Panasonic TH-37PA30E Manuale utente

ORDERNO. ITD0403002C2

Progressive Plasma Television

TH-37PA30E / TH-42PA30E

GP6DEChassis

SPECIFICATIONS

Specifications

Power

Source 220 V -240 V 50 Hz /60 Hz A.C.

Power

Consumption 245 W(TH-37PA30E)

Normal use 315 W(TH-42PA30E)

Standby 1.8W

Power-OFF 1.0W

Plasma

Displaypanel

Drivemethod AC type

Aspect Ratio 16:9

Contrast Ratio 4000:1

Screensize(No.of pixels) 37-inch(TH-37PA30E)

818 mm (W) × 461 mm (H) × 939 mm (diagonal)

42-inch(TH-42PA30E)

920 mm (W) × 518 mm (H) × 1,056 mm (diagonal)

408,960 (852 (W) × 480 (H)) [2,556 × 480 dots]

Sound

Speaker Woofer 80 mm × 2, Tweeter 16 mm × 73 mm × 8

AudioOutput 26 W[ 8W+8W, 5W+5W] ((10 %THD)

Headphone M3(3.5mm) Jack × 1

Applicable

signals

ColourSystem NTSC, PAL, PAL60, SECAM, ModifiedNTSC

Scanning format 525 (480) /60i 60p, 625 (575) /50i 50p

PC signals VGAdisplay

VGA

SVGA, XGA, SXGA, UXGA..... (compressed)

Horizontal scanning frequency15 - 110 kHz

Vertical scanning frequency48 - 120 Hz

Receiving

Systems/Band

name

PALB, G, H, I, SECAM B, G SECAM L/ L’

VHFE2-E12 VHFH1-H2(ITALY)

VHFA-H (ITALY) UHFE21 -E69

CATV (S01 -S05) CATV S1-S10 (M1-M10)

CATV S11 -S20 (U1-U10) CATV S21 -S41 (Hyperband)

PALD, K, SECAM D, K

VHFR1-R2 VHFR3-R5

VHFR6-R12 UHFE21 -E69

PAL525/60 Playback of NTSC tapefromsome PALVideorecorders (

VCR)

M.NTSC Playback fromM.NTSC Videorecorders (VCR)

NTSC (AV INPUTONLY) Playback fromNTSC Videorecorders (VCR)

OUTPUT

AUDIO OUT AUDIO L-R (RCAPinType× 2) 0.5Vrms

INPUT

AV3-Front VIDEO (RCAPinType× 2) 1.0Vp-p(75 )

S-VIDEO (MINI DIN 4-pin) Y: 1.0Vp-p(75 ) C:0.286 Vp-p(75 )

AUDIO L-R (RCAPinType× 2) 0.5Vrms

AV4C-Rear Y 1.0Vp-p(including synchronization)

PB/PR±0.35 Vp-p

PC (HIGH-DENSITY D-SUB 15PIN) R, G, B/ 0.7Vp-p(75 )

HD, VD / 1.0- 5.0Vp-p(high impedance)

Others SD Cardslot × 1, PC Cardslot × 1

INPUT

/OUTPUT

AV1-Rear 21 Pinterminal (Audio/Videoin, TV out, RGB in)

AV2-Rear 21 Pinterminal (Audio/Videoin, Audio/Videoout, S-Videoin, Q-Link)

AV4-Rear 21 Pinterminal (Audio/Videoin, Audio/Videoout, S-Videoin, RGB in, Q-Link)

ANT

-Rear UHF/ VHF

Operating

Conditions Temperature :0° - 40 °C

Humidity:20 %- 80 %RH (non-condensing)

Accessories

Supplied

RemoteControl

Transmitter EUR7635020

Batteries 2 × R6Size

Clamper TMME206 × 2

Ferritecore Largesize× 2, Small size× 5

Dimensions

( W× H × D ) 1,040 mm × 697 mm × 139 mm (TH-37PA30E)

1,140 mm × 757 mm × 139 mm (TH-42PA30E)

Mass

(Weight) 34.5kg(TH-37PA30E)

41.0kg(TH-42PA30E)

Notes

Design and specificationsare subject tochangewithout notice.Mass and dimensionsshownare approximate.

Thisequipment complies withtheEMC standardslistedbelow.

EN55013,EN61000-3-2,EN61000-3-3,EN55020.

Unauthorized copying and distribution isaviolation of law.

1. Applicable signals

2. Safety Precautions

2.1. General Guidelines

1. When servicing, observe the original lead dress. Ifashort circuit

isfound, replace all parts which have been overheated or

damaged bythe short circuit.

2. After servicing, see to itthat all the protective devices such as

insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to

prevent the customer from being exposed to shock hazards.

2.2. Touch-Current Check

1. Plug the AC cord directlyinto the AC outlet. Donot use an

isolation transformer for thischeck.

2. Connect ameasuring network for touch currents between each

exposed metallicpart on the set and agood earth ground such as

awater pipe, as showninFigure 1.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to

measure the potential across the measuring network.

4. Check each exposed metallicpart, and measure the voltage at

each point.

5. Reserve the AC plug inthe AC outlet and repeat each of the above

measure.

6. The potential at anypoint (TOUGHCURRENT) expressed as

voltage U1and U2, does not exceed the following values:

For a. c.:U1= 35 V(peak) and U2= 0.35 V(peak);

For d. c.:U1= 1.0V,

Note:

The limit value of U2= 0.35 V (peak) fora. c. and U1= 1.0 V ford. c. correspond tothe values 0.7

mA (peak) a. c. and 2.0 mA d. c.

The limit value U1= 35 V (peak) fora. c. correspond tothe value 70 mA (peak) a. c. for

frequencies greaterthan100 kHz.

7. Incase ameasurement isout of the limits specified, there isa

possibilityof ashock hazard, and the equipment shouldbe

repaired and rechecked before itisreturned to the customer.

Figure 1

3. Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical

ES devices are integratedcircuits and some field-effect transistorsand semiconductor"chip"

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equipped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischarging ESDwrist strap,

whichshouldbe removed for potential shock reasons prior to

applying power to the unitunder test.

2. After removing an electrical assemblyequipped with ES devices,

place the assemblyon aconductive surface such as alminum foil,

to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan anti-staticsolder removal device. Some solder

removal devices not classified as "anti-static(ESDprotected)"

can generate electrical charge sufficient to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, alminum foil or

comparableconductive material).

7. Immediatelybefore removing the protective material from the

leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

Caution

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodilymotions when handling unpackaged replacement

ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricity(ESD)sufficient

todamage an ES device).

4. About lead free solder (PbF)

Note: Leadis listedas (Pb) inthe periodic table of elements.

Inthe information below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.

The LeadFree Solderusedinourmanufacturing process and discussedbelowis (Sn+Ag+Cu).

That is Tin(Sn), Silver(Ag) and Copper(Cu) although othertypes are available.

This model uses PbFree solderinit’s manufacture due toenvironmental conservation issues.

Forservice and repairwork, we’dsuggest the use of Pbfree solderas well, although Pbsolder

maybe used.

PCBs manufacturedusing leadfree solderwill have the PbF withina leaf Symbol

stampedon the back of PCB.

Caution

-Pb free solder has ahigher melting point than standard solder.

Typicallythe melting point is50 ~ 70 °F (30~40 °C)higher. Please

use ahigh temperature soldering iron and set itto 700 ± 20 °F (370

± 10 °C).

-Pb free solder will tend to splash when heated too high (about 1100

°F or 600 °C).

Ifyou must use Pb solder, please completelyremove all of the Pb

free solder on the pins or solder area before applying Pb solder. If

thisisnot practical, be sure to heat the Pb free solder until it

melts, before applying Pb solder.

-After applying PbF solder to doublelayered boards, please check

the component side for excess solder which mayflow onto the

opposite side. (see figure below)

SuggestedPbfree solder

There are several kinds of Pbfree solderavailable forpurchase. This product uses Sn+Ag+Cu

(tin, silver, copper) solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder

canalsobeused.

5. Service Hint

Stand the unit usedforpedestal.

Remove the RearCover.

Remove the AV ConnectorCover.

Service position.

Board

Name Function

C1 DATA DRIVER (RIGHT)

C2 DATA DRIVER (LEFT)

DDIGTALSIGNALPROCESS

DG DIGTALCORE, MICOM

GFRONTTERMINAL, SWITCH

H REAR TERMINAL

JG SD CARD/PC CARD, JPEG I/FD/A

KLED, REMOTE, POWER SWITCH

P POWER SUPPLY

PA DC/DC, AUDIO

PF LINE FILTER

S POWER SWITCH

SC SCAN DRIVE

SD SCAN OUT(DOWN)

SS SUSTAIN DRIVE

SS2 SUSTAIN CONNECTION (UP)

SS3 SUSTAIN CONNECTION (DOWN)

SU SCAN OUT(UP)

TTUNER

6. P.C.Board and Plasma panel replacement method

To replace the plasma panel (finished), place the unit on the servicing stand, remove the

front frame (finished), and replace the panel, being careful not toscratchthe plasma panel

surface.

1. Remove the rear cover and the AVconnector cover.

2. Remove the P-Board.

A. Remove the couplers (P2, P5, P7, P9, P11, P12, P23, P25, P27).

B. Remove the screws(×5) and remove the P-Board.

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