RAYTAC MDBT53V Manuale utente
Version: A
Issued Date: 2021/09/13
Approval Sheet
(產品承認書)
產品名稱
(Product)
Bluetooth Low Energy Module
產品型號
(Model No.)
MDBT53V(Chip Antenna)
MDBT53V –P (PCB Antenna)
Index
1. Overall Introduction ...................................................................................................... 3
1.1. Application............................................................................................................ 3
1.2. Features ............................................................................................................... 4
2. Product Dimension ....................................................................................................... 6
2.1. PCB Dimensions & Pin Indication......................................................................... 6
2.2. Recommended Layout of Solder Pad................................................................... 8
2.3. RF Layout Suggestion (aka Keep-Out Area) ...................................................... 12
2.4. Footprint & Design Guide ................................................................................... 15
2.5. Pin Assignment................................................................................................... 16
3. Main Chip Solution...................................................................................................... 18
4. Specification................................................................................................................ 19
4.1. Absolute Maximum Ratings................................................................................ 19
4.2. Operating Conditions.......................................................................................... 19
4.3. Electrical Specifications...................................................................................... 20
4.4. Application CPU Performance............................................................................ 22
4.5. Network CPU Performance ................................................................................ 23
4.6. Power Management............................................................................................ 23
5. FCC Compliance.......................................................................................................... 31
6. IC Caution .................................................................................................................... 34
7. NCC 警語 ...................................................................................................................... 36
1.Overall Introduction
Raytac’s MDBT53V & MDBT53V-P is a BT 5.2 stack (Bluetooth low energy or BLE) module
designed based on Nordic nRF5340 SoC solution, which incorporates: GPIO, SPI, UART,
TWI, I2S, PDM, PWM, ADC, NFC and USB interfaces for connecting peripherals and sensors.
Features:
1. Embedded 2.4GHz transceiver supports Bluetooth 5.2 ( ), IEEE 802.15.4
(& Zigbee) & 2.4Ghz RF & ANT+ upon customer’s preference.
2. Compact size with (L) 12.4 x (W) 7.8 x (H) 1.85 or 1.6 mm.
3. Low power requirements, ultra-low peak, average and idle mode power consumption.
4. Be compatible with a large installed base of mobile phones, tablets and computers.
5. Fully coverage of BLE software stack.
6. BLE & RF transmission switching helps products fit all operation system and most
hardware.
1.1. Application
‧Advanced computer peripherals and I/o devices
‧Multi-touch trackpad
‧Advanced wearables
‧Health / fitness sensor and monitor devices
‧Wireless payment enabled devices.
‧Wireless audio devices
‧Bluetooth Low EnergyAudio
‧True wireless earbuds
‧Headphones, microphones and speakers
‧Internet of Things (IoT)
‧Smart home sensors and controllers
‧Industrial IoT sensors and controllers
‧Interactive entertainment devices
‧Remote controls
‧Gaming controllers
‧Professional Lighting
‧Wireless connected luminaire
1.2. Features
‧Supply voltage range 1.7V to 5.5V
‧1.8 V to 3.3 V regulated supply for external components
‧Single 32 MHz crystal operation
‧25 general purpose I/O pins
‧Operating temperature from -40 to +105°C
Network Core
‧ARM® Cortex® -M33 with TrustZone® technology
‧64 MHz operation
‧256 kB flash
‧64 kB low leakage RAM
‧Bluetooth® 5.2, IEEE 802.15.4-2006, 2.4 GHz transceiver
‧-98 dBm sensitivity in 1 Mbps Bluetooth Low Energy mode
‧-104 dBm sensitivity in 125 kbps Bluetooth Low Energy mode (long range)
‧-101 dBm sensitivity in IEEE 802.15.4
‧-20 to +3 dBm configurable TX power
‧On-air compatible with nRF52, nRF51, nRF24L, and nRF24AP Series
‧Supported data rates:
‧Bluetooth 5.2 - 2 Mbps, 1 Mbps, 500 kbps, and 125 kbps
‧IEEE 802.15.4-2006 - 250 kbps
‧Proprietary 2.4 GHz - 2 Mbps, 1 Mbps
‧Angle of Arrival (AoA) and Angle of Departure (AoD) direction finding
‧128-bit AES/ECB/CCM/AAR co-processor (on-the-fly packet encryption)
‧SPI master/slave with EasyDMA
‧I2C compatible two-wire master/slave with EasyDMA
‧UART (CTS/RTS) with EasyDMA
‧Up to 3x 32-bit timer with counter mode
‧Up to 2x real-time counter (RTC)
Application Core
‧ARM® Cortex® -M33 with TrustZone® technology
‧128 MHz or 64 MHz operation
‧Single-precision floating-point unit (FPU)
‧Digital signal processing (DSP) instructions
‧1 MB flash and 512 kB low leakage RAM
‧ARM TrustZone CryptoCell™-312 security subsystem
‧USB 2.0 full speed (12Mbps) controller
‧QSPI peripheral for communicating with an external flash memory device
‧Near field communication (NFC-A) tag with wake-on field
‧Up to 5x SPI master/slave with EasyDMA
‧Up to 4x I2C compatible two-wire master/slave with EasyDMA
‧Up to 4x UART (CTS/RTS) with EasyDMA
‧Audio peripherals: I2S, digital microphone interface (PDM)
‧Up to 4x pulse width modulator (PWM) units with EasyDMA
‧12-bit, 200 kspsADC with EasyDMA - eight configurable channels with programmable gain
‧Up to 3x 32-bit timer with counter mode
‧Up to 2x 24-bit real-time counter (RTC)
‧Up to 2x Quadrature decoder (QDEC)
2.Product Dimension
2.1. PCB Dimensions & Pin Indication
‧MDBT53V
PCB Size (in mm)
Min.
Norm
MAX.
L
- 0.15
12.4
+ 0.2
W
7.8
H
1.85
‧MDBT53V-P
PCB Size (in mm)
Min.
Norm
MAX.
L
- 0.15
12.4
+ 0.2
W
7.8
H
1.6
2.2. Recommended Layout of Solder Pad
Graphs are all in Top View, Unit in mm.
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