Panasonic TY-TP65P30K () Manuale utente

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ORDER NO. ITD1202004CE

Touch Panel

Model No. TY-TP65P30K

TY-TP65P30K

TABLE OF CONTENTS

PAGE

1Warning--------------------------------------------------------------3

1.1. Prevention of Electrostatic Discharge (ESD)

to Electrostatically Sensitive (ES) Devices ----------3

1.2. About lead free solder (PbF) ----------------------------4

2 Service Navigation------------------------------------------------5

2.1. Service Hint--------------------------------------------------5

3 Specifications ------------------------------------------------------6

4 Troubleshooting Guide------------------------------------------7

4.1. Diagnostic method of Bad P.C.B. ----------------------7

5 Disassembly and Assembly Instructions -----------------7

5.1. Cautions of Disassembling ------------------------------7

5.2. Removal of the Touch Panel ----------------------------7

5.3. Removal of CPU/X-LED1(Complete),

(Complete), X-LED3(Complete),

(Complete) and X-LED5(Complete) ------------ 7

5.4. Removal X-PHOTO1(Complete),

(Complete) , X-PHOTO3(Complete),

(Complete) ------ 8

5.5. Removal (Complete),

(Complete) and Y-LED3(Complete) ---------------- ---8

5.6. Removal Y-PHOTO1(Complete),

(Complete) --------------------9

6 Exploded View and Replacement Parts List ----------- 10

X-LED2

X-LED4

------

of X-PHOTO2

X-PHOTO4

and X-PHOTO5(Complete) --------

of Y-LED1 Y-LED2

of Y-PHOTO2

Y-PHOTO3(Complete)

TY-TP65P30K

1Warning

1.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-

tive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-

trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage

caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-

ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-

ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient

to damage an ES device).

TY-TP65P30K

1.2. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please

use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-

der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the

opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-

ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

TY-TP65P30K

2 Service Navigation

2.1. Service Hint

P.C.B. Arrangement

TY-TP65P30K

3 Specifications

Type Touch Panel

Power source

Voltage +5V DC ± 10%

Electric current +5V DC Max. 500 mA

Supply method From USB bus

Touch Panel

Detection system Infrared ray interruption detection

Panel window 5713/16” (1468.1 mm) (W) ×333/64” (839.1 mm) (H)

Detection range 561/2“ (1435 mm) (W) ×3145/64” (805 mm) (H)

Effective detection range Above detection range + 1.0 mm around all sides

Resolution 2297 (W) ×1289 (H)

Detection pitch 7/64” (2.5 mm) ×7/64” (2.5 mm)

Output system Coordinate output

Number of optical elements 288 (W) ×162 (H)

Optical element pitch 13/64” (5.0 mm) (W) ×13/64” (5.0 mm) (H)

Minimum stylus 9/32” (7.0 mm) (W) ×9/32” (7.0 mm) (H)

Interface

USB1.1 compliant

Signals: +DATA, -DATA, VCC, GND

Temperature When operating: 0 ~ 40°C (Temperature gradient 25°C /Hr or less) *1

Humidity When operating: 20 ~ 80% (No dewing) *1

Resistance to external light Lateral light 2,000 lx or higher (20°angle of incidence)

Frontal light 10,000 lx or higher (90°angle of incidence)

Panel shape Flat panel (Flat type)

External dimensions

(excluding projections and mounting brackets)

6133/64” (1,562.2 mm) (W) ×363/4” (933.2 mm) (H) ×31/64” (12 mm) (D)

Mass Approx. 7.28 lb. (3.3 kg)

Escutcheon material Aluminum

Computer IBM PC/AT compatible machine with USB ports

Windows XP (SP2 or later, 32 bit or 64 bit)

Windows Vista (32 bit or 64 bit)

Windows 7 (SP1 or later, 32 bit or 64 bit)

*1 For the touch panel only (when mounted to the main device, it follows the conditions of the main device.)

TY-TP65P30K

4 Troubleshooting Guide

4.1. Diagnostic method of Bad P.C.B.

• The diagnostic software “TDxx3UFtestPG“ enables the diagnostic of the P.C.B. and the identification of the defective P.C.B..

Click here for downloading the diagnostic software “TDxx3UFtestPG“.

• Unzip downloaded “soft_check_P30e.zip“ to extract the original files “TDxx3UFtestPG.exe“ and “Diagnostic_Manual_e.pdf“ in

folder “TDxx3UFtestPGe“.

• To use the product connecting with a Windows XP computer, the touch panel driver must be installed.

(Refer to Touch Panel Driver Software Installation Manual.)

4.2. Diagnostic procedures

1. Install the diagnostic software “TDxx3UFtestPG.exe“.

2. Connect the USB cable for the touch panel to the computer.

3. Start the installed software “TDxx3UFtestPG.exe“.

4. Use the self-test.

5. Confirm each block with the photo transistor output level test.

(Verify that the outputs of all elements are 200mV or more at gain zero with a PDP connected.)

6. Identify the defective blocks with the gain switching test (0 to 3).

(If the photo transistor output level is 200mV or less at gain zero, then replace the corresponding P.C.B..)

7. Identify the defective P.C.B. with the LED current verification.

■Please refer to the how to use the diagnostic software “TDxx3UFtestPG“ and how to identify the defective P.C.B..

4.3. Diagnostic method

TY-TP65P30K

5 Disassembly and Assembly Instructions

5.1. Cautions of Disassembling

• When disassembling the P.C.B., use Philips screwdriver

#1(with a diameter of 5mm) .

• and marks indicate screw positions.

5.2. Removal of the Touch Panel

1. Remove the 4 Attachment Bracket_2’s and then remove

the Touch Panel.

2. Turn over the Touch Panel.

3. Remove 8 screws and then remove 2 Attachment

Bracket_1 Top’s and 2 Attachment Bracket_1 Bottom’s.

5.3. Removal of CPU/X-LED1(Com-

plete), X-LED2(Complete), X-

LED3(Complete), X-LED4(Com-

plete) and X-LED5(Complete)

1. Remove the Touch Panel.

(Refer to removal of the Touch Panel.)

2. Remove 4 screws ( ) and then remove 2 Corner

Piece’s.

3. Remove 5 screws ( ) and then remove the Escutcheon

XL Assy.

4. Turn over the Touch Panel (turn to the front).

5. Remove double-sided tapes on the back side of each

flexible cable.

6. Remove screws of the P.C.B..

7. Turn over the P.C.B. and then remove the flexible cables

from it.

(Remove the USB Cable when CPU/X-LED1(Complete)

is replaced.)

8. Remove the P.C.B..

5.4. Removal of X-PHOTO1(Com-

plete), X-PHOTO2(Complete) ,

X-PHOTO3(Complete), X-

PHOTO4(Complete) and X-

PHOTO5 (Complete)

1. Remove the Touch Panel.

(Refer to removal of the Touch Panel.)

2. Remove 4 screws ( ) and then remove 2 Corner

Piece’s.

TY-TP65P30K

3. Remove 6 screws ( ) and then remove the Escutcheon

XP.

4. Turn over the Touch Panel (turn to the front).

5. Remove double-sided tapes on the back side of each

flexible cable.

6. Remove screws of the P.C.B..

7. Turn over the P.C.B. and then remove the flexible cables

from it.

8. Remove the P.C.B..

5.5. Removal of Y-LED1(Complete),

Y-LED2(Complete) and Y-

LED3(Complete)

1. Remove the Touch Panel.

(Refer to removal of the Touch Panel.)

2. Remove 4 screws ( ) and then remove 2 Corner

Piece’s.

3. Remove 9 screws ( ) and then remove the Escutcheon

YL and Cover.

4. Turn over the Touch Panel (turn to the front).

5. Remove double-sided tapes on the back side of each

flexible cable.

6. Remove screws of the P.C.B..

7. Turn over the P.C.B. and then remove the flexible cables

from it.

8. Remove the P.C.B..

5.6. Removal of Y-PHOTO1(Com-

plete), Y-PHOTO2(Complete)

and Y-PHOTO3(Complete)

1. Remove the Touch Panel.

(Refer to removal of the Touch Panel.)

2. Remove 4 screws ( ) and then remove 2 Corner

Piece’s.

3. Remove 6 screws ( ) and then remove the Escutcheon

YP.

4. Turn over the Touch Panel (turn to the front).

5. Remove double-sided tapes on the back side of each

flexible cable.

6. Remove screws of the P.C.B..

TY-TP65P30K

7. Turn over the P.C.B. and then remove the flexible cables

from it.

8. Remove the P.C.B..

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