Panasonic TY-FB9TU Manuale utente

ORDERNO.ITD0604018CE

D10 Canada: B07

U/VTuner Board with MATE I/FBoard

TY-FB9TU

SPECIFICATIONS

Specification

Channel Capability-181 VHF-12: UHF-56: Cable-125

Connection Terminals

AV INPUT VIDEO (RCAPIN JACK TYPE) 1.0Vp-p(75 )

S VIDEO (Mini DIN 4-pin) Y: 1.0Vp-p(75 ), C: 0.286 Vp-p(75 )

AUDIO L-R (RCAPIN JACK TYPE) 0.5Vrms

AV OUTPUT Video(RCAPIN JACK TYPE) 1.0Vp-p(75 )

*Cannot output UHF/VHFsignals.

AUDIO L-R (M3JACK TYPE) 0.5Vrms

Digital interface port /

(MATE) RJ-11C

RemoteControl Model No.N2QAFB000003

Mass (weight) approx. 160 g(5.6oz) (including batteries)

Operating range approx. 7m(23 feet) directlyinfront of theunit

Unauthorized copying and distribution isaviolation of law.

1. Safety Precautions

1.1. General Guidelines

1. When servicing, observe the original lead dress. Ifashort circuit

isfound, replace all parts which have been overheated or

damaged bythe short circuit.

2. After servicing, see to itthat all the protective devices such as

insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to

prevent the customer from being exposed to shock hazards.

1.1.1. Leakage Current ColdCheck

1. Unplug the AC cord and connect ajumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the

jumpered AC plug and each exposed metalliccabinet part on the

equipment such as screwheads, connectors, control shafts, etc.

When the exposed metallicpart has areturn path to the chassis,

the reading shouldbe between 1M and 5.2M .

When the exposed metal does not have areturn path to the

chassis, the reading must be .

Figure 1

1.1.2. Leakage Current Hot Check (See Figure 1.)

1. Plug the AC cord directlyinto the AC outlet. Donot use an

isolation transformer for thischeck.

2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F

capacitors, between each exposed metallicpart on the set and a

good earth ground such as awater pipe, as shownin Figure 1.

3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to

measure the potential across the resistor.

4. Check each exposed metallicpart, and measure the voltage at

each point.

5. Reverse the AC plug inthe AC outlet and repeat each of the above

measurements.

6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A

leakage current tester (Simpson Model 229 or equivalent) maybe

used to make the hot checks, leakage current must not exceed 1/2

milliamp. Incase ameasurement isoutside of the limits specified,

there isapossibilityof ashock hazard, and the equipment should

be repaired and rechecked before itisreturned to the customer.

2. Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical

ES devices are integratedcircuits and some field-effect transistors and semiconductor"chip"

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equipped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischarging ESDwrist strap, which

shouldbe removed for potential shock reasons prior to applying

power to the unitunder test.

2. After removing an electrical assemblyequipped with ES devices,

place the assemblyon aconductive surface such as alminum foil,

to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan anti-staticsolder removal device. Some solder

removal devices not classified as "anti-static(ESDprotected)"

can generate electrical charge sufficient to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, alminum foil or comparable

conductive material).

7. Immediatelybefore removing the protective material from the

leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

Caution

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodilymotions when handling unpackaged replacement

ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricity(ESD)sufficient to

damage an ES device).

3. About lead free solder (PbF)

Note: Leadis listedas (Pb) inthe periodic table of elements.

Inthe information below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.

The LeadFree Solderusedinourmanufacturing process and discussedbelowis (Sn+Ag+Cu).

That is Tin(Sn), Silver(Ag) and Copper(Cu) although othertypes are available.

This model uses PbFree solderinit’s manufacture due toenvironmental conservation issues.

Forservice and repairwork, we’dsuggest the use of Pbfree solderas well, although Pbsolder

maybe used.

PCBs manufacturedusing leadfree solderwill have the PbF withina leaf Symbol

stampedon the back of PCB.

Caution

-Pb free solder has ahigher melting point than standard solder.

Typicallythe melting point is50 ~ 70 °F (30~40°C)higher. Please

use ahigh temperature soldering iron and set itto 700 ± 20 °F (370

± 10 °C).

-Pb free solder will tend to splash when heated too high (about 1100

°F or 600 °C).

Ifyou must use Pb solder, please completelyremove all of the Pb

free solder on the pins or solder area before applying Pb solder. If

thisisnot practical, be sure to heat the Pb free solder until it

melts, before applying Pb solder.

-After applying PbF solder to doublelayered boards, please check

the component side for excess solder which mayflow onto the

opposite side. (see figure below)

SuggestedPbfree solder

There are several kinds of Pbfree solderavailable forpurchase. This product uses Sn+Ag+Cu

(tin, silver, copper) solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder

canalsobe used.

4. Installation

5. Antenna connection

6. Connection of external equipment

7. Circuit Board Layout

7.1. HMB-Board

8. Block and Schematic Diagram

8.1. SchematicDiagram Notes

8.2. HMB-Board Block Diagram

8.3. HMB-Board (1 of 4) SchematicDiagram

8.4. HMB-Board (2 of 4) SchematicDiagram

8.5. HMB-Board (3 of 4) SchematicDiagram

8.6. HMB-Board (4 of 4) SchematicDiagram

9. Replacement Parts List

9.1. Replacement Parts List Notes

9.2. Electrical Replacement Parts List

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