SanDisk SSD UATA 5000 1.8" Manuale utente
Computerized
Analysis & Simulation Ltd.
Thermal Analysis
SSD UATA 5000 1.8”
with ZIF connector
"Flash Disk Module"
For:
SanDisk
October 2006
(Ref: w06e048b.doc)
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Analysis & Simulation Ltd.
Page 2 of 23 Ref: w06e048d.doc
CAS Ltd. - P.O.B. 7651, Haifa 31076 - ISRAEL
Table of contents
ABSTRACT
1 SCOPE................................................................................................................................4
2 APPLICABLE DOCUMENTS ..........................................................................................4
3 THE FLASH DISK DESCRIPTION .................................................................................4
3.1 THE FLASH DISK DESCRIPTION.............................................................................................................. 4
4 BOUNDARY CONDITION AND ASSUMPTIONS......................................................10
4.1 BOUNDARY CONDITION....................................................................................................................... 10
4.2 MATERIALS ......................................................................................................................................... 10
5 THE THERMAL MODEL............................................................................................... 11
5.1 CFD AND FINITE VOLUME MODEL ..................................................................................................... 11
5.2 THE THERMAL MODEL STRUCTURE .................................................................................................... 12
6 ANALYSIS RESULTS ....................................................................................................17
7 CONCLUSIONS ..............................................................................................................23
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CAS Ltd. - P.O.B. 7651, Haifa 31076 - ISRAEL
Abstract
The document summarizes thermal analysis for the mSSD UATA 5000 1.8” CG with
ZIF connector - "Flash Disk Module"
The main aim is to check whether the current design meets thermal design requirements.
The analysis results are temperatures distribution figures and components case and
junction temperatures.
The analysis results shows that all the components checked, are below the maximum
allowable temperatures based on the thermal demand Twell=70 oC
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1Scope
The document summarized thermal analysis for the "Flash Disc module", based on the
customer design data.
It includes the base design data, description of the thermal model, the solution process
and graphical and numerical representation of the results (temperature distribution and
components case and junction temperatures).
2Applicable Documents
1. J. P. Holman ,Heat Transfer, McGraw Hill, 1989.
2. D. S. Steinberg, Cooling Techniques for Electronic Equipment, Wily Inter
Science, 1980.
3. Kraus A. D. and Bar-Cohen A., Thermal Analysis and Control of
Electronic Equipment, McGraw Hill, 1983.
4. Coolit user manual, DAAT Crop., 2005.
3The Flash Disk Description
3.1 The Flash Disk description
The Flash disk module is built from a plastic structure. At the 2 side mounted 2
PCBs : the Memory PCB and the CPU PCB.
The structure is covered by two stainless steel covers connected by 4 screws.
The "sandwich" structure contains thermal pad between the 2 PCBs and between
the Memory PCB and the cover.
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Table 3.1-1: Power dissipations
Component
Name
Designation
Number Quantity
Power
Total
Power
[W] [W]
1 Flash U5-U12, U105-U112
16 0.04 0.64
2 E3 U3 1 0.162 0.162
3 TI-transceiver U1-U4, U101-U104 8 0.0025 0.02
4 DC-DC U2 1 0.006 0.010
5 Oscillator Y1 1 0.018 0.018
TOTAL 0.850
Notes:
a. Flash, transceiver and E3 are working in 100% duty-cycle in high performance .
Figure 3.1-1: The general mechanical description – top side
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Figure 3.1-2: The general mechanical description – Bottom side
Figure 3.1-3: The Memory card (PS) from bottom side
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Figure 3.1-4: The CPU card ( CS) from bottom side
Figure 3.1-5: The CPU card pad from top side
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Figure 3.1-6: The CPU card (PS) from top side
Figure 3.1-7: The memory card CS and PS placement
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Figure 3.1-8: The CPU card CS and PS placement
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4Boundary Condition and Assumptions
4.1 Boundary condition
Boundary conditions:
•Temperature : Tw=70 oC (measured on the top-cover, at the
center.)
•Altitude : 3048m
4.2 Materials
•body - Plastic: K=0.29 W/m C
•Covers - stainless-steel K=37 W/m C
•Thermal Pad ( T-global H48-2) K=2 W/m C
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