Samsung SGH-E760 Manuale utente

GSM TELEPHONE

SGH-E760

GSM TELEPHONE CONTENTS

1. Specification

2. Circuit Description

3. Exploded Views and Parts List

4. Electrical Parts List

5. Block Diagrams

6. PCB Diagrams

7. Flow Chart of Troubleshooting

Samsung Electronics Co.,Ltd. September. 2005

Printed in Korea.

Code No.: GH68-08106A

BASIC.

This Service Manual is a property of Samsung Electronics Co.,Ltd.

Any unauthorized use of Manual can be punished under applicable

International and/or domestic law.

ⓒ

SAMSUNG Proprietary-Contents may change without notice

1. Specification

This Document can not be used without Samsung's authorization

1-1

GSM900

Phase 1 EGSM 900

Phase 2 DCS1800

Phase 1 PCS1900

Freq. Band[MHz]

Uplink/Downlink 890~915

935~960 880~915

925~960 1710~1785

1805~1880 1850~1910

1930~1990

ARFCN range 1~124 0~124 &

975~1023 512~885 512~810

Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz

Mod. Bit rate

/BitPeriod 270.833kbps

3.692us 270.833kbps

3.692us

Time Slot Period

/FramePeriod 576.9us

4.615ms 576.9us

4.615ms

Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK

MS Power 33dBm~13dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm

Power Class 5pcl ~ 15pcl 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl

Sensitivity -102dBm -102dBm -100dBm -100dBm

TDMA Mux 8 8 8 8

Cell Radius 35Km 35Km 2Km -

1-1. GSM General Specification

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Specification

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1-2

TX Power

control level GSM900

5 33±3 dBm

6 31±3 dBm

7 29±3 dBm

8 27±3 dBm

9 25±3 dBm

10 23±3 dBm

11 21±3 dBm

12 19±3 dBm

13 17±3 dBm

14 15±3 dBm

15 13±3 dBm

16 11±5 dBm

17 9±5 dBm

18 7±5 dBm

19 5±5 dBm

TX Power

control level DCS1800

0 30±3 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

TX Power

control level PCS1900

0 30±3 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

1-2. GSM TX power class

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2. Circuit Description

2-1

This Document can not be used without Samsung's authorization

2-1. SGH-E760 RF Circuit Description

2-1-1. RX PART

- FEM(MODULE100) →Switching Tx, Rx path for GSM900, DCS1800 and PCS1900 by logic controlling.

- FEM Control Logic (MODULE100) →Truth Table

VC1 VC2 VC3

Tx Mode (GSM900) H L L

Tx Mode (DCS1800/1900) L H L(H)

Rx Mode (GSM900) L L L

Rx Mode (DCS1800) L L L

Rx Mode (PCS1900) L L H

- VC-TCXO-2146C6(26MHz) (OSC100)

This module generates the 26MHz reference clock to drive the logic and RF.

It is turned on when the supply voltage is applied.

After buffering a reference clock of 26MHz is supplied to the other parts of the system through the transceiver pin

VCXOOUT1.

- Transceiver (U100)

This chip is a RF transceiver IC for GSM850/900, DCS1800, and PCS1900 Quad band cellular system, and incorporates

GPRS transceiver capability, and integrates most of the low power silicon functions of a transceiver.

It incorporates triple RF LNAs, direct conversion mixers which are IQ demodulator, an auto offset calibrated

programmable gain amplifier with baseband filter for IQ chains, RF synthesizer, a I/Q modulator, offset PLL, IF

synthesizer, and the circuits which are needed polar loop architecture for the transmitter.

2-1-2. TX PART

Transmitter of the transceiver is capable of GMSK and 8-PSK modulation, providing support for conventional GSM and

GPRS. The modulated signal out of the transceiver is fed into Power Amplifer Module(U101). PAM output signal is

radiated to the air through FEM(MODULE1) and antenna.

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Circuit Description

2-2

This Document can not be used without Samsung's authorization

2-2. Baseband Circuit description of SGH-E760

2-2-1.. PCF5603 (U405)

―Power Management

Eight low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal

system performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0V SIMs,

while a self-resetting, electronically fused switch supplies power to external accessories.

Ancillary support functions, such as RTC module and High Voltage Charge pump, Clock generator, aid in reducing

both board area and system complexity.

I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor

full control of the PCF50603 and enables system designers to maximize both standby and talk times.

Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable

system design. These functions work together to ensure proper system behavior during start-up or in the event of a

fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).

―Backlight Brightness Modulator

The Backlight Brightness Modulator (BBM) contains a programmable Pulse-width modulator (PWM) and FET to

modulate the intensity of a series of LED’s or to control a DC/DC converter that drives LCD backlight.

―Clock Generator

The Clock Generator (CG) generates all clocks for internal and external usage. The 32.768 kHz crystal oscillator

provides an accurate low clock frequency for the PCF50603 and other circuitry.

2-2-2. LCD Connector

LCD is consisted of main MAIN LCD, SUB LCD

Chip select signals in the U305, LCD_CS, can enable LCD. BACKLIGHT signal enables white LED of main LCD. These

signal is from U400.

16-bit data lines(LD(0)~LD(15)) transfers data and commands to LCD. Data and commands use "RS" signal. If this signal

is high, Inputs to LCD are commands. If it is low, Inputs to LCD are data. The signal which informs the input or output

state to LCD, is required. But this system is not necessary this signal. So "L_WR" signal is used to write data or

commands to LCD. Power signals for LCD are "VDD_IO_HIGH".

2-2-3. Key

This is consisted of key interface pins KEY_ROW(0:4) and KEY_COL(0:4) in PCF5213EL1. These signals compose the

matrix. Result of matrix informs the key status to key interface in the PCF5213EL1. Power on/off key is seperated from

the matrix. So power on/off signal is connected with PCF50603 to enable PCF50603. Key LED is consisted of six white

LEDs for sub key and eight white LEDs for main key.

Main and Sub key LED use the 3.3V LDO for a supply voltage. KEY_LED_ON signal enables eight white LED.

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Circuit Description

2-3

This Document can not be used without Samsung's authorization

2-2-4. EMI ESD Filter

This system uses the EMI ESD filter, U500 to protect noise from IF CONNECTOR part.

2-2-5. IF connetor

It is 18-pin connector. They are designed to use VBAT, V_EXT_CHARGE, USB_D+, +VBUS, USB_D-, TXD1, RXD1,

AUX_ON, EXT1, EXT2 and GND. They connected to power supply IC, microprocessor and signal processor IC.

2-2-6. Battery Charge Management

A complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries.

If TA connected to phone, "V_EXT_CHARGE" enable charger IC and supply current to battery.

When fault condition caused, "CHG_ON" signal level change low to high and charger IC stop charging process.

2-2-7. Audio

HFR_P and HFR_N from PCF5213EL1 are connected to the main speaker via analog switches. MIC_P and MIC_N

are connected to the main MIC as well. YMU765 is a synthesizer LSI for mobile phones. This LSI has a built-in speaker

amplifier for outputting sounds that are used by mobile phones in addition to game sounds and ringing melodies that are

replayed by a synthesizer.

There is Stereophonic analog output for Headphone.

2-2-8. Memory

This system uses Samsung's memory, KBJ10KB00A.TheKBJ10KB00A. is a Multi Chip Package

Memory whichcombines 256Mbit Synchronous Burst Multi Bank NOR Flash Memory and 1Gbit NAND

Flash and 128Mbit Synchronous Burst U tRAM.

It has 16 bit data line, HD[1~16] which is connected to PCF5213 and MV3315DOQ, also has 24 bit address lines,

HA[1~24]. There are 3 chip select signals, CS0n_FLASH, CS4n_NAND, and CS1n_RAM.

In the Wrting process, WEn is fallen to low and it enables writing process to operate. During reading process,

OEn is fallen to low and it enables reading process to operate. Each chip select signals in the PCF5213EL1 choose

different memories.

2-2-9. PCF5213EL1

The PCF5213EL1 is mainly composed of embeded DSP and ARM core. The DSP subsystem includes the Saturn

DSP core with embedded RAM and ROM, and a set of peripherals. It has 24kx16 bits PRAM, 104k*16 bits,

32k*16 XYRAM and 63k*16 XYROM in the DSP.

The ARM946E-S consists of an ARM9E-S processor core, 8 kbyte instruction cache and 8 kbyte data cache,

tghtly-coupled ITCM(Instruction Tightly Coupled Memory) and DTCM(Data Tightly Coupled Memory) memories, a

memory protection unit, and an AMBA(Advanced Microcontroller Bus Architecture) AHB(Advanced

High-performance Bus) bus interface with a write buffer.

HD(0:15), data lines and HA(0:23), address lines are connected to KBJ10KB00M (memory), MV319DNQ (image dsp)

and YMU765 (melody IC). It has 64 kbyte SC RAM (0.5 Mbit) and 32 kbyte SC program ROM for bootstrap

loader in the ARM core.

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Circuit Description

2-4

This Document can not be used without Samsung's authorization

HD(0:15), data lines and HA(0:23), address lines are connected to memory and YMU765 to communicate.

MV319DNQ(Camera DSP Chip) controls the communication between ARM core and DSP core.

OEn, WEn control the access of memory. KROW, and KCOL recognize the key string input status.

It has J-TAG control pins (TDI/TDO/TCK) for ARM and DSP core. J-SEL signal controls different access to ARM

and DSP core.

ADC(Analog to Digital Convertor) receives the condition of temperature, battery type and battery voltage.

2-2-10. TOH2600DGI4KRA(26MHz)

This system uses the 26MHz TCXO, VC-TCXO-214C6.AFC control signal form PCF5213EL1 controls requency from

26MHz x-tal. It generates the clock frequency. This clock is connected to PCF5213EL1, YMU765 and

MV3315DOQ.

2-2-11. Camera DSP(MV3315DOQ)

MV3315DOQ provides rich video functions up to 30-frame display with minimized tasks in the handset main processor

as well as hardware based real-time JPEG compression and decompression. MV3315DOQ directly transmits and

previews the RGB data to the LCD graphic memory by processing the sensor output data according to the

handset's command. It can save the raw RGB data up to VGA resoultion into its image buffer and allows the

host processor to download with scalable sized compressed data.

It utilizes 16 bit data bus for communication with the main processor, including bus interface types.

2-2-12. KXP74

KXP74 is Tri-axis Orthogonal accelerometers and inclinometers.

The KXP74 utilizes an onboard Serial Peripheral Interface (SPI) for digital communication.

PCF5213EL1 apply KXP74 for G- button and game

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3. Exploded View and Parts List

3-1

This Document can not be used without Samsung's authorization

3-1. Exploded View

QCA01

QLC01

QMO01 QAR01

QFL01

QHI01

QSC05

QMW02

QFU01

QLC02

QFR01

QKP01

QVK01

QCA02

QMP01

QAN02

QCK02

QRE01

QCR06

QBA01

QRF01

QCR06

QSC07

QME01

QRF03

QVO02

QIF01

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Exploded view and Part List

3-2

This Document can not be used without Samsung's authorization

3-2. Parts List

Location No Description Sec Code

QAN02 ㅤINTENNA-SGHE760;390-OY359,SGH-E760,8 GH42-00638A

QAR01 ㅤAUDIO-RECEIVER;32ohm,110dB±2dB,10X3 3009-001124

QBA01 ㅤBATTERY-800MAH,BLA,ENG,M;BST5208BE,S GH43-02028A

QCA01 ㅤUNIT-CAMERA;SGH-E760,AU-61C,-,RUSS,2 GH59-02218A

QCA02 ㅤUNIT-CAMERA;SGH-E760,-,-,SER,12V,10m GH59-02229A

QCK02 ㅤPMO-SIDE KEY CAMERA;SGH-E760,ABS+URE GH72-22978A

QCR06 ㅤSCREW-MACHINE;PH(PI2.5),+,M1.4,L3.5, 6001-001155

QFR01 ㅤMEC-FRONT COVER;SGH-E760,EU,-,-,-,-, GH75-07395A

QFU01 ㅤMEC-FOLDER UPPER;SGH-E760,EU,-,-,-,- GH75-07396A

QIF01 ㅤPMO-IF COVER V1;SGH-E760,PC+URETHANE GH72-22976A

QKP01 ㅤMEC-KEY PAD;SGH-E760,EU,-,-,-,-,SIL, GH75-07398A

QLC01 ㅤLCD-SGH-E760-MAIN;LTS180QC-F02,SGH-E GH07-00737A

QLC02 ㅤLCD-SGH-SUB-MODULE;PM09EC015A,SGH-E7 GH07-00741A

QME01 ㅤUNIT-METAL DOME;SGH-E760,-,-,EU,12V, GH59-02227A

QMO01 ㅤMOTOR DC-SCHX460;DMJBRK32M,SCH-X460, GH31-00036A

QMP01 ㅤPBA MAIN-SGHE760;SGH-E760,XET,EU,PBA GH92-02239A

QMW02 ㅤPCT-MAIN WINDOW;SGH-E760,ACRYL,TRP,- GH72-22981A

QRE01 ㅤMEC-REAR COVER;SGH-E760,EU,-,-,-,-,B GH75-07399A

QRF01 ㅤMPR-TAPE RF CAP;SGH-E760,PC SHEET,5. GH74-15696A

QRF03 ㅤPMO-EAR COVER V2;SGH-E760,PC,BLK,-,- GH72-23993A

QSC05 ㅤRMO-SCREW CAP L;SGH-E760,URETHANE,3. GH73-04940A

QSC07 ㅤRMO-SCREW CAP R;SGH-E760,URETHANE,3. GH73-04941A

QVK01 ㅤUNIT-VOLUME KEY;SGH-E760,-,-,SER,12V GH59-02228A

QVO02 ㅤPMO-SIDE KEY VOLUME;SGH-E760,ABS+URE GH72-22977A

QFL01 ㅤMEC-FOLDER LOWER;SGH-E760,EU,-,-,-,- GH75-07397A

ㅤQHI01 MEC-HINGE ASSY;SGH-E760,EU,-,-,-,-,S GH75-07551A

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