
COMe-cWL6 – User Guide Rev. 1.4
www.kontron.com // 10
2.3.22. External Fan support........................................................................................................................................................................ 33
2.3.23. General Purpose PCI Express 3.0 ................................................................................................................................................. 33
2.3.24. Universal Serial Bus (USB) .............................................................................................................................................................33
2.3.25. SATA 3.0................................................................................................................................................................................................34
2.3.26. Ethernet................................................................................................................................................................................................34
2.3.27. COMe Features ...................................................................................................................................................................................34
2.3.28. Kontron Features............................................................................................................................................................................... 35
3/ Electrical Specification ....................................................................................................................................................................36
3.1. Power Supply Voltage Specifications................................................................................................................................................36
3.1.1. Power Supply Rise Time...................................................................................................................................................................... 36
3.1.2. Power Supply Voltage Ripple............................................................................................................................................................36
3.2. Power Management ...............................................................................................................................................................................36
3.3. Power Supply Control Settings........................................................................................................................................................... 36
3.4. Power Supply Modes ............................................................................................................................................................................. 37
3.4.1. ATX Mode ................................................................................................................................................................................................ 37
3.5. Single Supply Mode................................................................................................................................................................................. 37
4/ Thermal Management ..................................................................................................................................................................... 39
4.1. Heatspreader and Active or Passive Cooling Solutions .............................................................................................................. 39
4.2. Active or Passive Cooling Solutions..................................................................................................................................................39
4.3. Operating with Kontron Heatspreader Plate (HSP) Assembly................................................................................................. 39
4.4. Operating without Kontron Heatspreader Plate (HSP) Assembly.......................................................................................... 39
5/ Environmental Specification..........................................................................................................................................................40
5.1. MTBF..............................................................................................................................................................................................................41
6/ Mechanical Specification ................................................................................................................................................................43
6.1. Dimensions.................................................................................................................................................................................................43
6.2. Height ..........................................................................................................................................................................................................44
6.3. Heatspreader Dimension......................................................................................................................................................................44
7/ Features and Interfaces ..................................................................................................................................................................45
7.1. LPC.................................................................................................................................................................................................................45
7.2. Serial Peripheral Interface (SPI)..........................................................................................................................................................45
7.2.1. SPI Boot ....................................................................................................................................................................................................46
7.3. Fast I2C........................................................................................................................................................................................................46
7.4. UART ............................................................................................................................................................................................................46
7.5. Dual Staged Watchdog Timer (WTD)................................................................................................................................................47
7.5.1. WDT Signal ..............................................................................................................................................................................................47
7.6. Real Time Clock (RTC) ............................................................................................................................................................................ 47
7.7. GPIO ..............................................................................................................................................................................................................48
7.8. Trusted Platform Module (TPM 2.0).................................................................................................................................................48
7.9. Kontron Security Solution.....................................................................................................................................................................48
8/ COMe Interface Connectors (X1A and X1B) ...............................................................................................................................49
8.1. X1A and X1B Signals.................................................................................................................................................................................49
8.2. X1A and X1B Pin Assignment................................................................................................................................................................50
8.2.1. Connector X1A Row A1 – A110 ............................................................................................................................................................51
8.2.2. Connector X1A Row B 1 - B 110.........................................................................................................................................................56
8.2.3. Connector X1B Row C 1 - C 110 .........................................................................................................................................................60
8.2.4. Connector X1B Row D 1 - D 110 ........................................................................................................................................................63
9/ UEFI BIOS Shell ...................................................................................................................................................................................66
9.1. Starting the UEFI BIOS ............................................................................................................................................................................66
9.2. The UEFI Shell........................................................................................................................................................................................... 67