indicatedratedimpedance of

the amplifierare used.

If this occurs, followthe procedure outlines below:

1. Turn off the power.

2. Determine the cause of the problem and correct it.

3. Turn on the power once againafter one minute.

Note :

Whenthe protection circuitryfunctions, the unit will not operate unless the poweris first turned

off and thenon again.

6. Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor(solidstate) devices canbe damagedeasilybyelectricity. Such

components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical

ES devices are integratedcircuits and some field-effect transistors and semiconductor“chip”

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equiped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischarging ESDwrist strap, which

shouldbe removed for potential shock reasons prior to applying

power to the unitunder test.

2. After removing an electrical assemblyequiped with ES devices,

place the assemblyon aconductive surface such as aluminium

foil, to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan anti-staticsolder remover device. Some solder

removal devices not classified as “anti-static(ESDprotected)”

can generate electrical charge to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

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6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, aluminium foil or

comparableconductive material).

7. Immediatelybefore removing the protective material from the

leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

Caution

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodilymotions when handling unpackaged replacement

ES devices. (Otherwise harmless motion such as the brushing

together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricity(ESD)sufficient to

damage an ES device).

7. Cautions to Be Taken When Handling Optical

Pickup

-The laser diode used inside the optical pickup couldbe destroyed

due to staticelectricity(potential difference iscaused by

electrostaticload discharged from clothes and human body).

Handlethe parts carefullyto avoidelectrostaticdestruction during

repair&during replacement.

7.1. Handling Optical Pickup

1. Donot cause anystrong impact on optical pickup as the unit

structurallyuses an extremelyprecise technology.

2. Short-circuitthe flexiblecableof optical pickup removed from the

circuitboard using ashort-circuitpinor clipinorder to prevent

laser diode from electrostaticdestruction. (Refer to Fig. 7-1 and

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Fig. 7-2.)

3. Donot handleflexiblecables forciblyas thismaycause snapping.

Handlethe parts carefully. (Refer to Fig. 7-1)

4. Anew optical pickup isequipped with an anti-staticflexiblecable.

After replacing and connecting to the flexibleboard, cut the anti-

staticflexiblecable. (Refer to Fig. 7-1)

Fig. 7-1

Fig. 7-2

7.2. Cautions to BeTaken During Replacement of Optical Pickup

Suppliedoptical pickup is equippedwitha short clipfound at the end of flexible cable inorder

toprevent electrostatic destruction of laserdiode. Before connection, remove the short clip, and

check that the short land is opened(remove solderif the part is short-circuited). Alsoensure

humanbodyis properlyground (ReferSection 7.3)

7.3. Grounding for Preventing ElectrostaticDestruction

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