Panasonic AG-DV2500P Manuale utente

ORDERNO. BSD0303M901

D21

DVVIDEO CASSETTERECORDER

AG-DV2500P/ AG-DV2500E

Please refer to theOperating Instructionsin theappendix

folder. / (Go to Appendix List)

SAFETYPRECAUTIONS

GENERALGUIDELINES

1. Whenservicing, observetheoriginal leaddress. Ifashort/ circuit

isfound, replace all parts whichhavebeenover-heatedor

damagedbytheshortcircuit.

2. Afterservicing, see toitthat all theprotectivedevices suchas

insulation barriers, insulation papersshieldsareproperlyinstalled.

3. Afterservicing, make thefollowing leakagecurrentchecks to

preventthecustomerfrombeing exposedtoshock hazards.

LEAKAGE CURRENTCOLDCHECK

1. Unplug theACcordand connect ajumperbetweenthetwoprongs

on theplug.

2. Measuretheresistance value, withanohmmeter, betweenthe

jumperedACplug and eachexposedmetalliccabinet parton the

equipmentsuchas screwheads, connectors, control shafts, etc.

Theresistance valuemust bemorethan5M .

Figure1

LEAKAGE CURRENTHOTCHECK (See Figure1)

1. Plug theACcorddirectlyintotheACoutlet. / Donotuse an

isolation transformerforthischeck.

2. Connect a1.5k , 10Wresistor, inparallel witha0.15 F

capacitor, betweeneachexposedmetallicparton theset ana

good earthground suchas awaterpipe, as showninFigure1.

3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to

measurethepotential across theresistor.

4. Check eachexposedmetallicpart, and measurethevoltageat

eachpoint.

5. Reverses theACplug intheACoutlet repeat eachoftheabove

measurements.

6. Thepotential at anypointshouldnotexceed0.15 volts RMS. A

leakagecurrenttester(Simpson Model 229 equivalent) maybe

usedtomake thehotchecks, leakagecurrentmust notexceed0.1

milliamp. Incase ameasurementisoutsideofthelimits specified,

thereisapossibilityofashock hazard, and theequipmentshould

berepairedand checkedbeforeitisreturnedtothecustomer.

ABOUTLEADFREE SOLDER(PbF)

Distinction ofPbfPCB:

PCBs(manufactured)using leadfree solderwill have aPbF stampon thePCB.

Caution:

1. Pbfree solderhas ahighermelting pointthanstandardsolder;

Typicallythemelting pointis50-70°F(30-40°C)higher. Please use

ahigh temperaturesoldering iron. Incase ofthesoldering iron

withtemperaturecontrol, please set itto700±20°F(370±10°C).

2. Pbfree solderwill tend tosplashwhenheatedtoo high (about

1100°F/600°C).

ELECTROSTATICALLYSENSITIVE (ES)DEVICES

Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such

componentscommonlyarecalledElectrostaticallysensitive (ED) Devices. Examples oftypical

ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor “chip”

components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of

componentdamagecausedbystaticelectricity.

1. Immediatelybeforehandling anysemiconductorcomponentor

semiconductor-equippedassembly, drainoff anyelectrostatic

chargeon yourbodybytouching aknownearthground. /

Alternatively, obtainand wearacommerciallyavailable

discharging wrist trapdevice, whichshouldberemovedfor

potential shock reasonspriortoapplying powertotheunitunder

test.

2. Afterremoving anelectrical assemblyequippedwithES devices,

place theassemblyon aconductivesurface suchas aluminum

foil, topreventelectrostaticchargebuildup orexposureofthe

assembly.

3. Use onlyagroundedtipsoldering iron tosolderorunsolderES

devices.

4. Use onlyananti-staticsolderremoval device classifiedas “anti-

static”cangenerate electrical charges sufficienttodamageES

devices.

5. Donotuse freon-propelledchemicals. These cangenerate

electrical charges sufficienttodamageES devices.

6. DonotremoveareplacementES device fromits protective

packageuntil immediatelybeforeyou arereadytoinstall it. / (most

replacementES devices arepackagewithleadselectrically

shortedtogetherbyconductivefoam, aluminumfoil orcomparable

conductivematerial).

7. Immediatelybeforeremoving theprotectivematerial fromthe

leadsofareplacementES device, touchtheprotectivematerial to

thechassisorcircuitassemblyintowhichthedevice will be

installed. / CAUTION:Besureno powerisappliedtothechassis

orcircuit, and observeall othersafetyprecautions.

8. Minimizebodilymotionswhenhandling unpackedreplacementES

devices. (Otherwise harmless motion suchas thebrushing

togetherofyourclothes fabricorthelifting ofyourfootfroma

carpetedfloorcangenerate staticelectricitysufficienttodamage

anES device).

X-RADIATION

WARNING

1. Thepotential source ofX-radiation inEVFsets istheHigh Voltage

section and thepicturetube.

2. Whenusing apicturetubetest jigforservice, ensurethat jigis

capableofhandling 10kVwithoutcausing x-radiation.

Note:

Itisimportanttouse anaccurateperiodicallycalibratedhigh voltagemeter.

3. MeasuretheHigh Voltage. Themeter(electrictype) reading should

indicate 2.5kV, 0.15kV. Ifthemeterindication isoutoftolerance,

immediate service and correction isrequiredtopreventthe

possibilityofprematurecomponentfailure. To preventanx-

radiation possibility, itisessential touse thespecifiedpicturetube.

1. Service Information

2. Mechanical Adjustments

3. Electrical Adjustments

4. Technical Description

5. Block Diagrams/SchematicDiagrams/Circuit Board

Diagrams

NOTE

BE SURE TOMAKE YOUR ORDERS OFREPLACEMENTPARTS ACCORDINGTOPARTS LIST.

CAUTION

THE MARK INDICATES THE PRIMARYCIRCUITTODISTINGUISHTHE PRIMARYFROMTHE

SECONDARYCIRCUIT. / PAYATTENTIONNOTTORECEIVE ANELECTRICSHOCK DURING

REPAIR

SERVICE OFTHE PRODUCTS.

IMPORTANTSAFETYNOTICE:

COMPONENTS IDENTIFIEDWITHTHE MARK HAVE THE SPECIALCHARACTERISTICS FOR

SAFETY. / WHENREPLACINGANYOFTHESE COMPONENTS, USE ONLYTHE SAME TYPE.

5.1. INDEX TO PAGES OFMAINBOARDSAND CIRCUITBOARD

LOCTION

5.1.1. Circuitboard location

5.2. SYSTEMCONTROLBLOCK DIAGRAM

5.3. VIDEO BLOCK DIAGRAM

5.4. AUDIO BLOCK DIAGRAM

5.5. OVERALL WIRING DIAGRAM

5.6. DVUNITOVERALL WIRING DIAGRAM

5.7. MAINSCHEMATICDIAGRAM

5.8. MAINCIRCUITBOARD

5.9. DV/CPUSCHEMATICDIAGRAM

5.10. DV/CPUCIRCUITBOARD

5.11. MDA/DC CIRCUITBOARD

5.12. MDA/DC SCHEMATICDIAGRAM

5.13. FDM(FRONT, DVCONN &MIC)SCHEMATICDIAGRAMS

5.14. FDM(FRONT, DVCONN &MIC)CIRCUITBOARDS

5.15. MECHA&MECHACONN SCHEMATICDIAGRAMS

5.16. MECHA&MECHACONN CIRCUITBOARDS

5.17. ICBLOCK DIAGRAMS

6. Mechanical Replacement PartsList &Exploded

Views

NOTE:

1. Besuretomake your ordersofreplacementpartsaccording tothislist.

2. Unless otherwise specified, all resistorsareinOHMS, K=1,000 OHMS, all capacitorsarein

MICROFARADS

( F), P= F.

3. TheP.C. Board unitmarkedwith" " shownbelowthemainassembledparts.

4. Thepartsmarkedwith on theexplodedviewshowtheelectricparts.

5. IMPORTANTSAFETYNOTICE

Componentsidentifiedwiththemarkhave thespecial characteristics for safety. When

replacing

anyofthese components, use onlythesametype.

6. Themarking (RTL)indicates theretention timeislimitedfor thisitem. / Afterthe

discontinuation

assemblyinproduction, itwill no longerbeavailable.

7. “(M)”inRemarkcolumnindicates neededintheperiodical maintenance.

7. Electrical Replacement PartsList

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